Patents by Inventor Neal W. Meyer
Neal W. Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7833830Abstract: This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.Type: GrantFiled: July 16, 2007Date of Patent: November 16, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Zhizhang Chen, Neal W. Meyer
-
Patent number: 7790331Abstract: A fuel cell has a substrate with a film deposited thereon. The film has nanowires dispersed therein. Catalytic activity and conductivity is substantially enhanced throughout the film.Type: GrantFiled: October 31, 2003Date of Patent: September 7, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: David Champion, Neal W. Meyer, Peter Mardilovich, Gregory S Herman
-
Patent number: 7294899Abstract: A method of manufacturing a nanowire filament includes forming and fusing actions. In a forming action, close proximity conductors are formed. In another forming action, a junction oxide is formed between the close proximity conductors. In a fusing action, a nanowire filament is fused between the close proximity conductors, through the junction oxide. A circuit is also provided, having first and second close proximity conductors, and a nanowire filament fused between the close proximity conductors.Type: GrantFiled: June 1, 2005Date of Patent: November 13, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Neal W. Meyer, James E. Ellenson
-
Patent number: 7262495Abstract: This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.Type: GrantFiled: October 7, 2004Date of Patent: August 28, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Zhizhang Chen, Neal W. Meyer
-
Patent number: 7082378Abstract: Determining a displacement of a substantially rigid item relative to a frame of reference between a first time and a second time is described. At the first time, a first set of pointwise measurements of a physical property of the item taken at a plurality of fixed locations relative to the frame of reference is acquired. At the second time, a second set of pointwise measurements of the physical property taken at the plurality of fixed locations is acquired. A first matrix derived from the first set of pointwise measurements is compared to a second matrix derived from the second set of pointwise measurements to determine the displacement.Type: GrantFiled: November 18, 2004Date of Patent: July 25, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Carl E. Picciotto, Jun Gao, Neal W. Meyer
-
Patent number: 6967149Abstract: Apparatus and method for making a multi-layered storage structure includes forming a device layer on a single-crystal wafer, cleaving the device layer from the wafer, repeating the forming and cleaving to provide a plurality of cleaved device layers, and bonding the cleaved device layers together to form the multi-layered storage structure.Type: GrantFiled: November 20, 2003Date of Patent: November 22, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Neal W. Meyer, Andrew L. Van Brocklin, Peter Fricke, Warren Jackson, Kenneth James Eldredge
-
Patent number: 6936496Abstract: A method of manufacturing a nanowire filament includes forming and fusing actions. In a forming action, close proximity conductors are formed. In another forming action, a junction oxide is formed between the close proximity conductors. In a fusing action, a nanowire filament is fused between the close proximity conductors, through the junction oxide. A circuit is also provided, having first and second close proximity conductors, and a nanowire filament fused between the close proximity conductors.Type: GrantFiled: December 20, 2002Date of Patent: August 30, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Neal W. Meyer, James E. Ellenson
-
Publication number: 20040265483Abstract: Various embodiments of the invention are directed towards fuel cell components (e.g., anodes, cathodes, or electrolytes) which are made by the application of a colloidal solution to a substrate, drying of the solution allowing particles to remain on the substrate, and sintering of the particles.Type: ApplicationFiled: June 24, 2003Publication date: December 30, 2004Inventors: Neal W. Meyer, Peter Mardilovich, Gregory S. Herman
-
Patent number: 6821848Abstract: Tunnel-junction structures are fabricated by any of a set of related methods that form two or more tunnel junctions simultaneously. The fabrication methods disclosed are compatible with conventional CMOS fabrication practices, including both single damascene and dual damascene processes. The simultaneously formed tunnel junctions may have different areas. In some embodiments, tub-well structures are formed with sloped sidewalls. In some embodiments, an oxide-metal-oxide film stack on the sidewall of a tub-well is etched to form the tunnel junctions. Memory circuits, other integrated circuit structures, substrates carrying microelectronics, and other electronic devices made by the methods are disclosed.Type: GrantFiled: October 30, 2002Date of Patent: November 23, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dennis Lazaroff, Kenneth M. Kramer, James E. Ellenson, Neal W. Meyer, David Punsalan, Kurt Ulmer, Peter Fricke, Andrew Koll, Andrew L. Van Brocklin
-
Publication number: 20040187813Abstract: A stroke internal combustion engine includes a piston slideably disposed within a cylinder. The cylinder and said piston together define a combustion chamber. The piston is configured to have a two-stroke cycle comprising a downstroke when said piston slides from an upper position to a lower position within said cylinder and an upstroke when said piston slides from said lower position to said upper position within said cylinder. Further, the engine includes a supply of lubricating fluid that is isolated from any fuel.Type: ApplicationFiled: March 27, 2003Publication date: September 30, 2004Inventor: Neal W. Meyer
-
Publication number: 20040121509Abstract: A method of manufacturing a nanowire filament includes forming and fusing actions. In a forming action, close proximity conductors are formed. In another forming action, a junction oxide is formed between the close proximity conductors. In a fusing action, a nanowire filament is fused between the close proximity conductors, through the junction oxide. A circuit is also provided, having first and second close proximity conductors, and a nanowire filament fused between the close proximity conductors.Type: ApplicationFiled: December 20, 2002Publication date: June 24, 2004Inventors: Neal W. Meyer, James E. Ellenson
-
Publication number: 20030186468Abstract: Tunnel-junction structures are fabricated by any of a set of related methods that form two or more tunnel junctions simultaneously. The fabrication methods disclosed are compatible with conventional CMOS fabrication practices, including both single damascene and dual damascene processes. The simultaneously formed tunnel junctions may have different areas. In some embodiments, tub-well structures are formed with sloped sidewalls. In some embodiments, an oxide-metal-oxide film stack on the sidewall of a tub-well is etched to form the tunnel junctions. Memory circuits, other integrated circuit structures, substrates carrying microelectronics, and other electronic devices made by the methods are disclosed.Type: ApplicationFiled: October 31, 2002Publication date: October 2, 2003Inventors: Dennis Lazaroff, Kenneth M. Kramer, James E. Ellenson, Neal W. Meyer, David Punsalan, Kurt Ulmer, Peter Fricke, Andrew Koll, Andrew L. Van Brocklin
-
Patent number: 6471340Abstract: The present invention provides an improved inkjet printhead assembly adapted to reduce and/or withstand the collapse of ink back into the firing chambers. In one embodiment, the printhead assembly includes one or more firing chambers disposed on a porous substrate. An ink supply is connected to the substrate so that ink is allowed to flow through the pores of the substrate from the ink supply to the firing chamber. Thus, a substantial amount of the energy created by the impact of ink collapsing back into the firing chamber is expended within the pores of the substrate. In another embodiment, one or more firing resistors are formed in each firing chamber, and disposed adjacent the periphery of the firing chamber out of the direct impact path of collapsing ink.Type: GrantFiled: February 12, 2001Date of Patent: October 29, 2002Assignee: Hewlett-Packard CompanyInventor: Neal W. Meyer
-
Publication number: 20020109755Abstract: The present invention provides an improved inkjet printhead assembly adapted to reduce and/or withstand the collapse of ink back into the firing chambers. In one embodiment, the printhead assembly includes one or more firing chambers disposed on a porous substrate. An ink supply is connected to the substrate so that ink is allowed to flow through the pores of the substrate from the ink supply to the firing chamber. Thus, a substantial amount of the energy created by the impact of ink collapsing back into the firing chamber is expended within the pores of the substrate. In another embodiment, one or more firing resistors are formed in each firing chamber, and disposed adjacent the periphery of the firing chamber out of the direct impact path of collapsing ink.Type: ApplicationFiled: February 12, 2001Publication date: August 15, 2002Inventor: Neal W. Meyer
-
Patent number: 6315393Abstract: The invention contemplates a flexible film, and a printhead (TAB head assembly) comprising the same; the flexible film having a converted surface with improved resistance. The converted surface comprises a carbon rich layer, preferably, Diamond Like Carbon (DLC) created through simultaneous surface treatment by multiplexed lasers.Type: GrantFiled: April 30, 1999Date of Patent: November 13, 2001Assignee: Hewlett-Packard CompanyInventors: Harold Lee Van Nice, Salim Khasawinah, Neal W. Meyer
-
Patent number: 6290331Abstract: A novel polymeric orifice plate for a printhead. The plate includes a recess in the top surface thereof which terminates at a position between the top and bottom plate surfaces. The recess communicates with a bore which passes through the remainder of the plate and terminates at the bottom surface. The recess has an upper end with a first opening therein, a lower end with a second opening therein, a side wall, and a bottom wall at the lower end The first opening is larger than the second opening. Application of physical force to the plate does not disturb the second opening in the recess which is “inset”. The recessed bottom wall (and possibly the top surface) of the plate may include at least one layer of coating material thereon for protective, wettability-control, and other purposes. These designs insure proper ink drop trajectory and high-quality image generation.Type: GrantFiled: July 18, 2000Date of Patent: September 18, 2001Assignee: Hewlett-Packard CompanyInventors: Arun K. Agarwal, Jennifer Korngiebel, Kit Christopher Baughman, Matthew D. Giere, Ronald A. Askeland, Noah C. Lassar, Satya Prakash, Neal W. Meyer, Harold Lee Van Nice, Salim Khasawinah
-
Patent number: 6155675Abstract: A high-durability printhead for an ink cartridge printing system. The printhead includes a substrate having ink ejectors (e.g. resistors) thereon and an orifice plate positioned above the substrate. The orifice plate (which preferably involves a non-metallic polymer film) has a top surface, bottom surface and a plurality of openings therethrough. To improve the durability of the orifice plate, a protective coating is applied to the top surface and/or the bottom surface of the plate. Representative coatings involve dielectric compositions (including diamond-like carbon) or at least one layer of metal. This approach improves the abrasion and deformation resistance of the plate and avoids "ruffling" and "dimpling" problems.Type: GrantFiled: August 28, 1997Date of Patent: December 5, 2000Assignee: Hewlett-Packard CompanyInventors: Lee Van Nice, Gerald E. Heppell, Neal W. Meyer, Donald L. Michael, Kit Baughman, Thach G. Troung, Rui Yang, Moses M. David, James R. White
-
Patent number: 6130688Abstract: A novel polymeric orifice plate for a printhead. The plate includes a recess in the top surface thereof which terminates at a position between the top and bottom plate surfaces. The recess communicates with a bore which passes through the remainder of the plate and terminates at the bottom surface thereof. The recess has an upper end with a first opening therein, a lower end with a second opening therein, and a side wall which is preferably oriented at a right angle relative to the top surface of the plate. The recess may also have a bottom wall at the lower end. The first opening is larger than the second opening. The application of physical force to the plate does not disturb the second opening in the recess which is "inset" and protected. This design insures proper ink drop trajectory and the generation of high-quality printed images.Type: GrantFiled: September 9, 1999Date of Patent: October 10, 2000Assignee: Hewlett-Packard CompanyInventors: Arun K Agarwal, Kit C Baughman, Jennifer M. Korngiebel, Neal W. Meyer, Harold Lee Van Nice, Salim Khasawinah
-
Patent number: 6062679Abstract: A high-durability printhead for an ink cartridge printing system includes a substrate having ink ejectors (e.g. resistors) thereon and an orifice plate positioned above the substrate. The orifice plate (which preferably involves a non-metallic polymer film) has a top surface, bottom surface and a plurality of openings therethrough. To improve the durability of the orifice plate, a protective coating is applied to the top surface and/or the bottom surface of the plate. Representative coatings involve dielectric compositions (including diamond-like carbon) or at least one layer of metal. This approach improves the abrasion and deformation resistance of the plate and avoids "dimpling" problems. Likewise, an intermediate barrier layer of diamond-like carbon is used between the orifice plate and the substrate. As result, an additional level of structural integrity is imparted to the orifice plate and printhead.Type: GrantFiled: August 28, 1997Date of Patent: May 16, 2000Assignee: Hewlett-Packard CompanyInventors: Neal W. Meyer, Donald L. Michael, Lee Van Nice, Gerald E. Heppell, Kit Baughman
-
Patent number: 5682188Abstract: A thermal inkjet printhead includes unpassivated heater resistors whose resistive material is doped, preferably with oxygen, nitrogen or an equivalent dopant, for increasing the resistance of the material. By increasing the resistance of the resistive material through doping, the drive currents for generating heat within the resistors need not be changed from levels which inkjet printers are presently designed to work with. The printhead of the invention can thus be used in place of a standard printhead without modification to the printer.Type: GrantFiled: March 16, 1995Date of Patent: October 28, 1997Assignee: Hewlett-Packard CompanyInventors: Neal W. Meyer, Eric G. Hanson, Alfred Pan, Glenn W. Weberg