Abstract: A composition contains an organopolysiloxane having the following average chemical structure: X3SiO—SiR2—R?—(R2SiO)x—R2Si—[Rb—(R2SiO)y—R2Si—Rb?—(R2SiO)z—R2Si]m—R?—R2SiO—SiX3; where X is —OSiR2—R?—R2SiO—R2Si—R?-A; R is an alkyl group having from 2 to 6 carbons and aryl groups; R?, R?, Rb and Rb? are divalent hydrocarbon groups comprising a chain of 2 to 6 methylene units; A is acrylate, methacrylate or trialkoxysilyl; provided that, on average, 60 to 90 mole-percent of the A groups are acrylate and methacrylate; Subscript m has an average value in a range of zero to 10; Subscripts x, y and z each has an average value in a range of zero to 1200; and provided that the average values of m, x, y and z are such that the sum of the average values for x, y and z is in a range of 300-1200 and the molar ratio of methylene units to siloxane units is less than 0.15.

Abstract: A curable organopolysiloxane composition contains: (A) 100 mass parts of a functional organopolysiloxane component having at least one radical curable group selected from an acrylate group and a methacrylate group and optionally one or more alkoxysilyl groups; (B) 0 to 100 mass parts of a condensation curable organo polysiloxane component; (C) one to 10 mass parts of tetraalkoxysilanes or a hydrolyate of the tetraalkoxysilanes; and optionally one or more of (D) a radical initiator, (E) a condensation catalyst, (F) fillers, (G) adhesion promoters, (H) pigments, (I) a non-reactive organopolysiloxane, and (J) inhibitors.

Abstract: A composition contains an organopolysiloxane having the following average chemical structure: X3SiO—SiR2—R?—(R2SiO)x—R2Si—[Rb—(R2SiO)y—R2Si—Rb?—(R2SiO)z—R2Si]m—R?—R2SiO—SiX3; where X is —OSiR2—R?—R2SiO—R2Si—R?-A; R is an alkyl group having from 2 to 6 carbons and aryl groups; R?, R?, Rb and Rb? are divalent hydrocarbon groups comprising a chain of 2 to 6 methylene units; A is acrylate, methacrylate or trialkoxysilyl; provided that, on average, 60 to 90 mole-percent of the A groups are acrylate and methacrylate; Subscript m has an average value in a range of zero to 10; Subscripts x, y and z each has an average value in a range of zero to 1200; and provided that the average values of m, x, y and z are such that the sum of the average values for x, y and z is in a range of 300-1200 and the molar ratio of methylene units to siloxane units is less than 0.15.

Abstract: Two-part condensation curable silyl-modified polymer (SMP) based sealant compositions, in particular two-part condensation curable SMP based translucent sealant compositions containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt.

Abstract: A one-part room temperature vulcanisable (RTV) silicone composition containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which cures to a silicone elastomer which may be used as a clear sealant which avoids discolouration and loss of adhesion upon aging.

Abstract: One-part condensation curable silyl-modified polymer (SMP) based sealant compositions in particular one-part condensation curable SMP based sealant compositions containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which compositions upon cure provide elastomeric sealants having low modulus and a high elastic recovery.

Abstract: A one-part low modulus room temperature vulcanisable (RTV) silicone composition containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which cures to a low modulus silicone elastomer which may be used as a non-staining (clean) sealant having high movement capability.

Abstract: A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

Abstract: A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

Abstract: A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

Abstract: An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25° C. as measured at 1 radian per second at 1 to 5% strain.

Abstract: An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25° C. as measured at 1 radian per second at 1 to 5% strain.

Abstract: Provided in various embodiments are methods of loading solid microparticles and nanoparticles of silver, including silver-based compounds, on silicone particles to surface modify the silicone particles. The silver-loaded microparticles and silver-loaded nanoparticles can be dispersed or loaded into silicones for use in antimicrobial and other applications.

Abstract: A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.

Abstract: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1?)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1? is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.

Abstract: A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications.

Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.

Abstract: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1?)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1? is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

Abstract: A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.