Patents by Inventor Neng-Sen Kao

Neng-Sen Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110017524
    Abstract: A touch panel has a first substrate, a second substrate, a frame adhesive and multiple multi-layer conductive wires. The first substrate has first axis electrode strings and second axis transparent electrodes formed on a surface. The second substrate is disposed opposite to the first substrate and has bridging members and bridging connectors formed on each of the bridging members and connected to the second axis electrodes of the first substrate. The frame adhesive connects the first substrate and the second substrate. The multi-layer conductive wires are electrically connected to the first axis electrode strings and the second axis transparent electrodes and connect to a flexible printed circuit board. With the bridging members and bridging connectors formed on another substrate, a mask process of forming insulating members can be avoided, and a manufacture process is simplified with associated cost reductions.
    Type: Application
    Filed: July 27, 2009
    Publication date: January 27, 2011
    Inventors: Chien Lung Chen, Wen-Jye Chen, Neng-Sen Kao, Chien-Cheng Chen