Abstract: An apparatus for fabricating a hybrid tube includes a rotatable mandrel and a first housing configured to translate alongside the rotatable mandrel while dispensing a first strip to be helically wound about the mandrel. The first housing includes an angle adjustment mechanism to control a dispensation angle of the first strip. The apparatus also includes least one energy or adhesive source for bonding overlapping strip portions on the rotatable mandrel and forming the hybrid tube. The at least one energy or adhesive source is configured for translation alongside the rotatable mandrel.

Abstract: A hydrophobic, self-healing coating includes a vitrimer film having a silicone polymer network crosslinked with dynamic covalent bonds including a boronic ester, where the vitrimer film has a thickness of less than 1000 nm, and where the dynamic covalent bonds provide a mechanism for self-healing of the vitrimer film.

Abstract: A component with a reflective substrate, a photoresist layer disposed on the reflective substrate, and a light diffusing layer sandwiched between the reflective substrate and the photoresist layer is provided. The light diffusing layer includes an outer metal oxide layer with an outer rough surface configured to diffuse laser light during laser interference lithography of the photoresist layer. The outer metal oxide is also configured to be reduced to a conductive metallic layer during electroplating of the substrate. The outer metal oxide layer includes a plurality of elongated light diffusing elements extending in an outward direction from the substrate such that the outer rough surface diffuses at least 90% of laser light during the laser interference lithography of the photoresist layer.

Abstract: A cooling system includes a container having a water-based fluid in which are immersed printed circuit boards (PCBs). One or more high-thermal electrical components are disposed on the PCBs. A condenser causes water vapor generated by the one or more high-thermal electrical components to condense and passively return to the water-based fluid. A nano-engineered coating is deposited over the one or more high-thermal electrical components that includes an electrical insulation coating of between two to 25 microns in thickness deposited on the one or more high-thermal electrical components. A metallic nano-layer comprising a porous metallic nano-structure deposited on the electrical insulation coating.

Abstract: A component with a reflective substrate, a photoresist layer disposed on the reflective substrate, and a light diffusing layer sandwiched between the reflective substrate and the photoresist layer is provided. The light diffusing layer includes an outer metal oxide layer with an outer rough surface configured to diffuse laser light during laser interference lithography of the photoresist layer. The outer metal oxide is also configured to be reduced to a conductive metallic layer during electroplating of the substrate. The outer metal oxide layer includes a plurality of elongated light diffusing elements extending in an outward direction from the substrate such that the outer rough surface diffuses at least 90% of laser light during the laser interference lithography of the photoresist layer.

Abstract: A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.

Abstract: An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (?m) thick, the copper layer conformally adhered to a top of the power component and to the PCB.

Abstract: A porous polymer composite for daytime radiative cooling includes a porous polymer matrix comprising a thermoplastic polymer and including a plurality of pores, and selectively emitting particles dispersed in the porous polymer matrix. When exposed to solar radiation, the porous polymer composite comprises an infrared emissivity of at least about 80% in a wavelength range of 8-13 ?m and/or a solar reflectivity of at least about 80% in a wavelength range of 0.3-2 ?m.

Abstract: A heat and mass transfer component comprises a lubricant-impregnated surface including hydrophobic surface features, which comprise nanostructured surface protrusions having a hydrophobic species attached thereto. The hydrophobic surface features are impregnated with a fluorinated lubricant having a viscosity in a range from about 400 mPa·s to about 6000 mPa·s. A method of fabricating a lubricant-impregnated surface on a heat and mass transfer component comprises: cleaning a thermally conductive substrate to form a cleaned substrate; exposing the cleaned substrate to a hot water or hot alkaline solution to form a thermally conductive substrate having nanostructured surface protrusions; depositing a hydrophobic species on the nanostructured surface protrusions to form hydrophobic surface features; and coating the hydrophobic surface features with a fluorinated lubricant having a viscosity in a range from 400 mPa·s to 6000 mPa·s.

Abstract: A method of achieving high heat transfer during cooling includes providing an aluminum body having an inner surface enclosing a channel, where the inner surface comprises microscale roughness features and microcavities configured to enhance nucleation site density during flow boiling. A refrigerant is transported through the channel. During the transport, the refrigerant absorbs heat from a thermal load and undergoes flow boiling. The heat is transferred to the refrigerant at an average heat transfer coefficient of at least about 10 kW/(m2·K) at a mass flux of about 300 kg/(m2·s).

Abstract: An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (?T) between the electronic devices.

Abstract: An apparatus for fabricating a hybrid tube includes a rotatable mandrel and a first housing configured to translate alongside the rotatable mandrel while dispensing a first strip to be helically wound about the mandrel. The first housing includes an angle adjustment mechanism to control a dispensation angle of the first strip. The apparatus also includes least one energy or adhesive source for bonding overlapping strip portions on the rotatable mandrel and forming the hybrid tube. The at least one energy or adhesive source is configured for translation alongside the rotatable mandrel.

Abstract: A coated substrate that may exhibit anti-scaling properties includes a substrate comprising a metal or alloy, an intermediary layer formed on the substrate, and a non-crosslinked omniphobic coating formed on the intermediary layer. A method of forming an anti-scaling coating on a substrate includes forming an intermediary layer on a substrate comprising a metal or alloy, and forming a non-crosslinked omniphobic coating on the intermediary layer.

Abstract: A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.

Abstract: A heat and mass transfer component comprises a lubricant-impregnated surface including hydrophobic surface features, which comprise nanostructured surface protrusions having a hydrophobic species attached thereto. The hydrophobic surface features are impregnated with a fluorinated lubricant having a viscosity in a range from about 400 mPa·s to about 6000 mPa·s. A method of fabricating a lubricant-impregnated surface on a heat and mass transfer component comprises: cleaning a thermally conductive substrate to form a cleaned substrate; exposing the cleaned substrate to a hot water or hot alkaline solution to form a thermally conductive substrate having nanostructured surface protrusions; depositing a hydrophobic species on the nanostructured surface protrusions to form hydrophobic surface features; and coating the hydrophobic surface features with a fluorinated lubricant having a viscosity in a range from 400 mPa·s to 6000 mPa·s.

Abstract: A method for coating heat transfer components to impart superhydrophobicity comprises conveying one or more heat transfer components to a cleaning station, where the one or more heat transfer components are cleaned with an organic solvent. After the cleaning, the one or more heat transfer components are conveyed to a nanostructuring station and immersed in hot water for surface oxidation and roughening. After the immersion in hot water, the one or more heat transfer components are conveyed to a functionalization station and exposed to a heated precursor vapor comprising a hydrophobic species. During the exposure, the hydrophobic species is deposited on roughened surfaces of the one or more heat transfer components, thereby forming a superhydrophobic coating. Prior to being conveyed to the cleaning station, the one or more heat transfer components may be attached to an automated conveyor system positioned to traverse the cleaning, nanostructuring, and functionalization stations.

Abstract: An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (?T) between the electronic devices.

Abstract: A uniform external field can enhance condensation on a superhydrophobic surface. Jumping droplets on superhydrophobic surfaces accumulate a positive charge which promises the manipulation and control of jumping behavior using external electric fields.

Abstract: A single-stack, solar power receiver comprising both a thermal absorber layer and a photovoltaic cell layer. The stack includes an aerogel layer, that is optically transparent and thermally insulating (“OTTI”); a spectrally selective high thermal conductivity (“SSTC”) thermal absorber layer; a bottom OTTI layer; and a PV cell layer. The SSTC layer includes a set of fins that substantially blocks solar radiation absorption in the band where PV cells are most sensitive. Photons with energies above or below this band block range are absorbed by the fins and the absorbed heat is conducted to pipes in the fin structure carrying a heated thermal working fluid to heat storage. Photons with energy in the band block range are reflected by the SSTC fins to the PV cell layer. The bottom OTTI aerogel layer keeps the PV cell operating near ambient temperature. The PV cell converts incident solar radiation to electrical energy.

Abstract: A single-stack, solar power receiver comprising both a thermal absorber layer and a photovoltaic cell layer. The stack includes an aerogel layer, that is optically transparent and thermally insulating (“OTTI”); a spectrally selective high thermal conductivity (“SSTC”) thermal absorber layer; a bottom OTTI layer; and a PV cell layer. The SSTC layer includes a set of fins that substantially blocks solar radiation absorption in the band where PV cells are most sensitive. Photons with energies above or below this band block range are absorbed by the fins and the absorbed heat is conducted to pipes in the fin structure carrying a heated thermal working fluid to heat storage. Photons with energy in the band block range are reflected by the SSTC fins to the PV cell layer. The bottom OTTI aerogel layer keeps the PV cell operating near ambient temperature. The PV cell converts incident solar radiation to electrical energy.