Abstract: Disclosed is method and device for forming an electrode plate. The method includes: performing tab cutting on a substrate so that the substrate forms a body portion, an edge portion connecting to the body portion, and a plurality of tabs that connect to the body portion but are separated from the edge portion; and performing edge portion cutting on the substrate to separate the edge portion from the body portion. The electrode plate is formed in two steps. First, the tab and the edge portion are separated, so that in the process of cutting, impact of vibration of the edge portion on the tab is small, greatly reducing the risk of deformation of the tab caused by vibration of the edge portion and damage to the tab caused by being pulled by the edge portion. Second, edge portion cutting separates the edge portion from the body portion.

Abstract: A coating device includes a first coating mechanism configured to coat a first surface of a substrate, a first oven drying mechanism arranged downstream of the first coating mechanism and configured to oven dry a coating on the first surface, a second coating mechanism arranged downstream of the first oven drying mechanism and configured to coat a second surface of the substrate opposite to the first surface, a second oven drying mechanism arranged downstream of the second coating mechanism and configured to oven dry a coating on the second surface, and a third oven drying mechanism arranged downstream of the second oven drying mechanism and configured to oven dry the coating on the second surface.

Abstract: The present application provides an oven drying apparatus and a coating device. The oven drying apparatus comprises an oven drying chamber and a heating assembly. The oven drying chamber is equipped with a first oven drying side having a plurality of first air inlet portions for fluid medium to enter the oven drying chamber. The heating assembly is disposed on the first oven drying side. The first oven drying side is further provided with at least one air return portion provided between two adjacent first air inlet portions, and the air return portion being configured for fluid medium in the oven drying chamber to be discharged from the oven drying chamber. The arrangement of an air return portion between two first air inlet portions can discharge fluid medium between the two first air inlet portions and take away the heat, thus avoiding accumulation of heat between the two first air inlet portions.

Abstract: Disclosed is method and device for forming an electrode plate. The method includes: performing tab cutting on a substrate so that the substrate forms a body portion, an edge portion connecting to the body portion, and a plurality of tabs that connect to the body portion but are separated from the edge portion; and performing edge portion cutting on the substrate to separate the edge portion from the body portion. The electrode plate is formed in two steps. First, the tab and the edge portion are separated, so that in the process of cutting, impact of vibration of the edge portion on the tab is small, greatly reducing the risk of deformation of the tab caused by vibration of the edge portion and damage to the tab caused by being pulled by the edge portion. Second, edge portion cutting separates the edge portion from the body portion.

Abstract: An electrode plate processing device is provided. The electrode plate processing device includes: an electrode plate conveying mechanism configured to convey an electrode plate; a cutting mechanism disposed opposite to the electrode plate and configured to cut the electrode plate to form a tab; and a waste adsorption mechanism disposed downstream of the cutting mechanism along a conveying direction of the electrode plate. The waste adsorption mechanism includes an active driving roller, a driven support roller, and a conveyer belt that is coupled to the active driving roller and the driven support roller in a transmission way. The conveyer belt is driven by the active driving roller to rotate and configured to provide an adsorption force to a waste edge produced during the cutting of the electrode plate so as to adsorb the waste edge.

Abstract: The present disclosure relates to an electrode plate processing device. The electrode plate processing device includes: an electrode plate cutting mechanism having a cutting position; and an electrode plate rolling mechanism, through which an electrode plate passes. The electrode plate rolling mechanism includes a first roller and a second roller. The first roller has a vacuum adsorption zone for adsorbing a waste edge of the electrode plate. The cutting position is provided in upstream of the vacuum adsorption zone along a conveying direction of the electrode plate processing device.

Abstract: The present disclosure relates to an electrode plate processing device. The electrode plate processing device includes: an electrode plate conveying mechanism configured to convey an electrode plate; a cutting mechanism disposed opposite to the electrode plate and configured to cut the electrode plate to form a tab; and a waste adsorption mechanism disposed downstream of the cutting mechanism along a conveying direction of the electrode plate. The waste adsorption mechanism includes an active driving roller, a driven support roller, and a conveyer belt that is coupled to the active driving roller and the driven support roller in a transmission way. The conveyer belt is driven by the active driving roller to rotate and configured to provide an adsorption force to a waste edge produced during the cutting of the electrode plate so as to adsorb the waste edge.

Abstract: The present disclosure relates to an electrode plate processing device. The electrode plate processing device includes: an electrode plate cutting mechanism having a cutting position; and an electrode plate rolling mechanism, through which an electrode plate passes. The electrode plate rolling mechanism includes a first roller and a second roller. The first roller has a vacuum adsorption zone for adsorbing a waste edge of the electrode plate. The cutting position is provided in upstream of the vacuum adsorption zone along a conveying direction of the electrode plate processing device.