Patents by Inventor Neda Seyedhassantehrani

Neda Seyedhassantehrani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat flux micro coolers having multi-stepped features and fluid wicking
    Patent number: 11729951
    Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: August 15, 2023
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior University, The Regents of the University of California, Merced, Alliance for Sustainable Energy, LLC
    Inventors: Chi Zhang, Qianying Wu, Muhammad Shattique, Neda Seyedhassantehrani, Souvik Roy, James Palko, Sreekant Narumanchi, Bidzina Kekelia, Sougata Hazra, Kenneth E. Goodson, Roman Giglio, Ercan M. Dede, Mehdi Asheghi
  • HEAT FLUX MICRO COOLERS HAVING MULTI-STEPPED FEATURES AND FLUID WICKING
    Publication number: 20230225082
    Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 13, 2023
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior University, The Regents of the University of California, Merced, Alliance for Sustainable Energy, LLC
    Inventors: Chi Zhang, Qianying Wu, Muhammad Shattique, Neda Seyedhassantehrani, Souvik Roy, James Palko, Sreekant Narumanchi, Bidzina Kekelia, Sougata Hazra, Kenneth E. Goodson, Roman Giglio, Ercan M. Dede, Mehdi Asheghi