Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

Abstract: A first voltage sensor measures a primary voltage between a first terminal of a tested device and electrical ground when a first switch and a second switch are in various on states or off states. In a test state either the first switch or the second switch is in an on state and in reference state both the first switch and the second switch are in on states. An observed leakage resistance is estimated based on the measured primary and secondary voltages of the test state. A reference leakage resistance is based on the measured primary and secondary voltages of the reference state. A test circuit has failed if the observed leakage resistance differs from the reference leakage resistance by more than a threshold amount.

Abstract: In one example embodiment, a circuit includes a first sub-circuit configured to generate first data corresponding to a frequency and a duration of overloading of a transistor in the inverter, and a second sub-circuit configured to generate second data corresponding to a rate of rise of a voltage and a peak voltage value of the transistor in the inverter. The first sub-circuit and the second sub-circuit are configured to respectively provide the first data and second data as outputs to a controller for analyzing a manner in which a load coupled to the inverter is driven.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

Abstract: A temperature estimation module estimates each junction temperature of a corresponding semiconductor device, among a plurality of semiconductor devices, for each phase of an inverter. The temperature estimation module or the data processing system determines a hottest device with a highest junction temperature among the semiconductor devices. A thermal adjustment module or data processing system determines if the highest junction temperature parameter is less than maximum junction temperature parameter for the respective semiconductor device or deciding whether or not to adjust a duty cycle of the semiconductor devices.

Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Abstract: A first voltage sensor measures a primary voltage between a first terminal of a tested device and electrical ground when a first switch and a second switch are in various on states or off states. In a test state either the first switch or the second switch is in an on state and in reference state both the first switch and the second switch are in on states. An observed leakage resistance is estimated based on the measured primary and secondary voltages of the test state. A reference leakage resistance is based on the measured primary and secondary voltages of the reference state. A test circuit has failed if the observed leakage resistance differs from the reference leakage resistance by more than a threshold amount.

Abstract: In one example embodiment, a circuit includes a first sub-circuit configured to generate first data corresponding to a frequency and a duration of overloading of a transistor in the inverter, and a second sub-circuit configured to generate second data corresponding to a rate of rise of a voltage and a peak voltage value of the transistor in the inverter. The first sub-circuit and the second sub-circuit are configured to respectively provide the first data and second data as outputs to a controller for analyzing a manner in which a load coupled to the inverter is driven.

Abstract: A temperature estimation module estimates each junction temperature of a corresponding semiconductor device, among a plurality of semiconductor devices, for each phase of an inverter. The temperature estimation module or the data processing system determines a hottest device with a highest junction temperature among the semiconductor devices. A thermal adjustment module or data processing system determines if the highest junction temperature parameter is less than maximum junction temperature parameter for the respective semiconductor device or deciding whether or not to adjust a duty cycle of the semiconductor devices.

Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Abstract: A sensor comprises an inductor for sensing an alternating current signal component of an observed signal. The inductor comprises a substrate, conductive traces associated with different layers of the substrate, and one or more conductive vias for interconnecting the plurality of conductive traces. A magnetic field sensor senses a direct current signal component of the observed signal. A first filtering circuit has a high-pass filter response. The first filtering circuit is coupled to the inductor to provide a filtered alternating current signal component. A second filtering circuit has a low-pass filter response. The second filtering circuit coupled to the magnetic field sensor to provide a filtered direct current signal component. A sensor fusion circuit determines an aggregate sensed current based on the filtered alternating current signal component and the filtered direct current signal component.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

Abstract: A sensor comprises primary ferrite members spaced apart from the magnetic field sensor on opposite sides of the magnetic field sensor concentrate or steer an orientation of a magnetic field of the observed signal toward a target area of the magnetic field sensor. A magnetic field sensor senses a direct current signal component or lower frequency component of the observed signal. A first filtering circuit has a high-pass filter response. The first filtering circuit is coupled to the inductor to provide a filtered alternating current signal component. A second filtering circuit has a low-pass filter response. The second filtering circuit coupled to the magnetic field sensor to provide a filtered direct current signal component. A sensor fusion circuit determines an aggregate sensed current based on the filtered alternating current signal component and the filtered direct current signal component.

Abstract: An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket.

Abstract: A sensor comprises an inductor for sensing an alternating current signal component of an observed signal. The inductor comprises a substrate, conductive traces associated with different layers of the substrate, and one or more conductive vias for interconnecting the plurality of conductive traces. A magnetic field sensor senses a direct current signal component of the observed signal. A first filtering circuit has a high-pass filter response. The first filtering circuit is coupled to the inductor to provide a filtered alternating current signal component. A second filtering circuit has a low-pass filter response. The second filtering circuit coupled to the magnetic field sensor to provide a filtered direct current signal component. A sensor fusion circuit determines an aggregate sensed current based on the filtered alternating current signal component and the filtered direct current signal component.

Abstract: A sensor comprises primary ferrite members spaced apart from the magnetic field sensor on opposite sides of the magnetic field sensor concentrate or steer an orientation of a magnetic field of the observed signal toward a target area of the magnetic field sensor. A magnetic field sensor senses a direct current signal component or lower frequency component of the observed signal. A first filtering circuit has a high-pass filter response. The first filtering circuit is coupled to the inductor to provide a filtered alternating current signal component. A second filtering circuit has a low-pass filter response. The second filtering circuit coupled to the magnetic field sensor to provide a filtered direct current signal component. A sensor fusion circuit determines an aggregate sensed current based on the filtered alternating current signal component and the filtered direct current signal component.

Abstract: An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket.