Abstract: A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

Abstract: A robotic object handling system comprises a robot arm, an image sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the image sensor to generate sensor data of the object, determine at least one of (i) a rotational error of the object or (ii) a positional error of the object based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error, and cause the robot arm to place the object at the first station without at least one of the rotational error or the positional error.

Abstract: A robotic object handling system comprises a robot arm, a non-contact sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the robot arm to position the object within a detection area of the non-contact sensor, cause the non-contact sensor to generate sensor data of the object, determine at least one of a rotational error of the object relative to a target orientation or a positional error of the object relative to a target position based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error from the object, and cause the robot arm to place the object at the first station, wherein the placed object lacks at least one of the rotational error or the positional error.

Abstract: An autoteach system includes an autoteach pin that is a scannable feature having a fixed position within the autoteach system. The autoteach pin enables an autoteach operation of a robot arm of the wafer processing system. The autoteach operation is an operation to automatically teach the fixed position within the autoteach system to the robot arm of the wafer processing system. The autoteach pin includes a first portion including a cylindrical sidewall. The robot arm is to use the first portion to locate the fixed position within the autoteach system. The autoteach portion further includes a second portion including planar sidewalls that are configured to enable calibration of robot arm error.

Abstract: An autoteach enclosure system includes a plurality of surfaces that at least partially enclose an interior volume of the autoteach enclosure system. The autoteach enclosure system further includes an autoteach pin at least partially disposed within the interior volume. The autoteach pin is a scannable feature having a fixed position within the autoteach enclosure system. The autoteach enclosure system further includes a front interface coupled to one or more of the plurality of surfaces to interface the autoteach enclosure system with a substantially vertical portion of a load port of a wafer processing system. The autoteach pin enables an autoteach operation of a robot arm of the wafer processing system. The autoteach operation is an operation to automatically teach the fixed position within the autoteach enclosure system to the robot arm of the wafer processing system.

Abstract: A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

Abstract: An autoteach enclosure system includes a plurality of surfaces that at least partially enclose an interior volume of the autoteach enclosure system. The autoteach enclosure system further includes an autoteach pin at least partially disposed within the interior volume. The autoteach pin is a scannable feature having a fixed position within the autoteach enclosure system. The autoteach enclosure system further includes a front interface coupled to one or more of the plurality of surfaces to interface the autoteach enclosure system with a substantially vertical portion of a load port of a wafer processing system. The autoteach pin enables an autoteach operation of a robot arm of the wafer processing system. The autoteach operation is an operation to automatically teach the fixed position within the autoteach enclosure system to the robot arm of the wafer processing system.

Abstract: A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

Abstract: A robotic object handling system comprises a robot arm, a non-contact sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the robot arm to position the object within a detection area of the non-contact sensor, cause the non-contact sensor to generate sensor data of the object, determine at least one of a rotational error of the object relative to a target orientation or a positional error of the object relative to a target position based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error from the object, and cause the robot arm to place the object at the first station, wherein the placed object lacks at least one of the rotational error or the positional error.

Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

Abstract: A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.