Abstract: A high frequency data network access system leverages commodity WiFi chipsets and specifically multi spatial stream (e.g., 802.11 ac) chipsets in combination with electrically steered patch array antenna systems at the subscriber nodes. In addition, for thermal control, the high frequency components are mounted to a main body that includes a heat sink and a chimney. These components are also separated from components operating at baseband to avoid interference.

Abstract: A high frequency data network access system leverages commodity WiFi chipsets and specifically multi spatial stream (e.g., 802.11 ac) chipsets in combination with electrically steered patch array antenna systems at the subscriber nodes. In addition, for thermal control, the high frequency components are mounted to a main body that includes a heat sink and a chimney. These components are also separated from components operating at baseband to avoid interference.

Abstract: A high frequency data network access system leverages commodity WiFi chipsets and specifically multi spatial stream (e.g., 802.11 ac) chipsets in combination with electrically steered patch array antenna systems at the subscriber nodes. In addition, for thermal control, the high frequency components are mounted to a main body that includes a heat sink and a chimney. These components are also separated from components operating at baseband to avoid interference.

Abstract: An electronic device is disclosed that includes a band, a functional layer disposed over the band, neutral mechanical surface adjusting layers disposed over a portion of the functional layer, and encapsulating layers disposed over the neutral mechanical surface adjusting layers. The band includes a bistable structure having an extended conformation and a curved conformation. The functional layer includes a device island and a stretchable interconnect coupled to the device island at a junction region. At least one of the neutral mechanical surface adjusting layers can have a property that is spatially inhomogeneous relative to a location in the electronic device. The device island and stretchable interconnect are disposed about the band such that the device island and the junction region are disposed at areas of minimal strain of the electronic device in the curved conformation of the bistable structure.