Abstract: A lighting device comprises a carrier having a radially outwardly facing mounting surface and an inner cavity radially within the outer mounting surface. Solid state lighting devices are mounted on the outer mounting surface and a driver is housed in the inner cavity. A ring shaped optical unit defines a light output region of the lighting device and is mounted around the carrier. An outer housing reflects light from the arrangement of solid state lighting devices to the ring shaped optical unit. This provides a compact arrangement, in which the driver, the heat sink (implemented by the carrier), and the solid state lighting arrangement are essentially in a plane. This is possible by providing a ring of light sources facing radially outwardly, with the driver mounted radially inside the ring. The radial light output is converted to a light output with a desired direction and beam shape by the optical unit.

Abstract: An optical module (30) for a LED assembly (1) is disclosed. The optical module comprises a plurality of optical elements (31) and a plurality of mounting structures (40), each mounting structure comprising a stepped arrangement of mounting elements, in which each mounting element defines a step of the stepped arrangement, each step defining a different mounting height for the optical module. Also disclosed are a LED assembly including such an optical module, a luminaire including such a LED assembly and a method of assembling such a LED assembly.

Abstract: An optical module (30) for a LED assembly (1) is disclosed. The optical module comprises a plurality of optical elements and a plurality of mounting structures (40), each mounting structure comprising a stepped arrangement of mounting elements, in which each mounting element defines a step of the stepped arrangement, each step defining a different mounting height for the optical module. Also disclosed are a LED assembly including such an optical module, a luminaire including such a LED assembly and a method of assembling such a LED assembly.

Abstract: A lighting device comprises a carrier having a radially outwardly facing mounting surface and an inner cavity radially within the outer mounting surface. Solid state lighting devices are mounted on the outer mounting surface and a driver is housed in the inner cavity. A ring shaped optical unit defines a light output region of the lighting device and is mounted around the carrier. An outer housing reflects light from the arrangement of solid state lighting devices to the ring shaped optical unit. This provides a compact arrangement, in which the driver, the heat sink (implemented by the carrier), and the solid state lighting arrangement are essentially in a plane. This is possible by providing a ring of light sources facing radially outwardly, with the driver mounted radially inside the ring. The radial light output is converted to a light output with a desired direction and beam shape by the optical unit.

Abstract: A light device includes a light engine having light emitting device, an optical device, and at least a first magnetic element disposed between the light emitting device and the optical device. The light device further includes a support holder having a magnetic material adapted to couple to the at least one magnetic element, to magnetically attach the light engine to the support holder.

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: The invention relates to a light engine (40) comprising: a light-emitting device (30) comprising at least one light source; an optical device (20) attached to the light-emitting device (30); and at least one first magnetic element (25) between the light-emitting device (30) and the optical device (20). The invention relates also to a light device (10) comprising: said light engine (40); and a support holder (50) arranged to bear the light engine (40), comprising a magnetic material adapted such that the at least one first magnetic element (25) of the light engine (40) and this magnetic material are magnetically attracted one to the other to magnetically attach the light engine (40) to the support holder (50).

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.