Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

Abstract: A haptic electromagnetic actuator for track pad is provided. The actuator includes an array of electromagnets with alternating South and North poles on a first end, each magnet comprising a metal core and an electrical wire around the metal core. The array of magnets is coupled to a base plate on a second end opposite to the first end. The actuator also includes an attraction plate at a distance from the first end of the array of the magnets such that the attraction plate moves toward the magnets when an electrical current flows through the electrical wire around the metal core and moves away from the magnets when the current becomes zero. The array of magnets is configured to form a uniform gap from the attraction plate.

Abstract: Examples of tooling fixtures and methods for manufacturing computing devices are described. According to some examples, a computer component may be shaped using successive steps of forging after deep drawing. In some examples, certain components may be assembled to form sub-assemblies of computer components and the sub-assembly may then be machined to drive closer tolerances. According to other examples, a work holding tool is described which may include a first plurality of individually movable pins for supporting a first surface of a work piece, the tool also having a second plurality of individually movable pins for applying a restraining force over a second opposite surface of the work piece to retain the work piece in position while maintaining it in its natural state.

Abstract: A haptic electromagnetic actuator for track pad is provided. The actuator includes an array of electromagnets with alternating South and North poles on a first end, each magnet comprising a metal core and an electrical wire around the metal core. The array of magnets is coupled to a base plate on a second end opposite to the first end. The actuator also includes an attraction plate at a distance from the first end of the array of the magnets such that the attraction plate moves toward the magnets when an electrical current flows through the electrical wire around the metal core and moves away from the magnets when the current becomes zero. The array of magnets is configured to form a uniform gap from the attraction plate.

Abstract: Embodiments of keyboards having variations of electrically connecting keys to an internal component of an electronic device are described. Some embodiments include positioning several rows of conductive layers below several rows of keys. The conductive layers may be configured to receive a signal indicating a key has been depressed. Also, the internal component may be configured to scan the conductive layers to determine whether a key or keys have been depressed. In some embodiments, the conductive layers lie outside a portion of the electronic device in which internal components are traditionally located. In some embodiments, a substrate may be integrally connected with the keyboard. The substrate may receive some internal components of the electronic device.

Abstract: Embodiments of keyboards having variations of electrically connecting keys to an internal component of an electronic device are described. Some embodiments include positioning several rows of conductive layers below several rows of keys. The conductive layers may be configured to receive a signal indicating a key has been depressed. Also, the internal component may be configured to scan the conductive layers to determine whether a key or keys have been depressed. In some embodiments, the conductive layers lie outside a portion of the electronic device in which internal components are traditionally located. In some embodiments, a substrate may be integrally connected with the keyboard. The substrate may receive some internal components of the electronic device.

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

Abstract: Examples of computing devices including a processor, memory, and a display device housed within the same enclosure are described. In examples, the display device, which may include a cover glass, may be attached to the enclosure using a multilayer adhesive member, the multilayer adhesive including a first adhesive layer and a second adhesive layer disposed on opposite sides of a foam layer. The first and/or second adhesive layers may include two or more layers of a pressure sensitive adhesive (PSA), which may be separated using one or more adhesive carrier films. In examples, the first and/or second adhesive layers may include a low tack (e.g. removable) PSA for adhering to surfaces of the display and enclosure and for facilitation removal and re-workability of the adhesive joint.

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

Abstract: Embodiments of keyboards having variations of electrically connecting keys to an internal component of an electronic device are described. Some embodiments include positioning several rows of conductive layers below several rows of keys. The conductive layers may be configured to receive a signal indicating a key has been depressed. Also, the internal component may be configured to scan the conductive layers to determine whether a key or keys have been depressed. In some embodiments, the conductive layers lie outside a portion of the electronic device in which internal components are traditionally located. In some embodiments, a substrate may be integrally connected with the keyboard. The substrate may receive some internal components of the electronic device.

Abstract: The described embodiments relate generally to liquid crystal displays (LCDs) and more particularly to thermal management of heat produced by an illumination source in an LCD module. High temperatures generated by the illumination source can cause color shifts in the LCD due to changes in any included LEDs and liquid crystals. One solution is to house the LCD module in a metal chassis and thermally couple the LED light bar to the metal chassis. Furthermore, the LCD module can be kept at a uniform temperature by transferring heat from a region near the LED light bar to a relatively cooler region of the LCD module. These approaches can minimize any alterations or shifts in color resulting from heat from the LED light bar.

Abstract: The three dimensional surface shape of one or more layers of a reflective object is determined by examining one or more captured images reflected from the reflective object. Curved surfaces reflect a distorted image altered by the surface shape. By analyzing one or more captured images of the distorted reflected images, the shape of the surface that caused the distortion is estimated. A captured distorted image is compared to a reference undistorted image having known geometric properties. A system to capture and process such images is assembled from components including an image capture assembly such as a digital camera to capture reflected images and a positioning assembly on which to orient the components with respect to each other. Multiple surface layers of the reflective object are separately estimated using polarizations, luminance levels, chroma values or combinations thereof contained in one or more captured images.

Abstract: A haptic electromagnetic actuator for track pad is provided. The actuator includes an array of electromagnets with alternating South and North poles on a first end, each magnet comprising a metal core and an electrical wire around the metal core. The array of magnets is coupled to a base plate on a second end opposite to the first end. The actuator also includes an attraction plate at a distance from the first end of the array of the magnets such that the attraction plate moves toward the magnets when an electrical current flows through the electrical wire around the metal core and moves away from the magnets when the current becomes zero. The array of magnets is configured to form a uniform gap from the attraction plate.

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a backlight assembly to a cover glass layer while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to the backlight assembly. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In another embodiment, a series of rigid plates can be bonded to the cover glass layer and attached to the backlight assembly. Point loads applied from the backlight assembly can be distributed over a larger area due to the resilience of the rigid plates.

Abstract: Examples of tooling fixtures and methods for manufacturing computing devices are described. According to some examples, a computer component may be shaped using successive steps of forging after deep drawing. In some examples, certain components may be assembled to form sub-assemblies of computer components and the sub-assembly may then be machined to drive closer tolerances. According to other examples, a work holding tool is described which may include a first plurality of individually movable pins for supporting a first surface of a work piece, the tool also having a second plurality of individually movable pins for applying a restraining force over a second opposite surface of the work piece to retain the work piece in position while maintaining it in its natural state.

Abstract: The described embodiments relate generally to liquid crystal displays (LCDs) and more particularly to thermal management of heat produced by an illumination source in an LCD module. High temperatures generated by the illumination source can cause color shifts in the LCD due to changes in any included LEDs and liquid crystals. One solution is to house the LCD module in a metal chassis and thermally couple the LED light bar to the metal chassis. Furthermore, the LCD module can be kept at a uniform temperature by transferring heat from a region near the LED light bar to a relatively cooler region of the LCD module. These approaches can minimize any alterations or shifts in color resulting from heat from the LED light bar.

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a backlight assembly to a cover glass layer while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to the backlight assembly. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In another embodiment, a series of rigid plates can be bonded to the cover glass layer and attached to the backlight assembly. Point loads applied from the backlight assembly can be distributed over a larger area due to the resilience of the rigid plates.