Patents by Inventor Nicolas Maier

Nicolas Maier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module comprising a housing which is formed in levels
    Patent number: 10991643
    Abstract: The invention relates to a power module. The power module has at least one power semiconductor and at least one further electronic component. The power module has a housing which is formed by a shaped body and is formed by an encapsulation compound. According to the invention, the housing is formed in at least two levels. At least one power semiconductor component is arranged in a first level and the at least one further electronic component is arranged in the second level. At least one electrically conductive layer, which forms an electrically conductive connecting structure, is formed on a surface of an inner boundary of the power module which extends between the levels. The connecting structure is applied directly to the surface. The at least one further electronic component is electrically conductively connected, in particular soldered or sintered, to the wiring structure.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: April 27, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Georg Hejtmann, Martin Rittner, Nicolas Maier, Uwe Glanz
  • POWER MODULE COMPRISING A HOUSING WHICH IS FORMED IN LEVELS
    Publication number: 20190378786
    Abstract: The invention relates to a power module. The power module has at least one power semiconductor and at least one further electronic component. The power module has a housing which is formed by a shaped body and is formed by an encapsulation compound. According to the invention, the housing is formed in at least two levels. At least one power semiconductor component is arranged in a first level and the at least one further electronic component is arranged in the second level. At least one electrically conductive layer, which forms an electrically conductive connecting structure, is formed on a surface of an inner boundary of the power module which extends between the levels. The connecting structure is applied directly to the surface. The at least one further electronic component is electrically conductively connected, in particular soldered or sintered, to the wiring structure.
    Type: Application
    Filed: December 11, 2017
    Publication date: December 12, 2019
    Inventors: Georg Hejtmann, Martin Rittner, Nicolas Maier, Uwe Glanz