Abstract: Various techniques are provided for reducing noise in captured image frames. In one example, a method includes determining row values for image frames comprising scene information and noise information. The method also includes performing first spectral transforms in a first domain on corresponding subsets of the row values to determine first spectral coefficients. The method also includes performing second spectral transforms in a second domain on corresponding subsets of the first spectral coefficients to determine second spectral coefficients. The method also includes selectively adjusting the second spectral coefficients. The method also includes determining row correction terms based on the adjusted second spectral coefficients to reduce the noise information of the image frames. Additional methods and systems are also provided.

Abstract: Modular infrared imaging systems and methods disclosed herein, in accordance with one or more embodiments, provide for capturing an infrared image, sensing a mode of operation, processing the captured infrared image according to the sensed mode of operation, generating a processed infrared image based on the sensed mode of operation, and displaying the processed infrared image.

Abstract: A shutter assembly may be provided for an infrared imaging module to selectively block external infrared radiation from reaching infrared sensors of the infrared imaging module. For example, the shutter assembly may comprise a paddle situated external to an optical element (e.g., lens) and adapted to be selectively moved by an actuator to substantially block external infrared radiation from entering the optical element. The shutter assembly may be stacked relative to a housing of the infrared imaging module without excessively increasing the overall profile of the infrared imaging module. A substantially reflective low emissivity interior surface may be provided on the paddle to reflect infrared radiation originating from an infrared sensor assembly of the infrared imaging module back to the infrared sensor assembly.

Abstract: A partially attenuating shutter may be used to identify and reduce fixed pattern noise (FPN) associated with imaging devices. In one example, a system includes an image capture component configured to capture images in response to incident radiation from a scene along an optical path. The system includes a shutter configured to attenuate a first portion of the incident radiation and permit a second portion of the incident radiation to pass. The system also includes an actuator configured to translate the shutter between an open position out of the optical path, and a closed position in the optical path between the scene and the image capture component. The system also includes a processor configured to determine a plurality of FPN correction terms using images captured by the image capture component while the shutter is in the open and closed positions. Related systems and methods are also provided.

Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

Abstract: Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, illumination modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

Abstract: Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Abstract: Various embodiments of the present disclosure may include one or more object detection devices. The object detection devices may include at least one distance sensor such as a radar, lidar, or other distance sensor and at least one thermal sensor such as a thermal imaging device. One or more object detection devices may be mounted to vehicles to provide enhanced representations of an area around the vehicles.

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

Abstract: Various embodiments of the present disclosure may include an imaging system that includes a plurality of uncooled cameras configured to detect the presence of gas within a scene imaged. The plurality of cameras may include at least one broadband camera and at least one narrowband camera. The narrowband camera may include a filter or image data from the narrowband camera may be filtered to the band desired. The images captured by the broadband and narrowband cameras may be processed and/or analyzed to determine the presence of gas within the scene. An image may be generated incorporating the image data of the broadband and narrowband cameras and the presence of gas may be indicated within the image.

Abstract: Flight based infrared imaging systems and related techniques, and in particular UAS based thermal imaging systems, are provided to improve the monitoring capabilities of such systems over conventional infrared monitoring systems. An infrared imaging system is configured to compensate for various environmental effects (e.g., position and/or strength of the sun, atmospheric effects) to provide high resolution and accuracy radiometric measurements of targets imaged by the infrared imaging system. An infrared imaging system is alternatively configured to monitor and determine environmental conditions, modify data received from infrared imaging systems and other systems, modify flight paths and other commands, and/or create a representation of the environment.

Abstract: Various techniques are provided for using one or more shielded (e.g., blinded, blocked, and/or obscured) infrared sensors of a thermal imaging device. In one example, a method includes capturing a signal from a shielded infrared sensor that is substantially blocked from receiving infrared radiation from a scene. The method also includes capturing a signal from an unshielded infrared sensor configured to receive the infrared radiation from the scene. The method also includes determining an average thermographic offset reference for the shielded and unshielded infrared sensors based on the captured signal of the shielded infrared sensor. The method also includes determining an absolute radiometric value for the scene based on the average thermographic offset reference and the captured signal of the unshielded infrared sensor.

Abstract: Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.

Abstract: Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Triple fusion processing, including selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Abstract: Various embodiments of the present disclosure may include an imaging system that allows for the transfer of high dynamic range (HDR) radiometric thermal images over a low bitrate interface. The image system may capture HDR images and output the HDR images over a communications interface to be processed. The HDR images may be converted to low dynamic range (LDR) images by a transfer function in order to be sent over the low bitrate interface. An inverse transfer function may also be sent along with the LDR image. Once the LDR image has been sent over the low bitrate interface, the LDR image may be converted to a reconstructed image using the inverse transfer function.

Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

Abstract: Techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor occupants in an interior compartment of a vehicle. For example, a vehicle-mounted system may include one or more infrared imaging modules, a processor, a memory, alarm sirens, and a communication module. The vehicle-mounted system may be mounted on, installed in, or otherwise integrated into a vehicle with an interior compartment. The infrared imaging modules may be configured to capture thermal images of desired portions of the interior compartments. Various thermal image processing and analytics may be performed on the captured thermal images to determine the presence and various attributes of one or more occupants. Based on the determination of the presence and various attributes, occupant detection information or control signals may be generated. Occupant detection information may be used to perform various monitoring operations, and control signals may adjust various vehicle components.

Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.