Patents by Inventor Nikhil E. Verghese

Nikhil E. Verghese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9617413
    Abstract: A curable composition including (a) at least one epoxide compound comprising: (i) at least one solid or semi-solid epoxy resin; and (ii) at least one divinylarene dioxide resin compound; and (b) at least one hardener; wherein the curable composition being cured comprises a cured thermoset product having a Tg of greater than about 120° C. A thermoset can be prepared from the above curable composition.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: April 11, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Angela I. Padilla-Acevedo, Theofanis Theofanous, Nikhil E. Verghese, Fabio Aguirre Vargas
  • Patent number: 9120926
    Abstract: Curable compositions including an epoxy resin, a hardener, and a block copolymer having a thermoset-philic block and a thermoset-phobic block, where the block copolymer is from 20 weight percent to 80 weight percent of the curable composition are described herein.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: September 1, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Radhakrishnan Karunakaran, Nikhil E. Verghese
  • Publication number: 20150218364
    Abstract: A curable composition including (a) at least one epoxide compound comprising: (i) at least one solid or semi-solid epoxy resin; and (ii) at least one divinylarene dioxide resin compound; and (b) at least one hardener; wherein the curable composition being cured comprises a cured thermoset product having a Tg of greater than about 120° C. A thermoset can be prepared from the above curable composition.
    Type: Application
    Filed: September 25, 2013
    Publication date: August 6, 2015
    Applicant: Dow Global Technologies LLC
    Inventors: Angela I. Padilla-Acevedo, Theofanis Theofanous, Nikhil E. Verghese, Fabio Aguirre Vargas
  • Publication number: 20150141602
    Abstract: A monomer treatment process including treating at least one metathesis polymerizable monomer composition having a purity of less than 95 weight percent of a dicyclopentadiene monomer with an alkali metal-containing additive prior to polymerizing the metathesis polymerizable monomer composition such that the treated polymerized monomer exhibits improved properties in metathesis reactions.
    Type: Application
    Filed: April 16, 2013
    Publication date: May 21, 2015
    Inventors: Marvin L. Dettloff, Richard J. Keaton, Ha Q. Pham, Nikhil E. Verghese
  • Publication number: 20150065613
    Abstract: A curable epoxy adhesive composition including (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) at least a first hydrophilic filler that has a predetermined aspect ratio; (e) at least a second hydrophobic filler that is different from the first filler and that has a predetermined aspect ratio; and (f) at least a third filler that is different from the first and second fillers; wherein the third filler has a predetermined aspect ratio higher than the first filler and the second filer; and wherein the volume ratio of the third filler to the combination of the first filler and second filler is in the range of from 1:1 to 10:1 such as to minimize the thermal residual stresses of the cured product made from the curable composition.
    Type: Application
    Filed: April 3, 2013
    Publication date: March 5, 2015
    Applicants: Dow MF Produktions GmbH & Co. OHG, The Dow Chemical Company
    Inventors: Bharati Balijepalli, Theofanis Theofanous, Bernd Hoevel, Nikhil E. Verghese, Ha Q. Pham
  • Publication number: 20140343234
    Abstract: Curable compositions including an epoxy resin, a hardener, and a block copolymer having a thermoset-philic block and a thermoset-phobic block, where the block copolymer is from 20 weight percent to 80 weight percent of the curable composition are described herein.
    Type: Application
    Filed: November 9, 2012
    Publication date: November 20, 2014
    Inventors: Radhakrishnan Karunakaran, Nikhil E. Verghese
  • Publication number: 20140316068
    Abstract: A bimodal toughening agent comprising a) a first preformed coreshell toughening agent and b) a second preformed coreshell toughening agent wherein the second preformed coreshell toughening agent has a particle size of at least two times larger than that of the first preformed coreshell toughening agent, and the use of the bimodal toughening agent in a thermosettable epoxy resin composition, is disclosed.
    Type: Application
    Filed: November 1, 2012
    Publication date: October 23, 2014
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: George C. Jacob, Yasmin N. Srivastava, Nikhil E. Verghese, Theofanis Theofanous, Ludovic Valette, Ha Q. Pham
  • Publication number: 20110104498
    Abstract: A structural composite uses a block copolymer toughening agent to increase the fracture resistance (toughness) of the structural composite. The structural composite comprises (i) a carbon fiber reinforcing material and (ii) a thermosettable resin composition; wherein the thermosettable resin composition comprises (a) a thermosettable resin and (b) at least one block copolymer toughening agent.
    Type: Application
    Filed: June 30, 2009
    Publication date: May 5, 2011
    Inventors: Rajesh Turakhia, Ha Q. Pham, Nikhil E. Verghese, George Jacob
  • Publication number: 20080197526
    Abstract: Epoxy composites are prepared by separately preheating an epoxy resin and a hardener; mixing the preheated epoxy resin and preheated hardener to form a hot reaction mixture and curing the hot reaction mixture in the presence of a reinforcement until the mixture cures to form a composite having a polymer phase with a glass transition temperature of at least 150° C.
    Type: Application
    Filed: February 5, 2008
    Publication date: August 21, 2008
    Inventors: Asjad Shafi, Nikhil E. Verghese, Allan James, John J. Penkala
  • Patent number: 6887574
    Abstract: A curable flame retardant epoxy resin composition including (a) at least one flame retardant epoxy resin; (b) at least one amphiphilic block copolymer; and (c) a curing agent. Such components are present in the curable composition in the appropriate amounts and ratios such that, upon curing, the block copolymer self-assembles into a nano structure morphology, such as a worm-like micelle morphology. The resulting cured product made from the composition of the present invention has a remarkably increased high fracture resistance; and allows the use of flame retardant epoxies in applications where fracture resistance is an issue.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: May 3, 2005
    Assignees: Dow Global Technologies Inc., Regents of the University of Minnesota
    Inventors: Jennifer M. Dean, Frank S. Bates, Ha Q. Pham, Nikhil E. Verghese