Abstract: An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.

Abstract: A device for monitoring bone density comprises: a first electrode unit comprising a first electrode area to be arranged within a bone; a second electrode unit comprising a second electrode area to be arranged outside the bone, wherein the first and the second electrode units are configured for being arranged such that an electrical signal between the first and the second electrode areas travels through a cortical bone portion of the bone; an injection signal generating unit configured to provide an injection signal for generating the electrical signal; and a measurement unit configured to detect a measurement signal induced by the injection signal for determining an impedance between the first and the second electrode areas as a measure of bone density.

Abstract: A patient monitoring system, including: a bone plate configured to be secured to a bone; a plurality of sensors on the bone plate configured to: measure a parameter; transmit a data signal communicating the measured parameter value; and wherein the transmitted data signals from the plurality of sensors are time division multiplexed; and an external wireless reader including an antenna, a processor, and wireless communication radio, wherein the external wireless reader is configured to: transmit an modulated RF signal; and receive the time division multiplexed transmitted data signals from the plurality of sensors.

Abstract: An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.

Abstract: An electronic system, device and method for monitoring eye activity of a subject is provided for monitoring eye activity of a subject using electrooculogram (EOG) biosignals.

Abstract: A test contactor having a heat slug for removing heat from an electronic device engaging the contactor. The heat slug is positioned in the test contactor so that a thermally conductive surface of the heat slug will intimately contact a heat-radiating bottom surface of the electronic device when the electronic device is in position for testing by the test contactor. A separate heat slug may also be provided for contacting a heat-radiating top surface of the electronic device. Either or both of the heat slugs may be spring loaded or otherwise movably constrained to maximize surface contact with the electronic device by self-positioning when all elements are placed in proper test position. Improved thermal contact may also be achieved by the use of compliant material between the respective contact surfaces of the heat slug and electronic device.

Abstract: A zero insertion force card edge connector for a printed circuit board assembly tester. The test connector includes a plurality of electrical contacts located within a slot of a housing. The contacts are connected to a test motherboard by a flexible circuit board. Also located within the slot is a plate which can be moved between an open position and a closed position by an actuator. When the plate is in the open position a printed circuit board assembly can be inserted into the test connector without having to overcome any spring forces of the connector. The circuit board assembly is inserted into the slot so that the contacts are aligned with surface pads located along an edge of the circuit board. The actuator is then actuated to move the plate into the closed position and push the contacts into the surface pads. The surface pads of the board are electrically connected to the test motherboard through the contacts and flexible circuit board.