Abstract: An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising intermetallic compounds of a phase formed with a first brazing metal and a second metal the melting point of which is higher than that of the first brazing metal, said linking element further including at least a second material portion composed of at least a third metal, said second material portion contacting both objects.

Abstract: Device for connecting nano-objects to external electrical systems, and method for producing the device. According to the invention, which applies in particular to molecular characterization, a device including the following is produced: an upper layer equipped with upper contact pads to be connected to a nano-object; a lower layer, equipped with lower contact pads to be connected to an external electrical system; above the lower layer, a bonding layer including electrical through-vias in contact with the lower pads; and, between the bonding layer and the upper layer, at least two layers equipped with conductive lines and electrical vias, for connecting the upper pads to the lower pads.

Abstract: A novel method makes it possible to form cavities intended to contain a liquid with determined optical properties within a film for optical use. The walls (38) of the cavities (40) are formed by plasma etching of a layer of transparent or light absorbent material (30, 34) transferred onto a microtechnological substrate, the walls (38) having a structured profile in order to limit the parasitic phenomena of light diffusion and diffraction.

Abstract: Device for connecting nano-objects to external electrical systems, and method for producing the device. According to the invention, which applies in particular to molecular characterization, a device including the following is produced: an upper layer (16) equipped with upper contact pads (8) to be connected to a nano-object (2); a lower layer (18), equipped with lower contact pads (12) to be connected to an external electrical system (4); above the lower layer, a bonding layer (20) including electrical through-vias (22) in contact with the lower pads; and, between the bonding layer and the upper layer, at least two layers (22, 24) equipped with conductive lines (25) and electrical vias (26), for connecting the upper pads to the lower pads.

Abstract: An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising intermetallic compounds of a phase formed with a first brazing metal and a second metal the melting point of which is higher than that of the first brazing metal, said linking element further including at least a second material portion composed of at least a third metal, said second material portion contacting both objects.

Abstract: A process for packaging a plurality of micro-components made on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a cover plate; depositing a metal layer on a face of the cover plate or on a face of the wafer; covering the wafer with the cover plate; applying a contact pressure equal to at least one bar onto the cover plate and onto the wafer; and heating the metal layer during pressing until a seal is obtained, each cavity thus being provided with a sealing area and being closed by a part of the cover plate and/or its metal layer.

Abstract: A process for packaging a number of micro-components on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a covering plate comprising a re-useable matrix, a polymer layer, and a metal layer; covering the wafer with the covering plate; applying a contact pressure equal to at least one bar on the covering plate and on the wafer; heating the metal layer during pressing until sealing is obtained, each cavity thus being provided with a sealing area and closed by metal layer; and dissolving the polymer to recover and recycle the matrix.

Abstract: A process for manufacturing a device including a packaged microsystem. The manufactured device is in a form of a plane wafer, the microsystem being buried in the wafer. Therefore, the process is used to make a compound that may be used as a basis for other micro technology processes. Moreover, the process co-integrates electronic compounds when the device is being manufactured. The device is particularly suitable for MEMS, and particularly radiofrequency resonators.

Abstract: A novel method makes it possible to form cavities intended to contain a liquid with determined optical properties within a film for optical use. The walls (38) of the cavities (40) are formed by plasma etching of a layer of transparent or light absorbent material (30, 34) transferred onto a microtechnological substrate, the walls (38) having a structured profile in order to limit the parasitic phenomena of light diffusion and diffraction.

Abstract: This invention discloses a process for manufacturing a device (44) comprising a packaged microsystem (10?): the device manufactured according to the invention is in the form of a plane wafer, the microsystem (10?) being buried in the wafer. Therefore, the process according to the invention is used to make a compound that may be used as a basis for other micro technology processes. Moreover, the process according to the invention co-integrates electronic compounds (36, 38) when the device (44) is being manufactured. The device (44) according to the invention is particularly suitable for MEMS, and particularly radiofrequency resonators.

Abstract: A process for packaging a number of micro-components on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a covering plate comprising a re-useable matrix, a polymer layer, and a metal layer; covering the wafer with the covering plate; applying a contact pressure equal to at least one bar on the covering plate and on the wafer; heating the metal layer during pressing until sealing is obtained, each cavity thus being provided with a sealing area and closed by metal layer; and dissolving the polymer to recover and recycle the matrix.

Abstract: A process for packaging a plurality of micro-components made on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a cover plate; depositing a metal layer on a face of the cover plate or on a face of the wafer; covering the wafer with the cover plate; applying a contact pressure equal to at least one bar onto the cover plate and onto the wafer; and heating the metal layer during pressing until a seal is obtained, each cavity thus being provided with a sealing area and being closed by a part of the cover plate and/or its metal layer.

Abstract: Production process of a flat suspended micro-structure using a sacrificial layer of polymer material and component obtained thereby The process successively comprises deposition of a sacrificial layer (2) of polymer material, deposition, on at least a part of the substrate (1) and of the front face of the sacrificial layer (2), of an embedding layer (6), the thickness whereof is larger than that of the sacrificial layer (2), and planarization so that the front faces of the sacrificial layer (2) and of the embedding layer (6) form a common flat surface. A formation layer (3) of a suspended structure (5) is deposited on the front face of the common flat surface. Planarization can comprise chemical mechanical polishing and etching of the embedding layer (6). Etching of the sacrificial layer (2) can be performed by means of a mask formed on the front face of a layer of polymer material eliminated during the planarization step.