Patents by Inventor Nicolaas H. Worp

Nicolaas H. Worp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Overmolded semiconductor package with anchoring means
    Patent number: 5136366
    Abstract: An overmolded semiconductor package (150) is formed by electrically and mechanically attaching a semiconductor device (100) to a substrate (110) having at least one hole (130). A plastic molding compound (140) is overmolded around the semiconductor device 100) so as to encapsulate the device, the molding compound (140) extending at least partially into the substrate hole (130) to form an anchor (135) to aid in bonding the molding compound to the substrate. An alternate embodiment of the invention forms a pedestal (449) from the portion of the molding compound extending beyond the surface of the substrate. The pedestal functions as an anchor to aid in bonding the molding compound (440) to the substrate, and also as a spacer to maintain a preselected clearance between the substrate (410) and the printed circuit board (460). The portion of the molding compound extending beyond the surface of the substrate may also be used to form an alignment pin (548).
    Type: Grant
    Filed: November 5, 1990
    Date of Patent: August 4, 1992
    Assignee: Motorola, Inc.
    Inventors: Nicolaas H. Worp, Bruce J. Freyman, Kurt C. Conrath