Abstract: The illustrative embodiments pertain to a test fixture having low insertion inductance for large bandwidth monitoring of current signals. In one exemplary embodiment, the test fixture includes a baseplate with each resistor of a set of resistors embedded inside a respective non-plated through slot in the baseplate. A first terminal of each resistor is soldered to a top metallic zone of the baseplate and a second terminal soldered to a first of two bottom metallic zones of the baseplate. The top metallic zone is connected by plated-through holes to a second of the two bottom metallic zones. When mounted upon a PCB, the test fixture allows current flow from the first bottom metallic zone, upwards through the set of resistors to the top metallic zone, and downwards to the second bottom metallic zone. An observation instrument may be coupled to a coaxial connector that is mounted on the baseplate.

Abstract: The illustrative embodiments pertain to a test fixture having low insertion inductance for large bandwidth monitoring of current signals. In one exemplary embodiment, the test fixture includes a baseplate with each resistor of a set of resistors embedded inside a respective non-plated through slot in the baseplate. A first terminal of each resistor is soldered to a top metallic zone of the baseplate and a second terminal soldered to a first of two bottom metallic zones of the baseplate. The top metallic zone is connected by plated-through holes to a second of the two bottom metallic zones. When mounted upon a PCB, the test fixture allows current flow from the first bottom metallic zone, upwards through the set of resistors to the top metallic zone, and downwards to the second bottom metallic zone. An observation instrument may be coupled to a coaxial connector that is mounted on the baseplate.

Abstract: The illustrative embodiments pertain to a test fixture having low insertion inductance for large bandwidth monitoring of current signals. In one exemplary embodiment, the test fixture includes a baseplate with each resistor of a set of resistors embedded inside a respective non-plated through slot in the baseplate. A first terminal of each resistor is soldered to a top metallic zone of the baseplate and a second terminal soldered to a first of two bottom metallic zones of the baseplate. The top metallic zone is connected by plated-through holes to a second of the two bottom metallic zones. When mounted upon a PCB, the test fixture allows current flow from the first bottom metallic zone, upwards through the set of resistors to the top metallic zone, and downwards to the second bottom metallic zone. An observation instrument may be coupled to a coaxial connector that is mounted on the baseplate.

Abstract: The illustrative embodiments pertain to a test fixture having low insertion inductance for large bandwidth monitoring of current signals. In one exemplary embodiment, the test fixture includes a baseplate with each resistor of a set of resistors embedded inside a respective non-plated through slot in the baseplate. A first terminal of each resistor is soldered to a top metallic zone of the baseplate and a second terminal soldered to a first of two bottom metallic zones of the baseplate. The top metallic zone is connected by plated-through holes to a second of the two bottom metallic zones. When mounted upon a PCB, the test fixture allows current flow from the first bottom metallic zone, upwards through the set of resistors to the top metallic zone, and downwards to the second bottom metallic zone. An observation instrument may be coupled to a coaxial connector that is mounted on the baseplate.