Patents by Inventor Neal Hall
Neal Hall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240139551Abstract: Systems, methods, and mechanisms for a transducer probe for ultrasonic measurement and direct neuromodulation, e.g., a transducer probe generating ultrasound across a broad range of frequencies to acoustically modulate groups of neurons. A probe may be configured to generate focused ultrasound inside an acoustic medium. The probe may include a plurality of ultrasonic transducer elements along its length. The probe may be configured to generate ultrasound across a broad range of frequencies. The probe may be configured to focus ultrasound down to an approximately 100 micrometers (?m) diameter spot size, e.g., to a focal point or spot of approximately 100 ?m. In addition, the focal spot may be movable in space via phased array focusing.Type: ApplicationFiled: October 27, 2023Publication date: May 2, 2024Inventor: Neal A. Hall
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Patent number: 11073433Abstract: Solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate and at least two electrodes forming an electrode pair. The at least two electrodes may include a first electrode and a second electrode. The first and second electrodes may be offset from each other in a direction substantially parallel to the first surface. The sensing material may be a piezoelectric material and the sensor system may be configured to generate an output signal in response to shear stress experienced by the sensing material.Type: GrantFiled: April 29, 2019Date of Patent: July 27, 2021Assignees: Silicon Audio, Inc., BOARD OF REGENTS OF THE UNIVERSITY OF TEXAS SYSTEMInventors: Neal A. Hall, Donghwan Kim, Randall P. Williams, David P. Gawalt, Bradley D. Avenson, Caesar T. Garcia, Kristofer L. Gleason
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Publication number: 20190257702Abstract: Solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate and at least two electrodes forming an electrode pair. The at least two electrodes may include a first electrode and a second electrode. The first and second electrodes may be offset from each other in a direction substantially parallel to the first surface. The sensing material may be a piezoelectric material and the sensor system may be configured to generate an output signal in response to shear stress experienced by the sensing material.Type: ApplicationFiled: April 29, 2019Publication date: August 22, 2019Inventors: Neal A. Hall, Donghwan Kim, Randall P. Williams, David P. Gawalt, Bradley D. Avenson, Caesar T. Garcia, Kristofer L. Gleason
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Patent number: 10309845Abstract: Embodiments of solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate, and at least three electrodes forming a first and second electrode pair. The at least three electrodes may include a first electrode, a second electrode, and a third electrode. The first electrode may be disposed in a first plane and the second electrode and the third electrode may be disposed in a second plane, the first and second planes associated with a first direction parallel to the first surface. The first and second electrodes may be at least partially offset in the first direction. The first and third electrodes may be at least partially offset in the first direction. The sensor system may be configured to generate an output signal in response to a shear stress within the sensing material.Type: GrantFiled: July 15, 2016Date of Patent: June 4, 2019Assignees: Silicon Audio, Inc., Board of Regents of the University of Texas SystemInventors: Neal A. Hall, Donghwan Kim, Randall P. Williams, David P. Gawalt, Bradley D. Avenson, Caesar T. Garcia, Kristofer L. Gleason
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Patent number: 10018521Abstract: A sensor systems including solid-state shear-stress sensors are presented. A solid-state shear-stress sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate, and at least two electrodes forming an electrode pair. The at least two electrodes may include a first electrode and a second electrode. The first electrode may be disposed in a first plane and the second electrode may be disposed in a second plane. The first and second planes may be associated with a first direction and may be substantially parallel to one another and the first surface. The first and second electrodes may be at least partially offset in the first direction. The sensor system may be configured to generate an output signal in response to a shear stress within the sensing material.Type: GrantFiled: July 15, 2016Date of Patent: July 10, 2018Assignee: Silicon Audio, Inc.Inventor: Neal A. Hall
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Patent number: 9832573Abstract: In some embodiments, a microphone system may include a deformable element that may be made of a material that is subject to deformation in response to external phenomenon. Sensing ports may be in contact with a respective region of the deformable element and may be configured to sense a deformation of a region of the deformable element and generate a signal in response thereto. The plurality of signals may be useable to determine spatial dependencies of the external phenomenon. The external phenomenon may be pressure and the signals may be useable to determine spatial dependencies of the pressure.Type: GrantFiled: June 14, 2016Date of Patent: November 28, 2017Assignee: Silicon Audio Directional, LLCInventors: Neal A. Hall, Caesar T. Garcia, Bradley D. Avenson, Abidin Guclu Onaran
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Publication number: 20170016785Abstract: Various embodiments of solid-state shear-stress sensors are presented. Some embodiments of a sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate, and at least two electrodes forming an electrode pair. The at least two electrodes may include a first electrode and a second electrode. The first electrode may be disposed in a first plane and the second electrode may be disposed in a second plane. The first and second planes may be associated with a first direction and may be substantially parallel to one another and the first surface. The first and second electrodes may be at least partially offset in the first direction. The sensor system may be configured to generate an output signal in response to a shear stress within the sensing material.Type: ApplicationFiled: July 15, 2016Publication date: January 19, 2017Inventor: Neal A. Hall
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Publication number: 20170016783Abstract: Embodiments of solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate, and at least three electrodes forming a first and second electrode pair. The at least three electrodes may include a first electrode, a second electrode, and a third electrode. The first electrode may be disposed in a first plane and the second electrode and the third electrode may be disposed in a second plane, the first and second planes associated with a first direction parallel to the first surface. The first and second electrodes may be at least partially offset in the first direction. The first and third electrodes may be at least partially offset in the first direction. The sensor system may be configured to generate an output signal in response to a shear stress within the sensing material.Type: ApplicationFiled: July 15, 2016Publication date: January 19, 2017Inventors: Neal A. Hall, Donghwan Kim, Randall P. Williams, David P. Gawalt, Bradley D. Avenson, Caesar T. Garcia, Kristofer L. Gleason
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Patent number: 9503820Abstract: In some embodiments, a sensor system may include a deformable structure and a sensing element. The deformable structure may include at least one layer of piezoelectric material and at least one actuator port disposed on the at least one layer of piezoelectric material. The deformable structure may deform in response to external phenomenon. The at least one actuator port may be configured to actuate the at least one layer of piezoelectric material via application of an electrical signal to the at least one layer of piezoelectric material. The at least one layer of piezoelectric material may be configured to apply a force to the deformable structure when actuated. The sensing element may be configured to sense deformation of the deformable structure capacitively, optically, or via a sensing port according to embodiments.Type: GrantFiled: January 23, 2015Date of Patent: November 22, 2016Assignee: Silicon Audio Directional, LLCInventors: Neal A. Hall, Donghwan Kim
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Publication number: 20160337761Abstract: A surface micromachined microphone with a 230 kHz bandwidth. The structure uses a 2.25 ?m thick, 305 ?m radius polysilicon diaphragm suspended above an 11 ?m gap to form a variable parallel-plate capacitance. The backcavity of the microphone consists of the 11 ?m thick air volume immediately behind the moving diaphragm, and also an extended larger cavity with a radius of 504 ?m. The dynamic frequency response of the sensor in response to electrostatic signals is presented using laser Doppler vibrometry, and indicates a system compliance of 0.4 nm/Pa in the flat-band of the response. The sensor is configured for acoustic signal detection using a charge amplifier configuration, and signal to noise ratio measurements and simulations are presented herein. A resolution of 0.80 mPa/?Hz (32 dB SPL in a 1 Hz bin) is achieved in the flat-band portion of the response extending from 10 kHz to 230 kHz.Type: ApplicationFiled: January 12, 2015Publication date: November 17, 2016Inventors: Neal A. Hall, Michael L. Kuntzman, Karen Kirk Sauceda
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Patent number: 9479875Abstract: In some embodiments, a sensor system may include a deformable structure and a sensing element. The deformable structure may include at least one layer of piezoelectric material and at least one actuator port disposed on the at least one layer of piezoelectric material. The deformable structure may deform in response to external phenomenon. The at least one actuator port may be configured to actuate the at least one layer of piezoelectric material via application of an electrical signal to the at least one layer of piezoelectric material. The at least one layer of piezoelectric material may be configured to apply a force to the deformable structure when actuated. The sensing element may be configured to sense deformation of the deformable structure capacitively, optically, or via a sensing port according to embodiments.Type: GrantFiled: January 23, 2015Date of Patent: October 25, 2016Assignee: SILICON AUDIO DIRECTIONAL, LLCInventors: Neal A. Hall, Donghwan Kim
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Publication number: 20160295333Abstract: In some embodiments, a microphone system may include a deformable element that may be made of a material that is subject to deformation in response to external phenomenon. Sensing ports may be in contact with a respective region of the deformable element and may be configured to sense a deformation of a region of the deformable element and generate a signal in response thereto. The plurality of signals may be useable to determine spatial dependencies of the external phenomenon. The external phenomenon may be pressure and the signals may be useable to determine spatial dependencies of the pressure.Type: ApplicationFiled: June 14, 2016Publication date: October 6, 2016Inventors: Neal A. Hall, Caesar T. Garcia, Bradley D. Avenson, Abidin Guclu Onaran
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Publication number: 20160219374Abstract: In some embodiments, a sensor system may include a deformable structure and a sensing element. The deformable structure may include at least one layer of piezoelectric material and at least one actuator port disposed on the at least one layer of piezoelectric material. The deformable structure may deform in response to external phenomenon. The at least one actuator port may be configured to actuate the at least one layer of piezoelectric material via application of an electrical signal to the at least one layer of piezoelectric material. The at least one layer of piezoelectric material may be configured to apply a force to the deformable structure when actuated. The sensing element may be configured to sense deformation of the deformable structure capacitively, optically, or via a sensing port according to embodiments.Type: ApplicationFiled: January 23, 2015Publication date: July 28, 2016Inventors: Neal A. Hall, Donghwan Kim
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Publication number: 20160219378Abstract: In some embodiments, a sensor system may include a deformable structure and a sensing element. The deformable structure may include at least one layer of piezoelectric material and at least one actuator port disposed on the at least one layer of piezoelectric material. The deformable structure may deform in response to external phenomenon. The at least one actuator port may be configured to actuate the at least one layer of piezoelectric material via application of an electrical signal to the at least one layer of piezoelectric material. The at least one layer of piezoelectric material may be configured to apply a force to the deformable structure when actuated. The sensing element may be configured to sense deformation of the deformable structure capacitively, optically, or via a sensing port according to embodiments.Type: ApplicationFiled: January 23, 2015Publication date: July 28, 2016Inventors: Neal A. Hall, Donghwan Kim
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Publication number: 20160219375Abstract: In some embodiments, a sensor system may include a deformable structure and a sensing element. The deformable structure may include at least one layer of piezoelectric material and at least one actuator port disposed on the at least one layer of piezoelectric material. The deformable structure may deform in response to external phenomenon. The at least one actuator port may be configured to actuate the at least one layer of piezoelectric material via application of an electrical signal to the at least one layer of piezoelectric material. The at least one layer of piezoelectric material may be configured to apply a force to the deformable structure when actuated. The sensing element may be configured to sense deformation of the deformable structure capacitively, optically, or via a sensing port according to embodiments.Type: ApplicationFiled: January 23, 2015Publication date: July 28, 2016Inventors: Neal A. Hall, Donghwan Kim
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Patent number: 9372111Abstract: A method of designing and manufacturing an acoustic sensor having a high degree of directivity is disclosed. The sensor includes a rotatable plate that is attached to a substrate with mounts. In one aspect the mounts are freely rotatable and the torque on the plate is measured using detectors disposed on springs that provide a resistance to rotation of the plate. In another aspect the plate is mounted to the substrate with mounts that torsionally deform during rotation of the plate. These detectors measure the torque on the plate according to the torsional deformation of the mounts. Methods of improving the signal to noise ratio of acoustic sensors having multiple detectors are also disclosed.Type: GrantFiled: August 12, 2013Date of Patent: June 21, 2016Assignee: Board of Regents, The University of Texas SystemInventors: Neal A. Hall, Michael L. Kuntzman, Donghwan Kim, Nishshanka Hewa-Kasakarage
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Patent number: 8989411Abstract: A vacuum sealed directional microphone and methods for fabricating said vacuum sealed directional microphone. A vacuum sealed directional microphone includes a rocking structure coupled to two vacuum sealed diaphragms which are responsible for collecting incoming sound and deforming under sound pressure. The rocking structure's resistance to bending aids in reducing the deflection of each diaphragm under large atmospheric pressure. Furthermore, the rocking structure exhibits little resistance about its pivot thereby enabling it to freely rotate in response to small pressure gradients characteristic of sound. The backside cavities of such a device can be fabricated without the use of the deep reactive ion etch step thereby allowing such a microphone to be fabricated with a CMOS compatible process.Type: GrantFiled: April 6, 2012Date of Patent: March 24, 2015Assignee: Board of Regents, The University of Texas SystemInventors: Neal A. Hall, Michael Louis Kuntzman, Karen Denise Kirk
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Publication number: 20140247954Abstract: In some embodiments, a microphone system may include a deformable element that may be made of a material that is subject to deformation in response to external phenomenon. Sensing ports may be in contact with a respective region of the deformable element and may be configured to sense a deformation of a region of the deformable element and generate a signal in response thereto. The plurality of signals may be useable to determine spatial dependencies of the external phenomenon. The external phenomenon may be pressure and the signals may be useable to determine spatial dependencies of the pressure.Type: ApplicationFiled: February 28, 2014Publication date: September 4, 2014Applicant: Silicon Audio, Inc.Inventors: Neal A. Hall, Caesar T. Garcia, Bradley D. Avenson, Abidin Guclu Onaran
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Publication number: 20140053650Abstract: A method of designing and manufacturing an acoustic sensor having a high degree of directivity is disclosed. The sensor includes a rotatable plate that is attached to a substrate with mounts. In one aspect the mounts are freely rotatable and the torque on the plate is measured using detectors disposed on springs that provide a resistance to rotation of the plate. In another aspect the plate is mounted to the substrate with mounts that torsionally deform during rotation of the plate. These detectors measure the torque on the plate according to the torsional deformation of the mounts. Methods of improving the signal to noise ratio of acoustic sensors having multiple detectors are also disclosed.Type: ApplicationFiled: August 12, 2013Publication date: February 27, 2014Applicant: Board of Regents, The University of Texas SystemInventors: Neal A. HALL, Michael L. KUNTZMAN, Donghwan KIM, Nishshanka HEWA-KASAKARAGE
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Publication number: 20120257778Abstract: A vacuum sealed directional microphone and methods for fabricating said vacuum sealed directional microphone. A vacuum sealed directional microphone includes a rocking structure coupled to two vacuum sealed diaphragms which are responsible for collecting incoming sound and deforming under sound pressure. The rocking structure's resistance to bending aids in reducing the deflection of each diaphragm under large atmospheric pressure. Furthermore, the rocking structure exhibits little resistance about its pivot thereby enabling it to freely rotate in response to small pressure gradients characteristic of sound. The backside cavities of such a device can be fabricated without the use of the deep reactive ion etch step thereby allowing such a microphone to be fabricated with a CMOS compatible process.Type: ApplicationFiled: April 6, 2012Publication date: October 11, 2012Applicant: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEMInventors: Neal A. Hall, Michael Louis Kuntzman, Karen Denise Kirk