Patents by Inventor Nicolas Maisonnave

Nicolas Maisonnave has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10843257
    Abstract: A method (S) for manufacturing a part (1) out of a metal matrix composite material, including the following steps: opening (S1) a device (10) that includes a supporting portion (14) and a molding portion (14); placing (S2) a fibrous reinforcement into the device (10); sealably closing (S3) the device (10) by providing a space between the fibrous reinforcement (2) and the device portions; feeding (S4) the molten metal matrix (3) into the device (10) such as to fill the space between the fibrous reinforcement (2) and the device portions (13, 14); and applying (S5) a force onto the equipment (10) such as to impregnate the fibrous reinforcement (2) with the metal matrix (3).
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: November 24, 2020
    Assignees: SAFRAN ELECTRONICS AND DEFENSE, SAFRAN
    Inventors: Muriel Sabah, Nicolas Maisonnave
  • Patent number: 10392548
    Abstract: A composite material part including reinforcement made of carbon fibers or yarns consolidated by an organic matrix. The part includes one or more thermally and electrically conductive portions in which the carbon fibers or yarns are free of matrix at least in part, the matrix-free carbon fiber or yarn portions being in contact with a material that is thermally and electrically conductive.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: August 27, 2019
    Assignee: SAFRAN
    Inventors: Nicolas Maisonnave, Marc-Antoine Colot, Julien LeFrancois
  • Publication number: 20170216911
    Abstract: The invention relates to a method (S) for manufacturing a part (1) out of a metal matrix composite material, including the following steps: opening (S1) device (10) that includes a supporting portion (14) and a molding portion (14); placing (S2) a fibrous reinforcement into the device (10); sealably closing (S3) the device (10) by providing a space between the fibrous reinforcement (2) and the device portions; feeding (S4) the molten metal matrix (3) into the device (10) such as to fill the space between the fibrous reinforcement (2) and the device portions (13, 14); and applying (S5) a force onto the equipment (10) such as to impregnate the fibrous reinforcement (2) with the metal matrix (3).
    Type: Application
    Filed: June 2, 2015
    Publication date: August 3, 2017
    Inventors: Muriel SABAH, Nicolas MAISONNAVE
  • Publication number: 20160168441
    Abstract: A composite material part including reinforcement made of carbon fibers or yarns consolidated by an organic matrix. The part includes one or more thermally and electrically conductive portions in which the carbon fibers or yarns are free of matrix at least in part, the matrix-free carbon fiber or yarn portions being in contact with a material that is thermally and electrically conductive.
    Type: Application
    Filed: July 21, 2014
    Publication date: June 16, 2016
    Applicant: SAFRAN
    Inventors: Nicolas MAISONNAVE, Marc-Antoine COLOT, Julien LEFRANCOIS
  • Patent number: 8947881
    Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 3, 2015
    Assignee: European Aeronautic Defence and Space Company EADS France
    Inventors: Jesus Aspas Puertolas, Nicolas Maisonnave, Emile Colongo, Sylvain Bourdou
  • Publication number: 20140290977
    Abstract: A strip of a semi-finished product (101, 102), suitable for being deposited by lay-up, for the constitution of a laminated composite material, includes, according to a cross-section and over all its length: a first conductive layer (105, 106), made of an electric conductive material; two electric insulating layers (121, 122), made of a dielectric material completely surrounding the conductive layer (105, 106), the cross sectional width of which is greater than the width of the conductive layer; and two bonding layers (111, 112), extending in thickness on either side of the insulating layers (121, 122), on the exterior of the strip (101, 102). A method for the continuous production of such a strip is also described.
    Type: Application
    Filed: May 15, 2012
    Publication date: October 2, 2014
    Applicant: EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE
    Inventors: Jesus Aspas Puertolas, Nicolas Maisonnave, Mathieu Sauzedde, Michel Bermudez
  • Publication number: 20120140417
    Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.
    Type: Application
    Filed: April 6, 2010
    Publication date: June 7, 2012
    Applicant: European Aeronautic Defence and Space Company Eads
    Inventors: Jesus Aspas Puertolas, Nicolas Maisonnave, Emile Colongo, Sylvain Bourdou