Abstract: An environmental physical sensor is provided that includes a power input terminal, a sensor output terminal, and a resonant switch. The resonant switch includes a mechanical element that is responsive to an environmental stimulus and is coupled to an electrical switch. The electrical switch is operable between an open position and a closed position and electrically connects the power input terminal to the sensor output terminal when in the closed position. The mechanical element is configured to intermittently actuate the electrical switch into the closed position responsive to the environmental stimulus.

Abstract: An environmental physical sensor is provided that includes a power input terminal, a sensor output terminal, and a resonant switch. The resonant switch includes a mechanical element that is responsive to an environmental stimulus and is coupled to an electrical switch. The electrical switch is operable between an open position and a closed position and electrically connects the power input terminal to the sensor output terminal when in the closed position. The mechanical element is configured to intermittently actuate the electrical switch into the closed position responsive to the environmental stimulus.

Abstract: The present invention provides methods and tools for directed assembly of nanoelements across a large area using a nanosubstrate. The nanosubstrate has a substrate layer, an adhesive layer, a conductive layer, and an insulating layer that is interrupted by one or more nanotrenches or nanowells having a width of at least 20 nm. The nanosubstrate allows the rapid assembly of linear assemblies and arrays of single walled carbon nanotubes and nanoparticles by DC electrophoresis. The density of nanoelements assembled can be controlled by varying the voltage and trench size. Functionalized nanoparticles can be assembled into arrays useful, e.g., as biosensors.

Abstract: The present invention provides methods and tools for directed assembly of nanoelements across a large area using a nanosubstrate. The nanosubstrate has a substrate layer, an adhesive layer, a conductive layer, and an insulating layer that is interrupted by one or more nanotrenches or nanowells having a width of at least 20 nm. The nanosubstrate allows the rapid assembly of linear assemblies and arrays of single walled carbon nanotubes and nanoparticles by DC electrophoresis. The density of nanoelements assembled can be controlled by varying the voltage and trench size. Functionalized nanoparticles can be assembled into arrays useful, e.g., as biosensors.

Abstract: Processes for preparing contacts on microswitches have been invented. The first is a wet process, involving the use of one or more acids, bases and peroxides, in some formulations diluted in water, to flush the contacts. The second process involves exposing the contacts to plasmas of various gases, including (1) oxygen, (2) a mixture of carbon tetrafluoride and oxygen, or (3) argon.

Abstract: Apparatus and methods for protecting devices such as micro-switches (100) and micro-relays from adverse effects of electrostatic discharge (ESD). A protection device is provided that includes a two terminal switch (102, 104) that can be actuated by an ESD event to protect an EDS-sensitive micro-switch or micro-relay from potential malfunction and/or damage. The two terminal switch is configured to close in less time than the micro-switch or micro-relay it is protecting, thereby disipating the energy associated with the ESD event without causing damage to the micro-relays which are provided with increased immunity to the adverse effects of ESD events. The micro-switch includes respective drain/gate terminal pairs at respective ends of the device. The micro-relay includes at least two drain terminals (106) and a gate terminal (102) at respective ends of the device.

Abstract: Apparatus and methods for protecting devices such as micro-switches (100) and micro-relays from adverse effects of electrostatic discharge (ESD). A protection device is provided that includes a two terminal switch (102, 104) that can be actuated by an ESD event to protect an EDS-sensitive micro-switch or micro-relay from potential malfunction and/or damage. The two terminal switch is configured to close in less time than the micro-switch or micro-relay it is protecting, thereby disipating the energy associated with the ESD event without causing damage to the micro-relays which are provided with increased immunity to the adverse effects of ESD events. The micro-switch includes respective drain/gate terminal pairs at respective ends of the device. The micro-relay includes at least two drain terminals (106) and a gate terminal (102) at respective ends of the device.

Abstract: A micro-electromechanical optical switch assembly is provided for an optical network. The switch assembly includes arrays of input and output optical fibers and optical components for selecting light paths that connect any selected pair of input and output fibers. The optical components include optical switching elements, such as torsionally supported micromechanical mirrors that are electrostatically actuated to rotate to direct the light beam along the desired light path. The mirrors are bulk micromachined into a semiconductor wafer, preserving their optical qualities, and formed into a chip mated to a cover. The package incorporates alignment elements to ensure correct position and orientation of the optical components in the package.

Abstract: A micro-electromechanical optical switch assembly is provided for an optical network. The switch assembly includes arrays of input and output optical fibers and optical components for selecting light paths that connect any selected pair of input and output fibers. The optical components include optical switching elements, such as torsionally supported micromechanical mirrors that are electrostatically actuated to rotate to direct the light beam along the desired light path. The mirrors are bulk micromachined into a semiconductor wafer, preserving their optical qualities, and formed into a chip mated to a cover. The package incorporates alignment elements to ensure correct position and orientation of the optical components in the package.

Abstract: Processes for preparing contacts on microswitches have been invented. The first is a wet process, involving the use of one or more acids, bases and peroxides, in some formulations diluted in water, to flush the contacts. The second process involves exposing the contacts to plasmas of various gases, including (1) oxygen, (2) a mixture of carbon tetrafluoride and oxygen, or (3) argon.

Abstract: A method of creating plastically deformed devices which have a three dimensional aspect. Micromechanical structures are created from a material which is plastically deformable and then a section of the structure is bent to an out-of-plane position and can be maintained there without being supported by other mechanical devices such as latches or hinges. The bending of the structures may be done mechanically, by electrostatic forces or by magnetic forces. The bending can also be done in a batch mode where a plurality of devices are bent at the same time as part of the same process. Fuses can be utilized to allow only a predetermined number of devices to be bent in batch mode. The fuses are later blown, thereby providing a plurality of devices which are relatively parallel to the substrate as well as a plurality of devices which are generally out-of-plane with respect to the substrate.

Abstract: A microelectric flow sensor including a deformable mechanical element is disclosed. The sensor includes a beam element mounted to a substrate. The beam element is anchored to the substrate on a first end, and deformed to a position normal to the surface of the substrate. An electrode is positioned on the substrate below a portion of the beam, such that when the beam is deflected, an electrical connection is established between the beam and the electrode. An alternate flow sensor includes a sensing beam surrounded by at least two cantilever beams which act as switches. The sensing beam is defined with two mechanically weak points which allow the sensing beam to be mechanically deformed to a new position approximately perpendicular to the cantilever beams and the top surface of the substrate. The substrate also includes electrodes which are positioned underneath the ends of the cantilever beams.

Abstract: A micromechanical switch or relay in accordance with the invention includes a substrate, a source electrode, a gate electrode, a drain electrode, and various style beams. In one embodiment the beam is relatively long and includes flexures on at least one end, and has a small activation voltage.

Abstract: A method for the fabrication complex-transition metal oxide (CTMO)/semiconductor or dielectric substrate integrated devices includes the separation of the CTMO film growth process from the CTMO-film/semiconductor or dielectric substrate integration process. The CTMO-film is transferred from the native substrate to the final substrate for fabrication into devices. The CTMO-film is grown onto a native substrate under growth conditions chosen to provide a CTMO-film having desirable properties and thickness. No restrictions are placed upon the native substrate used, the growth method used, or on the growth conditions required. The CTMO-film is then joined to the semiconductor or dielectric substrate and the native substrate is removed, providing the basis for an integrated electronics, photonics, or MEMS device. Techniques fully compatible with semiconductor processing can be used to fabricate monolithically integrated CTMO/semiconductor devices in a first embodiment.