Patents by Inventor Nelson Fan

Nelson Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless plastic chip carrier with etch back pad singulation
    Patent number: 6498099
    Abstract: A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip may then be performed by saw singulation or die punching.
    Type: Grant
    Filed: April 8, 1999
    Date of Patent: December 24, 2002
    Assignee: ASAT Ltd.
    Inventors: Neil McLellan, Nelson Fan
  • Saw singulated leadless plastic chip carrier
    Publication number: 20020056856
    Abstract: Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.
    Type: Application
    Filed: December 21, 2001
    Publication date: May 16, 2002
    Inventors: Neil Mclellan, Nelson Fan
  • Saw-singulated leadless plastic chip carrier
    Publication number: 20010030355
    Abstract: Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.
    Type: Application
    Filed: February 26, 2001
    Publication date: October 18, 2001
    Inventors: Neil Mclellan, Nelson Fan, Robert P. Sheppard
  • Exposed die leadless plastic chip carrier
    Patent number: 6294100
    Abstract: A leadless integrated circuit package, comprising an exposed semiconductor die and contact pads embedded in an over mold, and wires interconnecting the semiconductor die and contact pads.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: September 25, 2001
    Assignee: Asat LTD
    Inventors: Nelson Fan, Neil McLellan
  • Saw-singulated leadless plastic chip carrier
    Patent number: 6242281
    Abstract: Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: June 5, 2001
    Assignee: ASAT, Limited
    Inventors: Neil Mclellan, Nelson Fan
  • Saw-singulated leadless plastic chip carrier
    Patent number: 6229200
    Abstract: Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.
    Type: Grant
    Filed: June 10, 1998
    Date of Patent: May 8, 2001
    Assignee: ASAT Limited
    Inventors: Neil Mclellan, Nelson Fan