Abstract: A SMART amplifier circuit is disclosed. The amplifier circuit comprises a processor configured to receive a state control signal and generate a plurality of control signals, a power amplifier configured to provide an amplified RF signal that is a function of the RF input signal and the first control signal, and a tunable matching network configured to receive a second control signal and to provide a tuned, amplified RF output signal as an output that is a function of the amplified RF signal and the second control.

Abstract: A dual path RF amplifier circuit including two or more amplifiers that are configurable as to any combination of class of operation, biasing, and power ratio to achieve a desired power curve for the amplifier circuit. In one example, an RF amplifier circuit includes an input coupler that generates at least two coupled signals from an RF input signal, first and second RF amplifiers each configured to receive and amplify one of the coupled signals to generate first and second amplified signals, and an output coupler generate an amplified output signal based on the first and second amplified signals. The first RF amplifier is biased into a first class of operation, and the second RF amplifier is biased into a second class of operation, wherein a power ratio between the first and second RF amplifiers is selected based on the amplifier biasing and the first and second classes of operation.

Abstract: Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first electronic component.

Abstract: Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.