Patents by Inventor Nelson J. KOTTKE

Nelson J. KOTTKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board assembly having a damping layer
    Patent number: 10431382
    Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: October 1, 2019
    Assignee: Apple Inc.
    Inventors: Gemin Li, Paul Martinez, Benjamin A. Bard, Connor R. Duke, Zhong-Qing Gong, Kevin R. Richardson, Curtis C. Mead, Kieran Poulain, Sung Woo Yoo, Nelson J. Kottke
  • Acoustically quiet capacitors
    Patent number: 9805867
    Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: October 31, 2017
    Assignee: Apple Inc.
    Inventors: Shawn X. Arnold, Jeffrey M. Thoma, Connor R. Duke, Yanchu Xu, Nelson J. Kottke
  • PRINTED CIRCUIT BOARD ASSEMBLY HAVING A DAMPING LAYER
    Publication number: 20170064811
    Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 2, 2017
    Inventors: Gemin Li, Paul Martinez, Benjamin A. Bard, Connor R. Duke, Zhong-Qing Gong, Kevin R. Richardson, Curtis C. Mead, Kieran Poulain, Sung Woo Yoo, Nelson J. Kottke
  • ACOUSTICALLY QUIET CAPACITORS
    Publication number: 20140076621
    Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.
    Type: Application
    Filed: August 1, 2013
    Publication date: March 20, 2014
    Applicant: Apple Inc.
    Inventors: Shawn X. ARNOLD, Jeffrey M. THOMA, Connor R. DUKE, Yanchu XU, Nelson J. KOTTKE