Abstract: This document discusses, among other things, an apparatus comprising a lacrimal implant insertable at least partially into a lacrimal punctum. The lacrimal implant comprises an implant core, and an implant body. The implant body includes a cavity sized and shaped to receive the implant core. At least one of the implant core and the implant cavity includes a detection device configured to allow automatic detection of the lacrimal implant with a separate detector device.

Abstract: This document discusses, among other things, an apparatus comprising a lacrimal implant insertable at least partially into a lacrimal punctum. The lacrimal implant comprises an implant core, and an implant body. The implant body includes a cavity sized and shaped to receive the implant core. At least one of the implant core and the implant cavity includes a detection device configured to allow automatic detection of the lacrimal implant with a separate detector device.

Abstract: A unidirectional acoustic probe including a high-performance interconnection network, and a method of manufacturing such a probe. The unidirectional acoustic probe includes linear piezoelectric transducers on the surface of a dielectric film. The dielectric film includes a connection device to electrically connect the piezoelectric transducers to a control device. The connection device includes primary connection pads, facing the piezoelectric transducers, secondary connection pads, offset with respect to the piezoelectric transducers, so that the transducers can be connected to the control device, and conducting tracks connecting the primary connection pads to the secondary connection pads. The conducting tracks are in a direction perpendicular to the direction defined by a major axis of the piezoelectric transducers.

Abstract: The invention concerns a method to manufacture acoustic probes comprising unitary piezoelectric transducers. The method comprises an original step to realize an earth plane formed from a flexible dielectric film covered by a conducting film. The flexible dielectric film is ablated locally to expose the conducting film. The ablated film acts as draping and earth plane for the unitary piezoelectric transducers.

Abstract: The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.

Abstract: The invention relates to a multielement acoustic probe comprising an acoustic support and an electrical circuit with conducting tracks connected to elementary piezoelectric transducers. In addition, the probe comprises a film of composite conducting material placed between the piezoelectric transducers and the conducting tracks. Conventionally, the piezoelectric transducers are subcut in order to obtain elements which are acoustically uncoupled and electrically coupled. The presence of the film of composite conducting material favours the dimensioning of the track with respect to the subelements and constitutes an intermediate element with respect to the differences in thermal expansion between the acoustic support and the piezoelectric transducers. Application: medical and underwater imaging.

Abstract: The invention relates to a unidirectional acoustic probe comprising a high-performance interconnection network, and a method of manufacturing such a probe.

Abstract: A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the external face, and including a first series of via holes connecting the electrical contacts and the connection pads and a second series of holes for use in aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component or components. The deformable film is aspirated through the second series of holes from the face opposite the external face of the base, so as to sheath the electronic component or components. The method may furthermore include, on top of the deformable film, a mineral deposition to provide for the hermetic sealing of the components and a conductive deposition to provide for the shielding. Such an application may find particular application to surface wave filters.