Abstract: A package substrate includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the package substrate and includes a first contact pad coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the package substrate and includes a second contact pad coupled to the second circuit element.

Abstract: A converter includes a transformer having a primary and secondary windings. The primary winding has first and second winding terminals. A switch network has first-sixth switch network terminals. The first switch network terminal couples to the first winding terminal. The second switch network terminal couples to the second winding terminal. A first transistor has a first control input and first and second current terminals. The second current terminal couples to the third switch network terminal. A second transistor has a second control input and third and fourth current terminals. The fourth current terminal couples to the fourth switch network terminal. A third transistor has a third control input and fifth and sixth current terminals. The fifth current terminal couples to the fifth switch network terminal. A fourth transistor has a fourth control input and seventh and eighth current terminals. The seventh current terminal couples to the sixth switch network terminal.

Abstract: An apparatus includes a substrate and first through fourth conductive layers. The first conductive layer is on the substrate and includes a first electromagnetic interference (EMI) shield. The second conductive layer is over the first conductive layer opposite the substrate and includes a first winding of a transformer. The third conductive layer is over the second conductive layer opposite the first conductive layer and includes a second EMI shield. The fourth conductive layer is over the third conductive layer opposite the second conductive layer and includes a second winding of the transformer.

Abstract: A voltage converter includes a switch network, a rectifier, and a transformer coupled between the switch network and the rectifier. The voltage converter includes an adaptive ON-time generation circuit having a control input and a control output, the control input. The adaptive ON-time generation circuit is configured to receive a WAKE signal to turn ON the switch network, generate a signal indicative of an OFF time of the switch network, and determine an ON time for the switch network based on the signal indicative of the OFF time.

Abstract: An apparatus includes a substrate. A first conductive layer is on the substrate. The first conductive layer includes a first set of conductive segments and a second set of conductive segments. A second conductive layer is over the first conductive layer opposite the substrate. The second metal layer includes a third set of conductive segments and a fourth set of conductive segments. A first set of vias is between the first set of conductive segments and the third set of conductive segments. The first set of conductive segments, the third set of conductive segments, and the first set of vias form a first transformer winding. A second set of vias is between the second set of conductive segments and the fourth set of conductive segments. The second set of conductive segments, the fourth set of conductive segments, and the second set of vias form a second transformer winding.

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

Abstract: A laminate transformer includes a multilayer substrate having at least first, second, third, and fourth metal layers. The second metal layer and the third metal layer are separated by a voltage barrier having a thickness. A first multiloop coil has at least a first loop on the first metal layer and at least a second loop on the second metal layer. A second multiloop coil has at least a third loop on the third metal layer and at least a fourth loop on the fourth metal layer. A partial EMI shield for the first multiloop coil is on the second metal layer. A partial EMI shield for the second multiloop coil is on the third metal layer.

Abstract: An integrated circuit (IC) assembly includes a first power stage adapted to receive an input voltage and a second power stage adapted to provide an isolated output voltage. The IC also includes a transformer coupled between the first and second power stages. The IC further includes a detuning circuit coupled to the transformer, and a receiver circuit coupled to the first power stage. The receiver circuit includes an integrator configured to integrate a switching signal within the first power stage.

Abstract: An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.

Abstract: A rectifier circuit includes a first diode-connected transistor coupled to a first voltage terminal and a second diode-connected transistor coupled to a second voltage terminal. A switch network is coupled between the first diode-connected transistor and the second diode-connected transistor. The switch network has a first switch network terminal adapted to be coupled to a first terminal of a secondary winding of a transformer and has a second switch network terminal adapted to be coupled to a second terminal of the secondary winding of the transformer.

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.