Abstract: A user-controlled imaging device can include an imaging unit, a user facing imaging unit, a pupil detection and tracking unit for computing the user's viewing direction, a control unit for controlling the imaging unit corresponding to the determined direction of the user's view.

Abstract: A method according to embodiments of the invention includes, for a field of view comprising a plurality of portions, determining an amount of light for each portion. LEDs corresponding to each portion are selectively energized over a plurality of time periods, such that a sum of illumination generated by each LED during the plurality of time periods equals the determined amount of light. An image of the field of view is captured, for example by a camera.

Abstract: A device includes a light-emitting device (LED) having at least two vertical light-emitting sides, and a ring-shaped light guide having a bottom side, a top side comprising a light-emitting surface, an inner sidewall, and an outer sidewall defining an indentation having at least two vertical in-coupling surfaces mated to the at least two vertical light-emitting sides of the LED.

Abstract: The invention describes an infrared imaging assembly (1) for capturing an infrared image (M0, M1) of a scene (S), comprising an infrared-sensitive image sensor (14); an irradiator (10) comprising an array of individually addressable infrared-emitting LEDs, wherein each infrared-emitting LED is arranged to illuminate a scene region (S1, . . . , S9); a driver (11) configured to actuate the infrared irradiator (10) by applying a switching pulse train (T1, . . . , T9) to each infrared-emitting LED; an image analysis module (13) configured to analyse a preliminary infrared image (M0) to determine the required exposure levels (130) for each of a plurality of image regions (R1, . . . , R9); and a pulse train adjusting unit (12) configured to adjust the duration (L1, . . . , L9) of a switching pulse train (T1, . . . , T9) according to the required exposure levels (130).

Abstract: A semiconductor light-emitting device has an emitter matrix with an arrangement of emitter cells interspersed with non-emitter cells. The emitter cell has a semiconductor emitter, and a non-emitter cell does not have a semiconductor emitter. A number of bond pads for connection to a power supply and a plurality of wirebonds are present. Each wirebond extends from a bond pad to the semiconductor emitter of an emitter cell. An imaging arrangement includes a light source for illuminating a scene. The light source has a pair of such semiconductor light-emitting devices. A method of manufacturing such a semiconductor light-emitting device is also described.

Abstract: A lighting device comprises a light-emitting module with light-emitting elements, wherein the light-emitting elements are arranged adjacent to each other and are configured to emit light towards a light-emitting side. The light-emitting module is configured such that the light-emitting elements can be addressed partially independently of each other, such that some may be brought into a switched-on state while others are brought into a switched-off state. A top layer is disposed on the light-emitting module at the light-emitting side. Further comprising a switching material capable of a reversible change in transmittance for the light emitted by changing to a higher transmittance in regions where the top layer situated on light-emitting elements in the switched-on state or to a lower transmittance in regions of the top layer situated in the switched-off state. The invention further refers to methods for producing and operating a lighting device and using a lighting device.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: In an imaging system, a lens can redirect light from an illuminated portion of a scene toward a one-dimensional focus that is positioned in a focal plane of the lens and is elongated in an imaging dimension. The redirected light can include first light that emerges from the lens and second light that emerges from the lens. A reflector positioned adjacent the lens can reflect the second light to form third light. A linear array of detector pixels can extend along the imaging dimension and can be positioned at the focal plane proximate the one-dimensional focus to receive the first light from the lens and receive the third light from the reflector. A processor can obtain one-dimensional image data from the detector pixels for sequentially illuminated portions of the scene and construct data representing an image of the full scene from the one-dimensional image data.

Abstract: The image capture system of the present disclosure comprises an illuminator comprising at least one infrared light LED or laser and one visible light LED, an image sensor that is sensitive to infrared light and visible light, a memory configured to store instructions, and a processor configured to execute instructions to cause the image capture system to emit infrared light, receive image data comprising at least one infrared image, and determine depth maps, visible focus settings, or infrared exposure settings based on the infrared image data.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having all array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: A device includes a light-emitting device (LED) having at least two vertical light-emitting sides, and a ring-shaped light guide having a bottom side, a top side comprising a light-emitting surface, an inner sidewall, and an outer sidewall defining an indentation having at least two vertical in-coupling surfaces mated to the at least two vertical light-emitting sides of the LED.

Abstract: A method according to embodiments of the invention includes creating a three-dimensional profile of a scene, calculating a relative amount of light for each portion of the scene based on the three-dimensional profile, and activating a light source to provide a first amount of light to a first portion of the scene, and a second amount of light to a second portion of the scene. The first amount and the second amount are different. The first amount and the second amount are determined by calculating a relative amount of light for each portion of the scene.

Abstract: The invention describes an array of light sources comprising multiple VCSELs arranged laterally to each other on top of a substrate, wherein each VCSEL comprises a light emitting area surrounded by an electrode structure which does not emit light, wherein a shielding layer is applied on top of at least the electrode structure only covering a surface (of the electrode structure facing towards an average light emitting direction of the VECSELs, the shielding layer is an opaque layer and being adapted to optically match the array in a switched-off state to an outer surface of a housing of a device, where the array of light sources is to be installed. The invention further describes the device comprising such an array and a method for manufacturing an array of light sources.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: A method includes capturing a first image of a scene, detecting a face in a section of the scene from the first image, and activating an infrared (IR) light source to selectively illuminate the section of the scene with IR light. The IR light source includes an array of IR light emitting diodes (LEDs). The method includes capturing a second image of the scene under selective IR lighting from the IR light source, detecting the face in the second image, and identifying a person based on the face in the second image.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: A flash light module (1) can include a housing (30) carrying at least a visible flash light emitter (10) to emit a flash light beam along an optical axis (OA) and at least one additional emitter (20) emitting non-visible light arranged at a second distance (D2) perpendicular to the optical axis (OA), where position and orientation of the additional emitter (20) and at least the second distances (D2) are suitably adapted as well as the housing (30) is suitably shaped in order to enable the additional emitter (20) to emit non-visible light (22) along a non-visible light emitting direction (IRD), wherein the additional emitter (20) is adapted to emit the non-visible light (22) to the environment suitable to remote communicate to, preferably to remote control, external electronic devices (5) comprising corresponding receivers for the non-visible light (22). A mobile device (100) can include the flash light module (1) and a method to operate the mobile device (100).

Abstract: The invention describes an array of light sources comprising multiple VCSELs arranged laterally to each other on top of a substrate, wherein each VCSEL comprises a light emitting area surrounded by an electrode structure which does not emit light, wherein a shielding layer is applied on top of at least the electrode structure only covering a surface (of the electrode structure facing towards an average light emitting direction of the VECSELs, the shielding layer is an opaque layer and being adapted to optically match the array in a switched-off state to an outer surface of a housing of a device, where the array of light sources is to be installed. The invention further describes the device comprising such an array and a method for manufacturing an array of light sources.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: The invention describes a light emitting diode array module (30) comprising a plurality of light emitting diode structures (10a, 10b), wherein the light emitting diode structures (10a, 10b) are arranged such that there is an optical cross talk between the light emitting diode structures (10a, 10b) during operation of the light emitting diode array module (30), wherein at least a first light emitting diode structure (10a) of the plurality of light emitting diode structures (10a, 10b) is characterized by a first color, and wherein at least a second light emitting diode structure (10b) of the plurality of light emitting diode structures (10a, 10b) is characterized by a second color different than the first color, wherein the first color, the second color and the optical cross talk between the light emitting diodes are arranged to provide a predefined light distribution in a reference plane (40) perpendicular to an optical axis (50) of the light emitting diode array module (30).