Abstract: A deposition system includes a process tube aligned vertically with a substrate holder therein positioned horizontally and perpendicular to a vertical tube axis. Through a bottom or top flange a first gas line connector is for injecting a first gas and a reactant gas connector is for injecting at a reactant gas. A feed line is coupled between the reactant gas connector and a reactant gas distributor having apertures for flowing the reactant gas towards a substrate. A vapor generating showerhead includes a gas distribution plate having flow distributing apertures on a precursor boat having gas inlets fluidically coupled to precursor holder trenches that hold a vapor generating material. The gas inlets have a flow path for flowing the first gas over the vapor generating material for generating a reactant vapor that flows out of the flow distributing aperture toward the substrate.

Abstract: A system and a method for depositing films of a multi-component material by MOCVD utilizes a flash evaporator for providing vaporized reactant material at a high flow rate. The high flow rate enables film deposition to occur at a higher deposition rate that what is possible with conventional MOCVD systems. The system may be a single-chamber system or part of a multiple-chamber system. The multiple-chamber system allows multi-layer structures to be deposited and/or processed in situ.

Abstract: Low dielectric constant porous materials with improved elastic modulus and hardness. The process of making such porous materials involves providing a porous dielectric material and plasma curing the porous dielectric material to produce a plasma cured porous dielectric material. Plasma curing of the porous dielectric material yields a material with improved modulus and hardness. The improvement in elastic modulus is typically greater than or about 50%, more typically greater than or about 100%, and more typically greater than or about 200%. The improvement in hardness is typically greater than or about 50%. The plasma cured porous dielectric material can optionally be post-plasma treated. The post-plasma treatment of the plasma cured porous dielectric material reduces the dielectric constant of the material while maintaining an improved elastic modulus and hardness as compared to the plasma cured porous dielectric material.

Abstract: Low dielectric constant porous materials with improved elastic modulus and film hardness. The process of making such porous materials involves providing a porous dielectric material and plasma curing the porous dielectric material to produce a plasma cured porous dielectric material. Plasma curing of the porous dielectric material yields a material with improved modulus and hardness, but with a higher dielectric constant. The improvement in elastic modulus is typically greater than about 100%, and more typically greater than about 200%. The improvement in film hardness is typically greater than about 50%. The porous dielectric material is plasma cured for a time between about 15 and about 120 seconds at a temperature less than about 350° C. The plasma cured porous dielectric material can optionally be post-plasma treated.