Abstract: Synchronizing stereoscopic cameras using padding data setting modification may include: receiving a first frame from a first camera and a second frame from a second camera; calculating a differential between a first time corresponding to the first frame and a second time corresponding to the second frame; determining whether the differential exceeds a threshold; and increasing, responsive to the differential exceeding the threshold, a frame rate of the first camera relative to the second camera by transmitting a padding data instruction to the first camera or the second camera.

Abstract: Detecting stereoscopic camera desynchronization may include: receiving, at a processing unit, a first frame from a first camera and a second frame from a second camera, wherein the first camera provides first time data for when the first frame is captured by the first camera and the second camera provides second time data indicating when the second frame is captured by the second camera; associating, with the first image and independent of the first time data, a first timestamp; associating, with the second image and independent of the second time data, a second timestamp; and determining, by the processing unit, whether the first camera and the second camera are synchronized based on the first timestamp and the second timestamp.

Abstract: Stereoscopic camera resynchronization in an autonomous vehicle may include: sending, to a first camera out of synchronization with a second camera, a first command to modify a frame rate of the first camera by modifying a padding data setting of the first camera; determining, independent of any determination that the first camera and second camera are resynchronized, an interval for sending, to the first camera, a second command to restore the padding data setting of the first camera; and sending, responsive to the interval occurring, the second command to the first camera.

Abstract: Embodiments of the present disclosure provide an apparatus including a semiconductor die having a plurality of integrated circuit devices, a pad structure electrically coupled to at least one integrated circuit device of the plurality of integrated circuit devices via an interconnect layer, an electrically insulative layer disposed on the interconnect layer, a first shielding structure disposed in the electrically insulative layer and electrically coupled to the pad structure, an under-ball metallization (UBM) structure electrically coupled to the first shielding structure, and a solder bump electrically coupled to the UBM structure, the solder bump comprising a solder bump material capable of emitting alpha particles, wherein the first shielding structure is positioned between the solder bump and the plurality of integrated circuit devices to shield the plurality of integrated circuit devices from the alpha particles. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide an apparatus including a semiconductor die having a plurality of integrated circuit devices, a pad structure electrically coupled to at least one integrated circuit device of the plurality of integrated circuit devices via an interconnect layer, an electrically insulative layer disposed on the interconnect layer, a first shielding structure disposed in the electrically insulative layer and electrically coupled to the pad structure, an under-ball metallization (UBM) structure electrically coupled to the first shielding structure, and a solder bump electrically coupled to the UBM structure, the solder bump comprising a solder bump material capable of emitting alpha particles, wherein the first shielding structure is positioned between the solder bump and the plurality of integrated circuit devices to shield the plurality of integrated circuit devices from the alpha particles. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide an apparatus including a semiconductor die having a plurality of integrated circuit devices, a pad structure electrically coupled to at least one integrated circuit device of the plurality of integrated circuit devices via an interconnect layer, an electrically insulative layer disposed on the interconnect layer, a first shielding structure disposed in the electrically insulative layer and electrically coupled to the pad structure, an under-ball metallization (UBM) structure electrically coupled to the first shielding structure, and a solder bump electrically coupled to the UBM structure, the solder bump comprising a solder bump material capable of emitting alpha particles, wherein the first shielding structure is positioned between the solder bump and the plurality of integrated circuit devices to shield the plurality of integrated circuit devices from the alpha particles. Other embodiments may be described and/or claimed.

Abstract: A. track structure utilizes a somewhat flexible track frame having a roadway portion for supporting a rolling toy vehicle. The frame further includes a plurality of outwardly extending opposed pairs of platforms on each side of the roadway. A plurality of guide post supports are secured to the platforms and define notches for receiving a snap-fitted guide rail. A pair of generally cylindrical elongated somewhat flexible and resilient guide rails are snap-fitted to the guide rails supports on each side of the frame to form trackway walls. The cooperation of the guide rails and their supports facilitates the shape retention of the track segments.

Abstract: A toy vehicle trackset including a closed trackway, a toy vehicle and a booster for accelerating the toy vehicle traveling the trackway. Within the trackway, a portion of the toy vehicle travel path includes a flexible multi-apertured panel held by a support structure.

Abstract: A toy vehicle trackset includes a trackway and a plurality of pneumatically actuated stunt devices within the travel path of the trackway. A source of compressed air is applied to one or more of the stunt devices to act upon a toy vehicle traveling the travel path.

Abstract: A clamping element for a toy vehicle trackset support structure includes a housing defining a passage therethrough and a socket. The passage receives an elongated support rod while the socket receives a ball which further supports a trackway segment. A lever actuated lock secures the rod and ball within the housing.

Abstract: A spiral stunt device includes a supporting frame having an upper cross member which in turn defines a helical thread. A traveler engages the helical thread of the upper support and further supports a pendulum segment. The pendulum segment extends downwardly and terminates in a toy vehicle receiver or “caddy”. A first track segment is directed toward one side of the spiral stunt device which a second track segment is directed toward an offset portion of the stunt device. As a toy vehicle enters the stunt device with substantial energy, it is captivated by the toy vehicle receiver. As the energy of the captivated toy vehicle is transferred to the receiver and its pendulum support, the receiver together with the toy vehicle and the pendulum support are caused to rotate about the horizontal member advancing the traveler on the helical threads. The resulting lateral movement of the traveler upon the helical thread aligns the toy vehicle receiver with the offset track segment.

Abstract: The stunt device is positioned within the travel path of a toy vehicle and is supported by a support frame. A flip device is pivotally coupled to the frame and positioned to receive a toy vehicle from a portion of the trackset. A spring is coupled to the flip device and is restrained by the trigger. The trigger is positioned within the toy vehicle travel path upon the vehicle entrance to the stunt device. As the toy vehicle impacts the trigger, the spring is released causing the flip device to pivot rapidly thrusting the toy vehicle into the air in a somersault projection.

Abstract: A plurality of stunt devices are used within a toy vehicle trackset. Each of the devices includes a movable portion within the toy vehicle travel path. Each movable portion is moved by a pneumatic actuator. A manually operated air bellows is coupled to each pneumatic actuator by a hollow tube. When a particular air bellows is compressed, the corresponding actuator moves the movable portion diverting the toy vehicle on the stunt device.

Abstract: A toy vehicle launcher and supporting clamp are used in providing a gravity driven toy vehicle trackset. The clamp utilizes a ratcheting attachment member which facilitates the rapid sizing or adjustment for size for attachment to a table edge or the like. The launcher and clamp further provides a toy vehicle launcher having a trigger release for gravity driven launch of a toy vehicle down a coupled track segment. The angle of the toy vehicle launcher is adjustable to facilitate changes in launch angle and thereby changes in the amount of energy imparted to the toy vehicle.

Abstract: A scaffold support system for toy vehicle tracksets utilizes a plurality of base members which in turn support a plurality of generally cylindrical rod elements. The rod elements are elongated and generally circular in cross-section. A plurality of joint members are utilized in securing combinations of the rod members together to form a scaffold structure. In turn, a further plurality of joint members are utilized in securing the track segments to the various rods found in the scaffold structure. The joints are movable and rotatable upon the supporting rods to provide substantial variation of track segment positioning and contour within the trackset. For the most part, each joint utilized in securing the track segments and the combinations of scaffold supporting rods within the trackset is capable of securely locking in a selected position.