Patents by Inventor Nicolas Chapas

Nicolas Chapas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5384005
    Abstract: A process for producing laminated capacitors includes stacking of metallized plastic films. It includes a step of winding of at least one pair of metallized plastic films, this step being separated into three phases, a first phase of making finishing turns and during which the films are demetallized so that their superposition does not lead to any additional capacitance in the final component, a second phase of superposing the films so that they contribute to the capacitance of the final component and during which the films are demetallized near their edges, and a third phase intended to perform finishing turns under the same conditions as during the first phase, wherein the demetallizations of the films occurring in the successive phases are performed by etching.
    Type: Grant
    Filed: January 19, 1994
    Date of Patent: January 24, 1995
    Assignee: Compagnie Europeenne de Composants Electroniques LCC
    Inventors: Nicolas Chapas, Philippe Mysson, Ronan Stephan
  • Patent number: 5372056
    Abstract: In a method for the manufacturing or a foil capacitor, cut out into unit blocks by a circular saw blade from a capacitive strip, the saw blade rotates about an axis passing through a point of rotation that is offset with respect to the center of the saw blade. The method can be applied to the manufacture of capacitors with metallized dielectric films.
    Type: Grant
    Filed: November 9, 1992
    Date of Patent: December 13, 1994
    Assignee: Compagnie Europeenne de Composants Electroniques LCC
    Inventors: Michel Pageaud, Nicolas Chapas
  • Patent number: 5258153
    Abstract: In a method for the manufacture of stacked or wound type capacitors, made by the stacking and cutting out into unit blocks or by the winding of metallized polyethylene naphthalene films, at least after the stacking phase for the stacked type capacitors or the winding phase for the wound type capacitors, the capacitors are subjected to at least one annealing operation at a temperature of 240.degree. C. to 295.degree. C. for a period of at least one hour. The method can be applied notably to the making of chip capacitors for SMC mounting.
    Type: Grant
    Filed: May 28, 1992
    Date of Patent: November 2, 1993
    Assignee: Compagnie Europeenne de Composants Electroniques LCC
    Inventors: Nicolas Chapas, Thierry Feral