Abstract: This application relates primarily to various apparatus and method for securing and protecting a camera module within a device housing. The securing and protecting elements are configured to take up minimal space within the device housing so that available space for the camera module is maximized. In some embodiments the securing elements can also include grounding features.

Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

Abstract: Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: Devices, methods and graphical user interfaces for manipulating user interfaces based on fingerprint sensor inputs are provided. While a display of an electronic device with a fingerprint sensor displays a first user interface, the device may detect movement of a fingerprint on the fingerprint sensor. In accordance with a determination that the movement of the fingerprint is in a first direction, the device allows navigating through the first user interface, and in accordance with a determination that the movement of the fingerprint is in a second direction different from the first direction, the device allows displaying a second user interface different from the first user interface on the display.

Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

Abstract: This application relates primarily to various apparatus and method for securing and protecting a camera module within a device housing. The securing and protecting elements are configured to take up minimal space within the device housing so that available space for the camera module is maximized. In some embodiments the securing elements can also include grounding features.

Abstract: A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device.

Abstract: This is directed to a dome switch that includes a capacitive sensor. A dome switch can include a dome operative to deform to provide tactile feedback to a user. To provide an electrical instruction to the device, the region underneath the dome can define a free space separating conductive regions forming a capacitor. For example, a tip of the dome, a button placed between the dome and a circuit board, or a user's finger can form a first conductor of a capacitor, and a support structure for the dome can include a terminal forming a second conductor completing the capacitor. When the dome deflects, the distance between the conductors can change and provide a measurable capacitance variation, which the device can detect.

Abstract: Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.

Abstract: A control mechanism for an electronic device comprises a cover glass having an aperture defined therein. The aperture extends from an interior to an exterior of the device. A control member is positioned within the aperture, coupled to an actuator. The control member comprises a ceramic insert having a contact surface exposed to the exterior of the housing, operable to actuate the actuator in response to a force on the contact surface. A bearing member is molded about the insert. The bearing member has a hardness less than that of the ceramic insert, and less than that of the cover glass.

Abstract: Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: This is directed to a dome switch that includes a capacitive sensor. A dome switch can include a dome operative to deform to provide tactile feedback to a user. To provide an electrical instruction to the device, the region underneath the dome can define a free space separating conductive regions forming a capacitor. For example, a tip of the dome, a button placed between the dome and a circuit board, or a user's finger can form a first conductor of a capacitor, and a support structure for the dome can include a terminal forming a second conductor completing the capacitor. When the dome deflects, the distance between the conductors can change and provide a measurable capacitance variation, which the device can detect. To protect the dome switch from damage due to contaminants, the terminal can be integrated within a volume of the circuit board such that it is not exposed to the environment of the dome switch. In one implementation, the terminal may not be exposed to air.