Patents by Inventor Nicholas T. Bronn
Nicholas T. Bronn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11900217Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: GrantFiled: November 15, 2022Date of Patent: February 13, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Publication number: 20230252332Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: ApplicationFiled: November 15, 2022Publication date: August 10, 2023Applicant: International Business Machines CorporationInventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Patent number: 11551125Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: GrantFiled: February 21, 2019Date of Patent: January 10, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Patent number: 11537929Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: GrantFiled: April 16, 2021Date of Patent: December 27, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Patent number: 11178771Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: GrantFiled: July 28, 2020Date of Patent: November 16, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
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Publication number: 20210326740Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: ApplicationFiled: April 16, 2021Publication date: October 21, 2021Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Patent number: 11006527Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: GrantFiled: July 15, 2019Date of Patent: May 11, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
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Patent number: 11005574Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.Type: GrantFiled: June 27, 2019Date of Patent: May 11, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese, Jason S. Orcutt
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Patent number: 10984335Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: GrantFiled: June 17, 2019Date of Patent: April 20, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Patent number: 10891251Abstract: In an embodiment, a device includes a first high density interface in a first dilution fridge stage configured to receive a first set of transmission lines. In an embodiment, a device includes a second high density interface in a second dilution fridge stage configured to receive a second set of transmission lines. In an embodiment, a device includes a printed circuit board configured to transfer microwave signals between a first dilution fridge stage and the second dilution fridge stage, the first high density interface and the second high density interface coupled to the printed circuit board.Type: GrantFiled: November 9, 2018Date of Patent: January 12, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore Bernardo Olivadese, Patryk Gumann, Nicholas T. Bronn
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Publication number: 20200412457Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.Type: ApplicationFiled: June 27, 2019Publication date: December 31, 2020Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese, Jason S. Orcutt
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Publication number: 20200394546Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.Type: ApplicationFiled: June 17, 2019Publication date: December 17, 2020Inventors: Nicholas T. Bronn, Daniela F. Bogorin, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Publication number: 20200359501Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: ApplicationFiled: July 28, 2020Publication date: November 12, 2020Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
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Patent number: 10813219Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: GrantFiled: July 15, 2019Date of Patent: October 20, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
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Publication number: 20200272927Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.Type: ApplicationFiled: February 21, 2019Publication date: August 27, 2020Inventors: Nicholas T. Bronn, Patryk Gumann, Sean Hart, Salvatore B. Olivadese
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Patent number: 10692831Abstract: According to an embodiment of the present invention, a method of producing a quantum computer chip includes performing a frequency measurement on a qubit chip bonded to a test interposer chip for qubits on the qubit chip at an operating temperature of the qubit chip. The method further includes pulling the qubit chip apart from the test interposer chip after performing the frequency measurement, and modifying a frequency of a subset of qubits after pulling the qubit chip apart from the test interposer chip. The method further includes bonding the qubit chip to a device interposer chip after modifying the frequency of the subset of qubits.Type: GrantFiled: February 21, 2019Date of Patent: June 23, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicholas T. Bronn, Jared B. Hertzberg, Eric P. Lewandowski, Jae-woong Nah
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Publication number: 20200151133Abstract: In an embodiment, a device includes a first high density interface in a first dilution fridge stage configured to receive a first set of transmission lines. In an embodiment, a device includes a second high density interface in a second dilution fridge stage configured to receive a second set of transmission lines. In an embodiment, a device includes a printed circuit board configured to transfer microwave signals between a first dilution fridge stage and the second dilution fridge stage, the first high density interface and the second high density interface coupled to the printed circuit board.Type: ApplicationFiled: November 9, 2018Publication date: May 14, 2020Applicant: International Business Machines CorporationInventors: Salvatore Bernardo Olivadese, Patryk Gumann, Nicholas T. Bronn
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Patent number: 10644217Abstract: A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded. The optically transmissive path may provide optical access to the qubit on the first chip.Type: GrantFiled: January 18, 2019Date of Patent: May 5, 2020Assignee: International Business Machines CorporationInventors: Sami Rosenblatt, Jason S. Orcutt, Martin O. Sandberg, Markus Brink, Vivekananda P. Adiga, Nicholas T. Bronn
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Publication number: 20190343002Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: ApplicationFiled: July 15, 2019Publication date: November 7, 2019Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
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Publication number: 20190343003Abstract: An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.Type: ApplicationFiled: July 15, 2019Publication date: November 7, 2019Inventors: Baleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese