Patents by Inventor Nieh-Hung Lai

Nieh-Hung Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for quickly building a building and moldboard employed in the method
    Publication number: 20020100247
    Abstract: A constructing method for multiple floors RC building and moldboard structure employed in the method. The upper floor construction can be proceeded before the concrete of the lower floor is dried so that this method shortens construction period. The connection between floors is good and the strength of the building is improved and the ability of anti-earthquake is increased.
    Type: Application
    Filed: January 31, 2001
    Publication date: August 1, 2002
    Inventor: Nieh-Hung Lai