Abstract: The invention relates to a palladium-copper-silver alloy with palladium as the main component, wherein the palladium-copper-silver alloy has a weight ratio of palladium to copper of at least 1.05 and at most 1.6 and has a weight ratio of palladium to silver of at least 3 and at most 6, and wherein the palladium-copper-silver alloy contains more than 1 wt % and up to a maximum of 6 wt % of ruthenium, rhodium or ruthenium and rhodium and contains, as the remainder, palladium, copper and silver and at most 1 wt % of other metallic elements including impurities. The invention also relates to a wire, a strip or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for making electrical contact or for producing a sliding contact.

Abstract: The invention relates to a palladium-copper-silver alloy with palladium as the main component, wherein the palladium-copper-silver alloy has a weight ratio of palladium to copper of at least 1.05 and at most 1.6 and has a weight ratio of palladium to silver of at least 3 and at most 6, and wherein the palladium-copper-silver alloy contains more than 1 wt % and up to a maximum of 6 wt % of ruthenium, rhodium or ruthenium and rhodium and contains, as the remainder, palladium, copper and silver and at most 1 wt % of other metallic elements including impurities. The invention also relates to a wire, a strip or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for making electrical contact or for producing a sliding contact.

Abstract: A probe pin (100, 100?) for electronic testing of semi-conductor elements is provided. The pin contains an electrically conductive core element (200) made up of a metallic alloy, and an electrically insulating jacket element (300) which surrounds the core element (200) over regions thereof. The core element (200) contains a distal contact section (210) for electrical contacting to a semi-conductor element. The metallic alloy of the core element contains at least 67% by weight rhodium, 0.1% by weight to 1% by weight zirconium, up to 1% by weight yttrium, and up to 1% by weight cerium. A method for producing a probe pin is also described.

Abstract: A probe pin (100, 100?) for electronic testing of semi-conductor elements is provided. The pin contains an electrically conductive core element (200) made up of a metallic alloy, and an electrically insulating jacket element (300) which surrounds the core element (200) over regions thereof. The core element (200) contains a distal contact section (210) for electrical contacting to a semi-conductor element. The metallic alloy of the core element contains at least 67% by weight rhodium, 0.1% by weight to 1% by weight zirconium, up to 1% by weight yttrium, and up to 1% by weight cerium. A method for producing a probe pin is also described.

Abstract: One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal or cermet material with a metal fraction into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor.

Abstract: One aspect relates to an electrical bushing for an implantable device including an electrically insulating base body and at least one electrically conductive bushing body that is embedded in at least one bushing opening that extends through the base body. The base body is produced from a sintered ceramic material, characterized in that the at least one bushing body is made of a sintered cermet material or a sintered metallic material. The base body and the at least one bushing body comprise a firmly bonded sintered connection.

Abstract: One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal or cermet material with a metal fraction into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor.