Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

Abstract: A flame-retardant, optically clear thermoplastic molding composition is disclosed. The composition contains aromatic polycarbonate resin, a bromine-substituted carbonate oligomer, a phosphorous containing compound and an inorganic salt of perfluoroalkane sulfonic acid in amounts effective to impart to the composition flame resistance that in accordance with UL-94-5V standard is rated A at 3.00 mm and V-0 at 1.5 mm.

Abstract: The present invention relates to a flame-retardant, optically clear thermoplastic molding composition. The composition contains a A) about 60 pbw to about 97 pbw of a polycarbonate, B) about 1 pbw to about 20 pbw of bromine-substituted oligocarbonate, C) about 1 pbw to about 20 pbw of a phosphorus-containing compound and D) about 0.01 pbw to about 1 pbw of at least one alkali or alkaline-earth salt of perfluoroalkane sulfonic acid and optionally E) about 0.01 to about 1 pbw of a phosphite antioxidant/stabilizer. In accordance with UL-94 standard the flame-retardant, optically clear thermoplastic molding composition is rated 5VA at 3.00 mm and V-0 at 2.3 mm, more preferably V-0 at 1.5 mm according to UL-94.

Abstract: A flame-retardant, optically clear thermoplastic molding composition is disclosed. The composition contains aromatic polycarbonate resin, a bromine-substituted carbonate oligomer, a phosphorous containing compound and an inorganic salt of perfluoroalkane sulfonic acid in amounts effective to impart to the composition flame resistance that in accordance with UL-94-5V standard is rated A at 3.00 mm and V-0 at 1.5 mm.