Patents by Inventor Neal W. Meyer

Neal W. Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7833830
    Abstract: This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: November 16, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Zhizhang Chen, Neal W. Meyer
  • Patent number: 7790331
    Abstract: A fuel cell has a substrate with a film deposited thereon. The film has nanowires dispersed therein. Catalytic activity and conductivity is substantially enhanced throughout the film.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: September 7, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Champion, Neal W. Meyer, Peter Mardilovich, Gregory S Herman
  • Patent number: 7294899
    Abstract: A method of manufacturing a nanowire filament includes forming and fusing actions. In a forming action, close proximity conductors are formed. In another forming action, a junction oxide is formed between the close proximity conductors. In a fusing action, a nanowire filament is fused between the close proximity conductors, through the junction oxide. A circuit is also provided, having first and second close proximity conductors, and a nanowire filament fused between the close proximity conductors.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: November 13, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Neal W. Meyer, James E. Ellenson
  • Patent number: 7262495
    Abstract: This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: August 28, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Zhizhang Chen, Neal W. Meyer
  • Patent number: 7082378
    Abstract: Determining a displacement of a substantially rigid item relative to a frame of reference between a first time and a second time is described. At the first time, a first set of pointwise measurements of a physical property of the item taken at a plurality of fixed locations relative to the frame of reference is acquired. At the second time, a second set of pointwise measurements of the physical property taken at the plurality of fixed locations is acquired. A first matrix derived from the first set of pointwise measurements is compared to a second matrix derived from the second set of pointwise measurements to determine the displacement.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: July 25, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Carl E. Picciotto, Jun Gao, Neal W. Meyer
  • Patent number: 6967149
    Abstract: Apparatus and method for making a multi-layered storage structure includes forming a device layer on a single-crystal wafer, cleaving the device layer from the wafer, repeating the forming and cleaving to provide a plurality of cleaved device layers, and bonding the cleaved device layers together to form the multi-layered storage structure.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: November 22, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Neal W. Meyer, Andrew L. Van Brocklin, Peter Fricke, Warren Jackson, Kenneth James Eldredge
  • Patent number: 6936496
    Abstract: A method of manufacturing a nanowire filament includes forming and fusing actions. In a forming action, close proximity conductors are formed. In another forming action, a junction oxide is formed between the close proximity conductors. In a fusing action, a nanowire filament is fused between the close proximity conductors, through the junction oxide. A circuit is also provided, having first and second close proximity conductors, and a nanowire filament fused between the close proximity conductors.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: August 30, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Neal W. Meyer, James E. Ellenson
  • Publication number: 20040265483
    Abstract: Various embodiments of the invention are directed towards fuel cell components (e.g., anodes, cathodes, or electrolytes) which are made by the application of a colloidal solution to a substrate, drying of the solution allowing particles to remain on the substrate, and sintering of the particles.
    Type: Application
    Filed: June 24, 2003
    Publication date: December 30, 2004
    Inventors: Neal W. Meyer, Peter Mardilovich, Gregory S. Herman
  • Patent number: 6821848
    Abstract: Tunnel-junction structures are fabricated by any of a set of related methods that form two or more tunnel junctions simultaneously. The fabrication methods disclosed are compatible with conventional CMOS fabrication practices, including both single damascene and dual damascene processes. The simultaneously formed tunnel junctions may have different areas. In some embodiments, tub-well structures are formed with sloped sidewalls. In some embodiments, an oxide-metal-oxide film stack on the sidewall of a tub-well is etched to form the tunnel junctions. Memory circuits, other integrated circuit structures, substrates carrying microelectronics, and other electronic devices made by the methods are disclosed.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: November 23, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Dennis Lazaroff, Kenneth M. Kramer, James E. Ellenson, Neal W. Meyer, David Punsalan, Kurt Ulmer, Peter Fricke, Andrew Koll, Andrew L. Van Brocklin
  • Publication number: 20040187813
    Abstract: A stroke internal combustion engine includes a piston slideably disposed within a cylinder. The cylinder and said piston together define a combustion chamber. The piston is configured to have a two-stroke cycle comprising a downstroke when said piston slides from an upper position to a lower position within said cylinder and an upstroke when said piston slides from said lower position to said upper position within said cylinder. Further, the engine includes a supply of lubricating fluid that is isolated from any fuel.
    Type: Application
    Filed: March 27, 2003
    Publication date: September 30, 2004
    Inventor: Neal W. Meyer
  • Publication number: 20040121509
    Abstract: A method of manufacturing a nanowire filament includes forming and fusing actions. In a forming action, close proximity conductors are formed. In another forming action, a junction oxide is formed between the close proximity conductors. In a fusing action, a nanowire filament is fused between the close proximity conductors, through the junction oxide. A circuit is also provided, having first and second close proximity conductors, and a nanowire filament fused between the close proximity conductors.
    Type: Application
    Filed: December 20, 2002
    Publication date: June 24, 2004
    Inventors: Neal W. Meyer, James E. Ellenson
  • Publication number: 20030186468
    Abstract: Tunnel-junction structures are fabricated by any of a set of related methods that form two or more tunnel junctions simultaneously. The fabrication methods disclosed are compatible with conventional CMOS fabrication practices, including both single damascene and dual damascene processes. The simultaneously formed tunnel junctions may have different areas. In some embodiments, tub-well structures are formed with sloped sidewalls. In some embodiments, an oxide-metal-oxide film stack on the sidewall of a tub-well is etched to form the tunnel junctions. Memory circuits, other integrated circuit structures, substrates carrying microelectronics, and other electronic devices made by the methods are disclosed.
    Type: Application
    Filed: October 31, 2002
    Publication date: October 2, 2003
    Inventors: Dennis Lazaroff, Kenneth M. Kramer, James E. Ellenson, Neal W. Meyer, David Punsalan, Kurt Ulmer, Peter Fricke, Andrew Koll, Andrew L. Van Brocklin
  • Patent number: 6471340
    Abstract: The present invention provides an improved inkjet printhead assembly adapted to reduce and/or withstand the collapse of ink back into the firing chambers. In one embodiment, the printhead assembly includes one or more firing chambers disposed on a porous substrate. An ink supply is connected to the substrate so that ink is allowed to flow through the pores of the substrate from the ink supply to the firing chamber. Thus, a substantial amount of the energy created by the impact of ink collapsing back into the firing chamber is expended within the pores of the substrate. In another embodiment, one or more firing resistors are formed in each firing chamber, and disposed adjacent the periphery of the firing chamber out of the direct impact path of collapsing ink.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: October 29, 2002
    Assignee: Hewlett-Packard Company
    Inventor: Neal W. Meyer
  • Publication number: 20020109755
    Abstract: The present invention provides an improved inkjet printhead assembly adapted to reduce and/or withstand the collapse of ink back into the firing chambers. In one embodiment, the printhead assembly includes one or more firing chambers disposed on a porous substrate. An ink supply is connected to the substrate so that ink is allowed to flow through the pores of the substrate from the ink supply to the firing chamber. Thus, a substantial amount of the energy created by the impact of ink collapsing back into the firing chamber is expended within the pores of the substrate. In another embodiment, one or more firing resistors are formed in each firing chamber, and disposed adjacent the periphery of the firing chamber out of the direct impact path of collapsing ink.
    Type: Application
    Filed: February 12, 2001
    Publication date: August 15, 2002
    Inventor: Neal W. Meyer
  • Patent number: 6315393
    Abstract: The invention contemplates a flexible film, and a printhead (TAB head assembly) comprising the same; the flexible film having a converted surface with improved resistance. The converted surface comprises a carbon rich layer, preferably, Diamond Like Carbon (DLC) created through simultaneous surface treatment by multiplexed lasers.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: November 13, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Harold Lee Van Nice, Salim Khasawinah, Neal W. Meyer
  • Patent number: 6290331
    Abstract: A novel polymeric orifice plate for a printhead. The plate includes a recess in the top surface thereof which terminates at a position between the top and bottom plate surfaces. The recess communicates with a bore which passes through the remainder of the plate and terminates at the bottom surface. The recess has an upper end with a first opening therein, a lower end with a second opening therein, a side wall, and a bottom wall at the lower end The first opening is larger than the second opening. Application of physical force to the plate does not disturb the second opening in the recess which is “inset”. The recessed bottom wall (and possibly the top surface) of the plate may include at least one layer of coating material thereon for protective, wettability-control, and other purposes. These designs insure proper ink drop trajectory and high-quality image generation.
    Type: Grant
    Filed: July 18, 2000
    Date of Patent: September 18, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Arun K. Agarwal, Jennifer Korngiebel, Kit Christopher Baughman, Matthew D. Giere, Ronald A. Askeland, Noah C. Lassar, Satya Prakash, Neal W. Meyer, Harold Lee Van Nice, Salim Khasawinah
  • Patent number: 6155675
    Abstract: A high-durability printhead for an ink cartridge printing system. The printhead includes a substrate having ink ejectors (e.g. resistors) thereon and an orifice plate positioned above the substrate. The orifice plate (which preferably involves a non-metallic polymer film) has a top surface, bottom surface and a plurality of openings therethrough. To improve the durability of the orifice plate, a protective coating is applied to the top surface and/or the bottom surface of the plate. Representative coatings involve dielectric compositions (including diamond-like carbon) or at least one layer of metal. This approach improves the abrasion and deformation resistance of the plate and avoids "ruffling" and "dimpling" problems.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: December 5, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Lee Van Nice, Gerald E. Heppell, Neal W. Meyer, Donald L. Michael, Kit Baughman, Thach G. Troung, Rui Yang, Moses M. David, James R. White
  • Patent number: 6130688
    Abstract: A novel polymeric orifice plate for a printhead. The plate includes a recess in the top surface thereof which terminates at a position between the top and bottom plate surfaces. The recess communicates with a bore which passes through the remainder of the plate and terminates at the bottom surface thereof. The recess has an upper end with a first opening therein, a lower end with a second opening therein, and a side wall which is preferably oriented at a right angle relative to the top surface of the plate. The recess may also have a bottom wall at the lower end. The first opening is larger than the second opening. The application of physical force to the plate does not disturb the second opening in the recess which is "inset" and protected. This design insures proper ink drop trajectory and the generation of high-quality printed images.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: October 10, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Arun K Agarwal, Kit C Baughman, Jennifer M. Korngiebel, Neal W. Meyer, Harold Lee Van Nice, Salim Khasawinah
  • Patent number: 6062679
    Abstract: A high-durability printhead for an ink cartridge printing system includes a substrate having ink ejectors (e.g. resistors) thereon and an orifice plate positioned above the substrate. The orifice plate (which preferably involves a non-metallic polymer film) has a top surface, bottom surface and a plurality of openings therethrough. To improve the durability of the orifice plate, a protective coating is applied to the top surface and/or the bottom surface of the plate. Representative coatings involve dielectric compositions (including diamond-like carbon) or at least one layer of metal. This approach improves the abrasion and deformation resistance of the plate and avoids "dimpling" problems. Likewise, an intermediate barrier layer of diamond-like carbon is used between the orifice plate and the substrate. As result, an additional level of structural integrity is imparted to the orifice plate and printhead.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: May 16, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Neal W. Meyer, Donald L. Michael, Lee Van Nice, Gerald E. Heppell, Kit Baughman
  • Patent number: 5682188
    Abstract: A thermal inkjet printhead includes unpassivated heater resistors whose resistive material is doped, preferably with oxygen, nitrogen or an equivalent dopant, for increasing the resistance of the material. By increasing the resistance of the resistive material through doping, the drive currents for generating heat within the resistors need not be changed from levels which inkjet printers are presently designed to work with. The printhead of the invention can thus be used in place of a standard printhead without modification to the printer.
    Type: Grant
    Filed: March 16, 1995
    Date of Patent: October 28, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Neal W. Meyer, Eric G. Hanson, Alfred Pan, Glenn W. Weberg