Abstract: A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.

Abstract: A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.

Abstract: An electric machine can include a stator core having a plurality of core teeth that define a plurality of core slots in a surface thereof. A winding can be housed at least partially in the core slots. The winding can include a tube defining a channel through at least a portion thereof and one or more wires disposed along a surface of the tube that is opposite the channel. A cooling system can be operably coupled with the channel and configured to move a cooling fluid through the channel.

Abstract: A multisiphon passive cooling system includes a heat exchanger thermally connected to a heat-generating component located within an enclosure, a distribution manifold located below the heat exchanger, a condensing unit located external to the enclosure and above the heat exchanger, and a first conduit thermally connected to the heat exchanger. The first conduit is fluidly connected to the distribution manifold and the condensing unit. The cooling system also includes a second conduit fluidly connected to the condensing unit and the distribution manifold, a liquid bridge fluidly connected to the first conduit and the second conduit or the distribution manifold, and a two-phase cooling medium that circulates through a loop defined by the first conduit, the liquid bridge, the condensing unit, the second conduit, the heat exchanger, and the distribution manifold. As such, the liquid bridge transfers the cooling medium in a liquid state from the first conduit to the second conduit or the distribution manifold.

Abstract: An ultrasound imaging device or an ultrasound imaging probe includes an imaging device including at least one heat generating component and at least one thermal energy storage insert spaced from and disposed in thermal contact with the imaging device, the at least one thermal energy storage insert containing a phase change material (PCM) therein. The thermal energy storage insert is manufactured to closely confirm to a shape of a space defined within the interior of the probe. A method of forming the ultrasound imaging probe includes the steps of manufacturing a thermal energy storage insert from a thermally conductive material, filling the thermal energy storage insert with a phase change material (PCM) and positioning the thermal energy storage insert within an interior of the probe.

Abstract: A power overlay (POL) module includes a semiconductor device having a body, including a first side and an opposing second side. A first contact pad defined on the semiconductor device first side and a dielectric layer, having a first side and an opposing second side defining a set of first apertures therethrough, is disposed facing the semiconductor device first side. The POL module, includes a metal interconnect layer, having a first side and an opposing second side, the metal interconnect layer second side is disposed on the dielectric layer first side) and extends through the set of first apertures to define a set of vias electrically coupled to the first contact pad. An enclosure defining an interior portion is coupled to the metal interconnect layer first side, and a phase change material (PCM) is disposed in the enclosure interior portion.

Abstract: An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

Abstract: Systems and methods are provided for form-in-place shape-stabilized phase change material for transient cooling. An example combined structure, in accordance with the present disclosure, may include a heat spreading structure and a material structure for holding phase change material. The material structure may be arranged or disposed on a surface of the heat spreading structure. The phase change material may be configured to change phase in response to heat from a component of a system that includes the combined structure, and the material structure has mechanical and structural characteristics for holding the phase change material within the material structure when the phase change material changes phase. The phase change material may be mixed with filler material and/or additives for further assisting in holding the shape of phase change material within the material structure when the phase change material changes phase.

Abstract: A magnetic unit is presented. The magnetic unit includes a magnetic core. The magnetic core includes a first limb and a second limb disposed proximate to the first limb, where a gap is formed between the first limb and the second limb. The magnetic unit further includes a first winding wound on the first limb. Moreover, the magnetic unit includes a conductive element disposed facing an outer periphery of the first winding, where the conductive element is configured to control a fringing flux generated at the gap. Further, the magnetic unit includes a heat sink operatively coupled to the conductive element, where the conductive element is further configured to transfer heat from at least one of the conductive element and the first winding to the heat sink. Moreover, a high frequency power conversion system and a method of operation of the magnetic unit is also presented.

Abstract: An infrared imaging device includes a case, a plurality of electronic components, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the case. The heat transfer structure is disposed within the case. The heat transfer structure is configured to conduct heat away from the plurality of electronic components. The heat transfer structure is further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

Abstract: An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

Abstract: An electric machine can include a stator core having a plurality of core teeth that define a plurality of core slots in a surface thereof. A winding can be housed at least partially in the core slots. The winding can include a tube defining a channel through at least a portion thereof and one or more wires disposed along a surface of the tube that is opposite the channel. A cooling system can be operably coupled with the channel and configured to move a cooling fluid through the channel.

Abstract: An infrared imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

Abstract: A cooling assembly includes a body configured to be placed into thermal contact with a heat source and one or more non-planar, hermetic walls disposed within the body. The one or more non-planar hermetic walls extending around, enclosing, and defining a cooling channel configured to carry cooling fluid through the body such that the cooling fluid contacts internal surfaces of the cooling channel inside the body. The assembly including one or more enhancement structures disposed within the body and coupled with the one or more non-planar hermetic walls. The one or more enhancement structures shaped to change a flow path of the cooling fluid as the cooling fluid moves within the cooling channel and shaped to increase a surface area contacted by the cooling fluid within the cooling channel.

Abstract: A method includes fabricating a core, wherein the core comprises a chemically soluble first polymer, forming a body around the core, wherein the body comprises a second polymer, and etching away the core to reveal a cooling channel extending through the body.

Abstract: A magnetic resonance imaging (MRI) coil system is provided that includes a gradient coil and a flow inlet. The gradient coil includes a flow channel passing therethrough. The gradient coil defines an eye and an end. The eye is disposed proximate the center of the gradient coil. The flow inlet is disposed along the gradient coil between the eye and the end. Cooling fluid is provided to the gradient coil via the flow inlet, and removed from the gradient coil via the eye and the end.

Abstract: A method of manufacturing includes producing a gradient coil assembly having one or more cooling channels for a magnetic resonance imaging system by a process that includes printing a cooling channel template having a first end, a second end, and a hollow passage extending between the first end and the second end, disposing a dielectric material over at least a portion of the cooling channel template to generate a dielectric layer having the cooling channel template, and removing the cooling channel template from the dielectric layer to thereby produce the one or more cooling channels within the dielectric layer such that the one or more cooling channels have a pattern corresponding to a geometry of the cooling channel template.

Abstract: An ultrasound probe is presented. The ultrasound probe includes an ultrasound probe handle. Moreover, the ultrasound probe also includes a phase change chamber monolithic with respect to a portion of the ultrasound probe handle, where the phase change chamber includes hermetic chamber walls extending around and defining an enclosed chamber and a material disposed within the hermetic chamber walls, where the material is configured to change phase in response to heat from a component of the ultrasound probe.

Abstract: A cooling assembly includes a body configured to be placed into thermal contact with a heat source and one or more non-planar, hermetic walls disposed within the body. The one or more non-planar hermetic walls extending around, enclosing, and defining a cooling channel configured to carry cooling fluid through the body such that the cooling fluid contacts internal surfaces of the cooling channel inside the body. The assembly including one or more enhancement structures disposed within the body and coupled with the one or more non-planar hermetic walls. The one or more enhancement structures shaped to change a flow path of the cooling fluid as the cooling fluid moves within the cooling channel and shaped to increase a surface area contacted by the cooling fluid within the cooling channel.