Patents by Inventor Neil S. Wester

Neil S. Wester has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7348130
    Abstract: The present invention describes a method including providing a substrate; forming a photoresist on the substrate; performing a post-apply bake on the photoresist; exposing the photoresist to actinic radiation; performing a post-exposure bake on the photoresist; developing the photoresist; and performing electron exposure on the photoresist to reduce line edge roughness.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: March 25, 2008
    Assignee: Intel Corporation
    Inventor: Neil S. Wester
  • Patent number: 7005718
    Abstract: An apparatus including a plurality of devices formed on a substrate, and a scribe line area separating each of the plurality of devices, and a masking material overlying a portion of the scribe line area.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: February 28, 2006
    Assignee: Intel Corporation
    Inventor: Neil S. Wester
  • Patent number: 6924084
    Abstract: The present invention describes a method including providing a substrate; forming a photoresist on the substrate; performing a post-apply bake on the photoresist; exposing the photoresist to actinic radiation; performing a post-exposure bake on the photoresist; developing the photoresist; and performing electron exposure on the photoresist to reduce line edge roughness.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: August 2, 2005
    Assignee: Intel Corporation
    Inventor: Neil S. Wester
  • Publication number: 20040191701
    Abstract: The present invention describes a method including providing a substrate; forming a photoresist on the substrate; performing a post-apply bake on the photoresist; exposing the photoresist to actinic radiation; performing a post-exposure bake on the photoresist; developing the photoresist; and performing electron exposure on the photoresist to reduce line edge roughness.
    Type: Application
    Filed: March 31, 2003
    Publication date: September 30, 2004
    Inventor: Neil S. Wester
  • Patent number: 6577342
    Abstract: An optical device including a semiconductor-based substrate having a photosensitive circuit including a photosensitive area a portion of which is covered by color filter array material, a contact area surrounding the photosensitive area, and a microlens material overlying the portion of the photosensitive area and a portion of a contact area.
    Type: Grant
    Filed: September 25, 1998
    Date of Patent: June 10, 2003
    Assignee: Intel Corporation
    Inventor: Neil S. Wester
  • Publication number: 20020070429
    Abstract: An apparatus including a plurality of devices formed on a substrate, and a scribe line area separating each of the plurality of devices, and a masking material overlying a portion of the scribe line area.
    Type: Application
    Filed: February 5, 2002
    Publication date: June 13, 2002
    Inventor: Neil S. Wester
  • Patent number: 6383894
    Abstract: In one aspect, a method is disclosed. The method comprises introducing a plurality of integrated circuits on a substrate, each integrated circuit separated from another by a scribe line area and introducing a masking material over a portion of the scribe line area. Following the introduction of the masking material, the method further includes introducing a material comprising a colorant over a portion of each of the plurality of integrated circuits and singulating the plurality of integrated circuits.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: May 7, 2002
    Assignee: Intel Corporation
    Inventor: Neil S. Wester
  • Patent number: 6362513
    Abstract: An embodiment of the invention is a semiconductor die having a number of photodetecting sites that are part of a color image sensor. A number of microlens structures are provided, each positioned above a respective one of the photodetecting sites. A color filter layer is formed above the microlens structures. No passivation layer is formed between the microlens structures and a top metal layer of the die. The die may be used as the eye of an electronic system such as a digital camera.
    Type: Grant
    Filed: July 8, 1999
    Date of Patent: March 26, 2002
    Assignee: Intel Corporation
    Inventor: Neil S. Wester
  • Publication number: 20010042876
    Abstract: An embodiment of the invention is a semiconductor die having a number of photodetecting sites that are part of a color image sensor. A number of microlens structures are provided, each positioned above a respective one of the photodetecting sites. A color filter layer is formed above the microlens structures. No passivation layer is formed between the microlens structures and a top metal layer of the die. The die may be used as the eye of an electronic system such as a digital camera.
    Type: Application
    Filed: July 8, 1999
    Publication date: November 22, 2001
    Inventor: NEIL S. WESTER