Patents by Inventor Nick Ray Linebarger, JR.
Nick Ray Linebarger, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11946142Abstract: A plasma processing chamber for depositing a film on an underside surface of a wafer, includes showerhead pedestal. The showerhead pedestal includes a first zone and a second zone. An upper separator fin is disposed over a top surface of the showerhead pedestal and a lower separator fin is disposed under the top surface of the showerhead pedestal and aligned with the upper separator fin. The first zone is configured for depositing a first film to the underside surface of the wafer and the second zone is configured for depositing a second film to the underside surface of the wafer. In another embodiment, a top surface of the showerhead pedestal may be configured to receive a masking plate instead of the upper separator fin. The masking plate is configured with a first area that has openings and a second area that is masked. The first areas is used to provide the process gas to a portion of the underside surface of the wafer for depositing a film.Type: GrantFiled: August 6, 2020Date of Patent: April 2, 2024Assignee: Lam Research CorporationInventors: Fayaz A. Shaikh, Adriana Vintila, Matthew Mudrow, Nick Ray Linebarger, Jr., Xin Yin, James F. Lee, Brian Joseph Williams
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Publication number: 20230352279Abstract: Multi-station processing tools with station-varying support features for backside processing are provided. The support features in a first station may hold a wafer at a first set of points during backside deposition, blocking backside deposition, etching, or other processing at those points. The support features in a second station may hold a wafer at a second set of points that don’t overlap with the first set of points.Type: ApplicationFiled: June 21, 2021Publication date: November 2, 2023Inventors: Nick Ray Linebarger, JR., Fayaz A. Shaikh, Arul N. Dhas
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Publication number: 20230250524Abstract: In some examples, techniques for enhancing a corrosion resistance of a component are provided. In some examples, the component includes a granular metallic material. A friction stir processing operation is performed on the material. The friction stir processing operation comprises passing a rotating head of a friction stir welding tool through a surface thickness of the granular metallic material in a treatment path.Type: ApplicationFiled: June 30, 2021Publication date: August 10, 2023Inventors: Keith Joseph Martin, Nick Ray Linebarger, JR.
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Publication number: 20230238223Abstract: Carrier rings with radially-varied plasma impedance are provided herein. In some embodiments, a carrier ring may include an outer ring that holds a removable inner ring. The outer ring may be formed of a dielectric material such as ceramic. The inner ring may be formed of a metal such as aluminum to provide a desired impedance. In some other embodiments, a carrier ring is formed from a single piece with radially-varying impedances.Type: ApplicationFiled: June 21, 2021Publication date: July 27, 2023Inventors: Nick Ray Linebarger, JR., Fayaz A. Shaikh, Kang Il Lee
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Publication number: 20230220549Abstract: A semiconductor substrate processing apparatus includes a vacuum chamber having a processing zone in which a semiconductor substrate may be processed, a process gas source in fluid communication with the vacuum chamber for supplying a process gas into the vacuum chamber, a showerhead module through which process gas from the process gas source is supplied to the processing zone of the vacuum chamber, and a substrate pedestal module. The substrate pedestal module includes a platen made of ceramic material having an upper surface configured to support a semiconductor substrate thereon during processing, a stem made of ceramic material having an upper stem flange that supports the platen, and a backside gas tube made of ceramic material that is located in an interior of the stem.Type: ApplicationFiled: March 17, 2023Publication date: July 13, 2023Inventors: Troy Alan Gomm, Nick Ray Linebarger, JR.
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Patent number: 11634817Abstract: In various examples, the disclosed subject matter includes a substrate pedestal that includes a platen formed from a ceramic material and having an upper surface to support a substrate during processing. A stem, formed from a ceramic material, has an upper-stem flange upon which the platen is mechanically coupled. The stem has an interior portion. A backside gas-delivery tube, formed from a ceramic material, is located in the interior portion of the stem. The backside gas-delivery tube includes an upper gas-tube flange that is located between a lower surface of the platen and an upper surface of the upper-stem flange. The backside gas-delivery tube is in fluid communication with at least one backside-gas passage of the platen and is arranged to supply a backside gas to a region below a lower surface of the substrate during processing. Other examples of apparatuses and methods of making and using the apparatuses are included.Type: GrantFiled: April 30, 2020Date of Patent: April 25, 2023Assignee: Lam Research CorporationInventors: Troy Alan Gomm, Nick Ray Linebarger, Jr.
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Publication number: 20230052089Abstract: A reactor system comprises a process chamber, a gas inlet, and a dispenser. The dispenser is coupled to the gas inlet. The dispenser controls a gas flow from a vial to the gas inlet. The vial includes a coating material that, when released inside the process chamber under operating conditions of the reaction system, coats an inner wall of the process chamber.Type: ApplicationFiled: February 4, 2021Publication date: February 16, 2023Inventors: Jeffrey Womack, Karl Frederick Leeser, Curtis W. Bailey, Keith Joseph Martin, Rigel Martin Bruening, Nick Ray Linebarger, JR.
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Publication number: 20230052543Abstract: An apparatus to decouple RF signals from input signal conductors of a process chamber includes at least a first switch to decouple an energy storage element from an active element within a process station. In particular embodiments, while the first switch is in an opened position, a second switch located between a current generator and energy storage element is closed, thereby permitting the current generator to charge the energy storage element. In response to the energy storage element attaining a predetermined voltage, the first switch may be closed, and the second switch may be opened, thereby permitting current to be discharged from the energy storage element to the active element. In certain embodiments, the first and second switches are not permitted to simultaneously operate in a closed position, thereby preventing RF from being coupled from the process station to the current generator.Type: ApplicationFiled: February 9, 2021Publication date: February 16, 2023Inventors: Nick Ray Linebarger, Jr., Mohan Thilagaraj
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Publication number: 20220415624Abstract: Various kinematic mounts used to mount a carrier ring carrying a substrate to a pedestal within a processing chamber. Each of the various kinematic mounts provide a smooth gliding action during mounting, reduce the generation of unwanted particles and prevent free-fall of the carrier ring to the pedestal.Type: ApplicationFiled: November 18, 2020Publication date: December 29, 2022Inventors: Nick Ray LINEBARGER, Jr., Seshu NIMMALA, Eric MADSEN, Rigel Martin BRUENING
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Publication number: 20220364858Abstract: A substrate processing system includes a laser triangulation sensor configured to transmit and receive light through a window of an exterior wall of a substrate processing chamber. A controller is configured to: position the laser triangulation sensor such that the laser triangulation sensor transmits light onto a measurement feature arranged between a first surface of a substrate support and a second surface of a gas distribution device, where the second surface faces the first surface; and while the laser triangulation sensor transmits light onto the measurement feature, determine a first distance between the first and second surfaces based on a difference between: a second distance between the laser triangulation sensor and the first surface measured using the laser triangulation sensor; and a third distance between the laser triangulation sensor and the second surface measured using the laser triangulation sensor.Type: ApplicationFiled: July 29, 2022Publication date: November 17, 2022Inventors: Mark E. EMERSON, Nick Ray LINEBARGER, JR.
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Publication number: 20220298632Abstract: A plasma processing chamber for depositing a film on an underside surface of a wafer, includes showerhead pedestal. The showerhead pedestal includes a first zone and a second zone. An upper separator fin is disposed over a top surface of the showerhead pedestal and a lower separator fin is disposed under the top surface of the showerhead pedestal and aligned with the upper separator fin. The first zone is configured for depositing a first film to the underside surface of the wafer and the second zone is configured for depositing a second film to the underside surface of the wafer. In another embodiment, a top surface of the showerhead pedestal may be configured to receive a masking plate instead of the upper separator fin. The masking plate is configured with a first area that has openings and a second area that is masked. The first areas is used to provide the process gas to a portion of the underside surface of the wafer for depositing a film.Type: ApplicationFiled: August 6, 2020Publication date: September 22, 2022Inventors: Fayaz A. Shaikh, Adriana Vintila, Matthew Mudrow, Nick Ray Linebarger, Jr., Xin Yin, James F. Lee, Brian Joseph Williams
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Patent number: 11408734Abstract: A substrate processing system includes a laser triangulation sensor configured to transmit and receive light through a window of an exterior wall of a substrate processing chamber. A controller is configured to: position the laser triangulation sensor such that the laser triangulation sensor transmits light onto a measurement feature arranged between a first surface of a substrate support and a second surface of a gas distribution device, where the second surface faces the first surface; and while the laser triangulation sensor transmits light onto the measurement feature, determine a first distance between the first and second surfaces based on a difference between: a second distance between the laser triangulation sensor and the first surface measured using the laser triangulation sensor; and a third distance between the laser triangulation sensor and the second surface measured using the laser triangulation sensor.Type: GrantFiled: January 3, 2019Date of Patent: August 9, 2022Assignee: LAM RESEARCH CORPORATIONInventors: Mark E. Emerson, Nick Ray Linebarger, Jr.
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Publication number: 20220189817Abstract: In an example, a showerhead pedestal assembly for a substrate processing chamber is provided. The showerhead pedestal assembly includes a faceplate. A platen is disposed within the faceplate and includes a heater element extending through at least one groove in the faceplate. The at least one groove is profiled to accept at least one portion of the heater element. A periphery of the platen is joined to an interior surface of the faceplate by a friction stir welded joint.Type: ApplicationFiled: March 12, 2020Publication date: June 16, 2022Inventors: Nick Ray Linebarger, Jr., Prahalad Narasinghdas Agarwal, Ravikumar Sadashiv Patil, Damodar Rajararn Shanbhag
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Patent number: 10903070Abstract: Methods for reducing warpage of bowed semiconductor substrates, particularly saddle-shaped bowed semiconductor substrates, are provided herein. Methods involve depositing a bow compensation layer by plasma enhanced chemical vapor deposition on the backside of the bowed semiconductor substrate by region, such as by quadrants, to form a compressive film on a tensile substrate and a tensile film on a compressive substrate. Methods involve flowing different gases from different nozzles on a surface of a showerhead to deliver various gases by region in a one-step operation or flowing gases in a multi-step process by shielding regions of the showerhead during delivery of gases to deliver specific gases from non-shielded regions onto regions of the bowed semiconductor substrate by alternating between rotating the semiconductor substrate and flowing gases to the backside of the bowed semiconductor substrate.Type: GrantFiled: September 28, 2018Date of Patent: January 26, 2021Assignee: Lam Research CorporationInventors: Chanyuan Liu, Fayaz A. Shaikh, Niraj Rana, Nick Ray Linebarger, Jr.
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Patent number: 10872747Abstract: A showerhead for a plasma chamber comprises a resistive heater configured to receive power to heat the showerhead of the plasma chamber, and a resistive element thermally bonded to the showerhead of the plasma chamber. The resistive element changes resistance in response to a change in temperature of the showerhead. The resistive element is encapsulated in an insulating material to electrically insulate the resistive element from the showerhead. The insulating material is a good conductor of heat. The power to the resistive heater is received based on the resistance of the resistive element.Type: GrantFiled: August 8, 2018Date of Patent: December 22, 2020Assignee: LAM RESEARCH CORPORATIONInventors: Nick Ray Linebarger, Jr., Curtis W. Bailey, Easwar Srinivasan, Devon Pelkey
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Publication number: 20200325578Abstract: In various examples, the disclosed subject matter includes a substrate pedestal that includes a platen formed from a ceramic material and having an upper surface to support a substrate during processing. A stem, formed from a ceramic material, has an upper-stem flange upon which the platen is mechanically coupled. The stem has an interior portion. A backside gas-delivery tube, formed from a ceramic material, is located in the interior portion of the stem. The backside gas-delivery tube includes an upper gas-tube flange that is located between a lower surface of the platen and an upper surface of the upper-stem flange. The backside gas-delivery tube is in fluid communication with at least one backside-gas passage of the platen and is arranged to supply a backside gas to a region below a lower surface of the substrate during processing. Other examples of apparatuses and methods of making and using the apparatuses are included.Type: ApplicationFiled: April 30, 2020Publication date: October 15, 2020Inventors: Troy Alan Gomm, Nick Ray Linebarger, JR.
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Publication number: 20200217657Abstract: A substrate processing system includes a laser triangulation sensor configured to transmit and receive light through a window of an exterior wall of a substrate processing chamber. A controller is configured to: position the laser triangulation sensor such that the laser triangulation sensor transmits light onto a measurement feature arranged between a first surface of a substrate support and a second surface of a gas distribution device, where the second surface faces the first surface; and while the laser triangulation sensor transmits light onto the measurement feature, determine a first distance between the first and second surfaces based on a difference between: a second distance between the laser triangulation sensor and the first surface measured using the laser triangulation sensor; and a third distance between the laser triangulation sensor and the second surface measured using the laser triangulation sensor.Type: ApplicationFiled: January 3, 2019Publication date: July 9, 2020Inventors: Mark E. EMERSON, Nick Ray LINEBARGER, JR.
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Patent number: 10655225Abstract: A semiconductor substrate processing apparatus includes a vacuum chamber having a processing zone in which a semiconductor substrate may be processed, a process gas source in fluid communication with the vacuum chamber for supplying a process gas into the vacuum chamber, a showerhead module through which process gas from the process gas source is supplied to the processing zone of the vacuum chamber, and a substrate pedestal module. The substrate pedestal module includes a platen made of ceramic material having an upper surface configured to support a semiconductor substrate thereon during processing, a stem made of ceramic material having an upper stem flange that supports the platen, and a backside gas tube made of ceramic material that is located in an interior of the stem.Type: GrantFiled: July 28, 2017Date of Patent: May 19, 2020Assignee: Lam Research CorporationInventors: Troy Alan Gomm, Nick Ray Linebarger, Jr.
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Publication number: 20200105523Abstract: Methods for reducing warpage of bowed semiconductor substrates, particularly saddle-shaped bowed semiconductor substrates, are provided herein. Methods involve depositing a bow compensation layer by plasma enhanced chemical vapor deposition on the backside of the bowed semiconductor substrate by region, such as by quadrants, to form a compressive film on a tensile substrate and a tensile film on a compressive substrate. Methods involve flowing different gases from different nozzles on a surface of a showerhead to deliver various gases by region in a one-step operation or flowing gases in a multi-step process by shielding regions of the showerhead during delivery of gases to deliver specific gases from non-shielded regions onto regions of the bowed semiconductor substrate by alternating between rotating the semiconductor substrate and flowing gases to the backside of the bowed semiconductor substrate.Type: ApplicationFiled: September 28, 2018Publication date: April 2, 2020Inventors: Chanyuan Liu, Fayaz A. Shaikh, Niraj Rana, Nick Ray Linebarger, JR.
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Publication number: 20200051789Abstract: A showerhead for a plasma chamber comprises a resistive heater configured to receive power to heat the showerhead of the plasma chamber, and a resistive element thermally bonded to the showerhead of the plasma chamber. The resistive element changes resistance in response to a change in temperature of the showerhead. The resistive element is encapsulated in an insulating material to electrically insulate the resistive element from the showerhead. The insulating material is a good conductor of heat. The power to the resistive heater is received based on the resistance of the resistive element.Type: ApplicationFiled: August 8, 2018Publication date: February 13, 2020Inventors: Nick Ray LINEBARGER, JR., Curtis W. BAILEY, Easwar SRINIVASAN, Devon PELKEY