Abstract: A resistor network is disclosed which is suited for surface mount which does not incorporate wire terminations. The network is fabricated entirely from cermet, ceramic, and solder, yet will absorb thermal stresses normally associated with circuitry energization when properly mounted upon a substrate. This is accomplished by controlling the formation of solder bumps and simultaneously controlling the mounted distance between those bumps and a wiring substrate upon which the network is mounted. Additionally, the network may be formed to be either a SIP or DIP configuration, depending upon whether an additional groove is incorporated into the termination side of the substrate. Two alternative embodiments are also disclosed which incorporate various features of the invention.

Abstract: A packaged electronic component includes an insulating body completely enclosing the electronic component except for runner-like blade leads which extend outwardly from the insulating body. The runner-like blade leads are more durable than conventional shaped leads and facilitate the making and breaking of sliding electrical contact with stationary contacts. A method of preparing the novel, packaged electronic component is also disclosed.