Abstract: A fluid heat exchanger with pump, adapted to drive a fluid for heat transfer, comprises a heat conduction unit, a diversion unit, and a housing unit. The heat conduction unit includes a heat conductor. The diversion unit includes a cover and a diversion plate. A cooling chamber is defined by the cover and the heat conductor. The cover is provided with a fluid stopper. The diversion plate is disposed in the cooling chamber, and one end of the diversion plate abuts against the fluid stopper, so that the cooling chamber is divided into an upper passage and a lower passage. The housing unit includes a housing and a pump module. The fluid in the housing is driven by the pump module to flow through the upper passage to the lower passage, and then the fluid returns to the housing to carry the heat from the heat conductor.

Abstract: A fluid heat exchanger with pump, adapted to drive a fluid for heat transfer, comprises a heat conduction unit, a diversion unit, and a housing unit. The heat conduction unit includes a heat conductor. The diversion unit includes a cover and a diversion plate. A cooling chamber is defined by the cover and the heat conductor. The cover is provided with a fluid stopper. The diversion plate is disposed in the cooling chamber, and one end of the diversion plate abuts against the fluid stopper, so that the cooling chamber is divided into an upper passage and a lower passage. The housing unit includes a housing and a pump module. The fluid in the housing is driven by the pump module to flow through the upper passage to the lower passage, and then the fluid returns to the housing to carry the heat from the heat conductor.

Abstract: A method for manufacturing a fluid-based cooling element is provided. The fluid-based cooling element is configured for cooling a heat generating element arranged on a printed circuit board (100). The method comprises forming a base body comprising a plate-shaped base body portion and an inner base body portion integrally formed with the plate-shaped base body portion. The step of forming the base body comprises forming the plate-shaped base body portion and the inner base body portion by means of die casting. The inner base body portion comprises a plurality of protrusions formed on an upper side of the inner base body portion. The protrusions have a gap size in a range of 0.5 mm to 1.5 mm.

Abstract: A cooling liquid composition for a liquid cooling system for cooling a heat generating element arranged on a printed circuit board (PCB) comprises an aqueous solution comprising a copolymer having a copolymer concentration in a range of 0.05% to 20% by mass.

Abstract: A computer includes a heat source; and a cooling system secured to the heat source and configured to remove heat from the heat source during use. The cooling system includes a cooling head secured to the heat source; and a radiator in fluid communication with the cooling head.