Abstract: Some devices, systems, and methods obtain a set of relationship values, wherein the set of relationship values indicates relationships between control values for an imprint apparatus and corresponding overlay corrections; and estimate a set of control values based on a constrained optimization that uses the set of relationship values such that the set of control values globally minimizes a residual overlay error while the set of control values is maintained within a set of operating constraints, wherein the set of control values includes a set of in-plane control values that are in a plane and a set of out-of-plane control values that are out of the plane, wherein the plane is parallel to a template-substrate interface.

Abstract: A chuck for retaining a superstrate or a template. The chuck comprises a geometric structure formed on a surface of the chuck. The geometric structure includes at least one of a rounded edge portion and a roughened surface portion, such that an intensity variation of light transmitting through the geometric structure and an area of the chuck adjacent to the geometric structure is reduced.

Abstract: An imprint method is provided. The method includes exercising an imprint head along a preconditioning trajectory before contacting the imprint head with a formable material on a substrate, followed by performing imprinting on the formable material after exercising the imprint head. The exercise of the imprint head along the preconditioning trajectory may be performed after the imprint head has been idled for a predetermined period of time. The exercise of the imprint head along the preconditioning trajectory may also be performed for a duration decided based on expected throughput requirements and tools used for the imprinting process.

Abstract: Techniques and mechanisms for cooling a substrate in a processing chamber by a bi-directional cooling process prior to transferring the substrate outside the processing chamber are provided. First cooling gas is introduced into the processing chamber from an upper gas source in a downward direction towards the upward facing surface of the substrate. An apparatus is placed underneath and in proximity to the substrate. Second cooling gas is introduced from the apparatus into the processing chamber in an upward direction towards the downward facing surface of the substrate. One or more gaps are cut out of the body portion of the apparatus, the gaps configured to allow the apparatus to avoid contact with the support structure holding the substrate, as the apparatus is moved in a horizontal direction into position underneath the substrate during placement of the body portion of the apparatus in proximity to the substrate.

Abstract: A system and method for generating a modulation map to be supplied a spatial light modulator of a nanoimprint lithography system. Receiving a pixelated intermediate map for a spatial light modulator including a plurality of pixels based on a distortion model and a target light pattern. The pixelated intermediate map may have discontinuities. Generating a modulation map for the spatial light modulator by filling in discontinuities in the pixelated intermediate map. A first predicted light intensity map produced by the modulation map may be a closer approximation of the target light pattern than a second predicted light intensity map produced by the pixelated intermediate map.

Abstract: System and method for generating a set of illumination patterns. Intensity distribution for each pixel in an array of pixels of actinic radiation at a plane of a shaping surface while it is in contact with formable material on a substrate is received. Predicted dosage pattern based on the intensity distribution for each pixel and a set of operational parameters is computed. Set of operational parameters may include sets of: modulation maps; positional shifts of an array of illuminators; duty cycles. Curing dose variation metric based on the predicted dosage pattern is determined. The curing dose variation metric is compared to a threshold. Different sets of operational parameters may be used to create an operational parameters superset. The curing set of operational parameters in the operational parameters superset is selected based on a comparison of the curing dose variation metric to a dose variation threshold.

Abstract: A method of forming a planarization layer on a substrate is disclosed. The method can include aligning a superstrate with the substrate, where aligning the superstrate with the substrate comprises tuning a diffusing element to a first operational state, dispensing a formable material over the substrate, contacting the formable material over the substrate with the superstrate, tuning the diffusing element to a second operational state, where the first operational state is different from the second operational state, and curing the formable material over the substrate to form a layer over the substrate while the superstrate is contacting the formable material, where curing the formable material can include directing a set of actinic radiation beams to enter the diffusing element at an entering state and exit the diffusing element at an exiting state, and where the entering state is different from the exiting state.

Abstract: A method for correcting a final imprint force FIF in an imprint process is provided. Position traces of an imprint head exercising along a predetermined trajectory are obtained. A force disturbance model is established based on prior position and force traces of the imprint head. A disturbance force Fmod,FIF,i is using a predetermined motion sequence based on the force disturbance model for wafer i, where i=1 to n. A residual force offset (RFO) measurement is performed to determine an actual force Fact,RFO,i applied to wafer i. A disturbance force Fmod,FIF,i,j applied to a field j of the wafer i is calculated using the force disturbance model, where j=1 to m. An adjustment is applied to the RFO measurement. An imprint force is applied to a film on the wafer i with the imprint head based on an output of the adjustment applied to Fact,RFO,i and a desired force to be applied to the film on the wafer.

Abstract: Techniques and mechanisms for cooling a substrate in a processing chamber by a bi-directional cooling process prior to transferring the substrate outside the processing chamber are provided. First cooling gas is introduced into the processing chamber from an upper gas source in a downward direction towards the upward facing surface of the substrate. An apparatus is placed underneath and in proximity to the substrate. Second cooling gas is introduced from the apparatus into the processing chamber in an upward direction towards the downward facing surface of the substrate. One or more gaps are cut out of the body portion of the apparatus, the gaps configured to allow the apparatus to avoid contact with the support structure holding the substrate, as the apparatus is moved in a horizontal direction into position underneath the substrate during placement of the body portion of the apparatus in proximity to the substrate.

Abstract: A method and system for optimizing forces applied to actuators during a nanoimprint lithography process is provided. A first set of forces within a first set of force limits is selected to be applied to edges of a template. A first residual distortion representative of a first predicted overlay error associated with a simulated imprinting method in which the first set of forces are applied to the edges of the template is estimated. A second set of forces is selected within a second set of force limits to be applied to the edges of the template. A second residual distortion is estimated that is representative of a second predicted overlay error associated with the simulated imprinting method in which the second set of forces are applied to edges of the template. An initial set of forces having a narrowest set of force limits and residual distortion that is below a residual threshold from among the first set of forces and the second set of forces is selected.

Abstract: A method for identifying a model for modeling cable stress relaxation dynamics of an imprint head is provided. The method includes performing a non-contact imprint test run for a predetermined number of wafers. Data from a force trace and a position trace of the imprint head during the non-contact imprint test run are collected to compute cable stress relaxation forces. A model having a plurality of different model orders is generated. A set of parameters of the model for each model order is identified. Residual sum of squares for wafer average error for each of the model orders is calculated based on the obtained cable stress relaxation forces. The set of parameters of one of the plurality of model orders may be based on a difference in the residual sum of squares for wafer average error between the one of the plurality of model orders and a next higher model.

Abstract: An imprint apparatus is provided. The imprint apparatus includes an imprint head, at least one cable assembly configured to supply a signal to the imprint head, and a cable assembly sensor configured to detect a state of the at least one cable assembly. The signal may include one or more of a voltage signal, a current signal, and a pneumatic signal. The cable assembly sensor may include a strain gauge configured to measure a strain of the at least one cable assembly or a load cell configured to measure a force on the at least one cable assembly. For example, the cable assembly may include an electric wire and/or a gas supply tube.

Abstract: A system and method of forming a planarization layer on a substrate is disclosed. The method can include holding a superstrate with a superstrate chuck, the superstrate chuck positioned relative to a diffusing element, where the diffusing element includes a pattern and the superstrate chuck includes one or more geometric features, and where the pattern of the diffusing element aligns with the one or more geometric features of the superstrate chuck. The method can also include dispensing a formable material over the substrate, contacting the formable material over the substrate with a superstrate, providing a set of beams that pass through the diffusing element to cure the formable material over the substrate and form a layer over the substrate while the superstrate is contacting the formable material.

Abstract: An imprint method is provided. The method includes exercising an imprint head along a preconditioning trajectory before contacting the imprint head with a formable material on a substrate, followed by performing imprinting on the formable material after exercising the imprint head. The exercise of the imprint head along the preconditioning trajectory may be performed after the imprint head has been idled for a predetermined period of time. The exercise of the imprint head along the preconditioning trajectory may also be performed for a duration decided based on expected throughput requirements and tools used for the imprinting process.

Abstract: Methods and systems for imprinting, including receiving template slippage data about a change in a position of a template relative to a reference position. Also, a desired actinic radiation pattern to expose formable material in an imprinting field under a template border region of the template may be received. In addition, a new actinic radiation pattern to expose the template border region that compensates for the template slippage may be determined. The formable material in the imprinting field on the substrate may be contacted with the template. The template border region may be exposed to the new actinic radiation pattern while the template is in contact with the formable material.

Abstract: Methods and systems that include the generation of a map of modulation values for a spatial light modulator. In which a map representative of a desired curing region is received. Receiving, for each pixel of a spatial light modulator, spatial information representative of an intensity distribution of actinic radiation at a plane of formable material under a template that is guided from the spatial light modulator to the plane of the formable material for curing the formable material under the template. Receiving a dose threshold for the formable material. Generating a map of modulation values for each pixel in the spatial light modulator based on: the dose threshold; the spatial information for all of the pixels; and the map representative of the desired curing region.

Abstract: A system and method of shaping a film with a template on a substrate. Generating a first series of parameters from tests performed on a first series of films formed with: a set of shaping conditions; a calibration measurement parameter determined for each substrate prior to shaping; and a first scaling parameter. Generating a second series of parameters from the tests performed on a second series of films produced formed with the set of shaping conditions. The second series of films produced with the calibration measurement parameter determined for each substrate; and a second scaling parameter; or without the calibration measurement parameter. Generating a scaling parameter from: the first series of the parameters; and the second series of parameters. Generating the calibration measurement parameter prior to forming the film. Forming the film using the set of shaping conditions, the calibration measurement parameter, and the scaling parameter.

Abstract: A system and method of forming a planarization layer on a substrate is disclosed. The method can include holding a superstrate with a superstrate chuck, the superstrate chuck positioned relative to a diffusing element, where the diffusing element includes a pattern and the superstrate chuck includes one or more geometric features, and where the pattern of the diffusing element aligns with the one or more geometric features of the superstrate chuck. The method can also include dispensing a formable material over the substrate, contacting the formable material over the substrate with a superstrate, providing a set of beams that pass through the diffusing element to cure the formable material over the substrate and form a layer over the substrate while the superstrate is contacting the formable material.

Abstract: A frame cure apparatus includes a position actuator and a controller. The position actuator is attached to a digital spatial modulator (DSM) having a plurality of spatial elements with a pitch, and configured to move the DSM with a step size less than the pixel pitch to provide a pattern for curing a photo-curable material in a desired curing region on a substrate. The controller moves the DSM with the step size in a predefined sequence that covers a first curing region and a second curing region such that a first curing dose accumulated at the first curing region exceeds a curing threshold while a second curing dose accumulated at the second curing region does not exceed the curing threshold. The predefined sequence provides the set of curing patterns. The first curing region matches the desired region. The second curing region does not match the desired curing region.

Abstract: A frame cure apparatus includes a position actuator and a controller. The position actuator is attached to a digital spatial modulator (DSM) having a plurality of spatial elements with a pitch, and configured to move the DSM with a step size less than the pixel pitch to provide a pattern for curing a photo-curable material in a desired curing region on a substrate. The controller moves the DSM with the step size in a predefined sequence that covers a first curing region and a second curing region such that a first curing dose accumulated at the first curing region exceeds a curing threshold while a second curing dose accumulated at the second curing region does not exceed the curing threshold. The predefined sequence provides the set of curing patterns. The first curing region matches the desired region. The second curing region does not match the desired curing region.