Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Abstract: Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for packages that include transceivers that are at least partly positioned underneath a waveguide launcher array to decrease the maximum signal transmission time between the transceiver and the waveguide launcher array. This configuration may increase the overall data transmission rate between a die and waveguides coupled with the waveguide launcher array. Other embodiments may be described and/or claimed.

Abstract: Capacitors for decoupling, power delivery, integrated circuits, related systems, and methods of fabrication are disclosed. Such capacitors include a transition metal oxide dielectric between two electrodes, at least one of which includes a conductive metal oxide layer on the transition metal oxide dielectric and a high density metal layer on the conductive metal oxide.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, an electromagnetic wave launcher is embedded in the core. In an embodiment, the electromagnetic wave launcher comprises a fin, where the fin is a conductive material, and where the fin comprises a stepped profile.

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a via opening is formed through the core. In an embodiment, the via opening has an aspect ratio (depth:width) that is approximately 5:1 or greater. In an embodiment, the electronic package further comprises a via in the via opening, where the via opening is fully filled.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a magnetic ring is embedded in the substrate. In an embodiment, a loop is around the magnetic ring. In an embodiment, the loop is conductive and comprises a first via through the substrate, a second via through the substrate, and a trace over a surface of the substrate, where the trace electrically couples the first via to the second via.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a buildup layer is over the core. In an embodiment, a patch antenna with a first patch is under the core, and a second patch is over a surface of the core opposite from the first patch. In an embodiment, the electronic package further comprises a via through the core and coupled to the patch antenna.

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core. In an embodiment, the core comprises glass. In an embodiment, a blind via is provided into the core. In an embodiment, a plate spans across the blind via.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through the substrate, where the via opening has an hourglass shaped profile. In an embodiment, a magnetic layer fills the via opening, and a via is through the magnetic layer. In an embodiment, sidewalls of the via are substantially vertical.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through a thickness of the substrate, and a first layer is over sidewalls of the via opening. In an embodiment, the first layer comprises a magnetic material. In an embodiment, a second layer is over the first layer, where the second layer is an insulator. In an embodiment, a third layer fills the via opening, where the third layer is a conductor.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a core with a first surface and a second surface, where the core comprises glass. In an embodiment, a first buildup layer is over the first surface of the core, and a second buildup layer is under the second surface of the core. In an embodiment, the electronic package further comprises a via through the core between the first surface of the core and the second surface of the core, and a plane into the first surface of the core, where a width of the plane is greater than a width of the via.

Abstract: Embodiments disclosed herein include an electronic package that comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the substrate comprises glass. In an embodiment, the electronic package further comprises an opening through the substrate from the first surface to the second surface, where the opening comprises a first end proximate to the first surface of the substrate, a second end proximate to the second surface of the substrate, and a middle region between the first end and the second end. In an embodiment, the middle region has a discontinuous slope at junctions with the first end and the second end.

Abstract: Embedded batteries within glass cores are disclosed. Example apparatus include a glass core layer having opposing first and second surfaces, the glass core layer including a cavity extending from the first surface toward the second surface, and a battery including a first conductive material positioned in the cavity, a second conductive material positioned in the cavity, and an electrolyte to separate the first conductive material from the second conductive material.

Abstract: Methods, systems, apparatus, and articles of manufacture are disclosed for integrated circuit package substrates with high aspect ratio through glass vias. An example microelectronic package including a glass substrate including a via, the via including a high aspect ratio. The example microelectronic package further including a seed layer extending substantially evenly along an inner wall of the via.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass. In an embodiment, the electronic package further comprises a trace embedded in the substrate, where a width of the trace is less than a height of the trace. In an embodiment, the electronic package further comprises a first layer on the first surface of the substrate, where the first layer is a dielectric buildup film, and a second layer on the second surface of the substrate, where the second layer is the dielectric buildup film.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to positioning signal and ground vias, or ground planes, in a glass core to control impedance within a package. Laser-assisted etching processes may be used to create vertical controlled impedance lines to enhance bandwidth and bandwidth density of high-speed signals on a package. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include package substrates with angled vias and/or via planes. In an embodiment, a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a first pad is on the first surface, and a second pad on the second surface, where the second pad is outside a footprint of the first pad. In an embodiment, the package substrate further comprises a via through a thickness of the core, where the via connects the first pad to the second pad.

Abstract: Embodiments disclosed herein include a package substrate and methods of fabricating such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface, and a via through the core. In an embodiment a first pad is over the via, and the first pad is embedded within the core with a third surface that is substantially coplanar with the first surface of the core. In an embodiment, a second pad is over the via, where the second pad is embedded within the core with a fourth surface that is substantially coplanar with the second surface of the core.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package that is surrounded by a metal ring. A radiating element on one side of the substrate core and above the waveguide surrounded by the metal ring communicates with another radiating element on the other side of the substrate core and below the waveguide surrounded by the metal ring. Other embodiments may be described and/or claimed.