Patents by Inventor Nilesh Desai
Nilesh Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11758921Abstract: The invention relates to a method of producing a frozen confection product, the method comprising the steps of: providing an ingredient mix free from added sugar or comprises below 0.2% wt, the composition comprising 3-17 wt. % fat, 3-17 wt. % milk solids non-fat, and 1-10 wt. % protein comprising casein and whey, the ingredient mix having a pH of 6.1-6.4; homogenising the ingredient mix and subsequently pasteurizing the composition at a temperature of 80°-100° C. for a period of 0.5-3 min to form agglomerated protein comprising casein and whey, adding 3-25 wt. % of sugar to the ingredient mix; and freezing while optionally aerating the ingredient mix, to form a frozen confection product. The invention also relates to a product obtained with the method.Type: GrantFiled: October 11, 2018Date of Patent: September 19, 2023Assignee: Societe des Produits Nestle S.A.Inventors: Nilesh Desai, Stephen Gene Mark, Madansinh Nathusinh Vaghela, Rajiv Indravadan Dave, Nirav Chandrakant Pandya
-
Publication number: 20230174129Abstract: Systems and methods are disclosed for foldable containers with improved dumping features. In one embodiment, an example foldable container may include a first container wall, a second container wall coupled to the first container wall at a first joint, the second container wall configured to rotate outwards in a first direction with respect to the first container wall, and a third container wall coupled to the first container wall at a second joint, the third container wall oriented perpendicular to the first container wall. Example foldable containers may include a number of wheels and smooth side panels, where a first cross-sectional area of the foldable container at a lower portion of the foldable container is greater than a second cross-sectional area of the foldable container at an upper portion of the foldable container.Type: ApplicationFiled: December 8, 2021Publication date: June 8, 2023Applicant: Amazon Technologies, Inc.Inventors: Jainil Nilesh Desai, Spencer Cates, Daniel Eugene Lowther, Kevin Wolcott, Kaushal Bharatkumar Mehta, Ashwini Kotraiah Davangere, Eric Edmond Swensen, Jessica Fitzgerald, Tom Rattini, Damien Duffy
-
Patent number: 11570057Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for a contextual transformation of an analytical model for an industrial internet of things (IIoT) edge node. For instance, the method may include receiving the analytical model from a cloud service; obtaining local data of the IIoT edge node; analyzing the local data to determine a situational context of the IIoT edge node; determining whether to transform the analytical model based on a fit between the analytical model and the situational context; and in response to determining to transform the analytical model, transforming the analytical model based on the situational context to derive a transformed analytical model.Type: GrantFiled: May 28, 2021Date of Patent: January 31, 2023Assignee: Honeywell International Inc.Inventors: Ramchandra Joshi, Kirupakar Janakiraman, Narayanan Srinivasan, GaneshKumar Nagaraj, Karthick Sengodan, Nilesh Desai
-
Publication number: 20210288887Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for a contextual transformation of an analytical model for an industrial internet of things (IIoT) edge node. For instance, the method may include receiving the analytical model from a cloud service; obtaining local data of the IIoT edge node; analyzing the local data to determine a situational context of the IIoT edge node; determining whether to transform the analytical model based on a fit between the analytical model and the situational context; and in response to determining to transform the analytical model, transforming the analytical model based on the situational context to derive a transformed analytical model.Type: ApplicationFiled: May 28, 2021Publication date: September 16, 2021Inventors: Ramchandra JOSHI, Kirupakar JANAKIRAMAN, Narayanan SRINIVASAN, GaneshKumar NAGARAJ, Karthick SENGODAN, Nilesh DESAI
-
Publication number: 20210195916Abstract: The invention relates to a method of producing a frozen confection product, the method comprising the steps of: providing an ingredient mix free from added sugar or comprises below 0.2% wt, the composition comprising 3-17 wt. % fat, 3-17 wt. % milk solids non-fat, and 1-10 wt. % protein comprising casein and whey, the ingredient mix having a pH of 6.1-6.4; homogenising the ingredient mix and subsequently pasteurizing the composition at a temperature of 80°-100° C. for a period of 0.5-3 min to form agglomerated protein comprising casein and whey, adding 3-25 wt. % of sugar to the ingredient mix; and freezing while optionally aerating the ingredient mix, to form a frozen confection product. The invention also relates to a product obtained with the method.Type: ApplicationFiled: October 11, 2018Publication date: July 1, 2021Inventors: Nilesh Desai, Stephen Gene Mark, Madansinh Nathusinh Vaghela, Rajiv Indravadan Dave, Nirav Chandrakant Pandya
-
Patent number: 11050634Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for a contextual transformation of an analytical model for an industrial internet of things (IIoT) edge node. For instance, the method may include receiving the analytical model from a cloud service; obtaining local data of the IIoT edge node; analyzing the local data to determine a situational context of the IIoT edge node; determining whether to transform the analytical model based on a fit between the analytical model and the situational context; and in response to determining to transform the analytical model, transforming the analytical model based on the situational context to derive a transformed analytical model.Type: GrantFiled: September 11, 2018Date of Patent: June 29, 2021Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Ramchandra Joshi, Kirupakar Janakiraman, Narayanan Srinivasan, GaneshKumar Nagaraj, Karthick Sengodan, Nilesh Desai
-
Publication number: 20200084113Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for a contextual transformation of an analytical model for an industrial internet of things (IIoT) edge node. For instance, the method may include receiving the analytical model from a cloud service; obtaining local data of the IIoT edge node; analyzing the local data to determine a situational context of the IIoT edge node; determining whether to transform the analytical model based on a fit between the analytical model and the situational context; and in response to determining to transform the analytical model, transforming the analytical model based on the situational context to derive a transformed analytical model.Type: ApplicationFiled: September 11, 2018Publication date: March 12, 2020Inventors: Ramchandra JOSHI, Kirupakar JANAKIRAMAN, Narayanan SRINIVASAN, GaneshKumar NAGARAJ, Karthick SENGODAN, Nilesh DESAI
-
Publication number: 20180317519Abstract: The present invention relates to a non-dairy frozen confection comprising 30 to 60 wt. % of coconut cream based on the total weight of the frozen confection, 20 to 30 wt. % of the coconut cream being fat and the coconut cream having a total solid content of 25 to 40%, 15 to 40 wt. % non-fat solids and water, and being free from stabilizers or comprises as the only stabilizer fruit or vegetable based stabilizer or a combination thereof. The invention also relates to a process of making a non-dairy frozen confection.Type: ApplicationFiled: November 14, 2016Publication date: November 8, 2018Inventors: Nilesh Desai, Stephen Mark, Justine Mattiussi
-
Publication number: 20150140193Abstract: The present invention relates to a shelf-stable composition for the preparation of a frozen confection comprising: (i) a sweetening agent; (ii) a dairy fat; and (iii) one or more polysaccharide having a Dextrose Equivalent (DE) value of maximum 40; with the proviso that the composition does not comprise added emulsifiers or stabilizers. The present invention also relates to a method of preparing a frozen confection by mixing said composition with ice and an edible liquid and blend the mixture.Type: ApplicationFiled: December 17, 2012Publication date: May 21, 2015Applicant: NESTEC S.A.Inventors: Nilesh Desai, Mandeep Rajendra Patel, Josephine Enriquez Lometillo
-
Publication number: 20070086189Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.Type: ApplicationFiled: October 4, 2006Publication date: April 19, 2007Applicant: ONSCREEN TECHNOLOGIES, INC.Inventors: Robert Raos, Nilesh Desai, Steven Flank
-
Publication number: 20070086187Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.Type: ApplicationFiled: October 4, 2006Publication date: April 19, 2007Applicant: ONSCREEN TECHNOLOGIES, INC.Inventors: Robert Raos, Nilesh Desai, Steven Flank
-
Publication number: 20070086188Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.Type: ApplicationFiled: October 4, 2006Publication date: April 19, 2007Applicant: ONSCREEN TECHNOLOGIES, INC.Inventors: Robert Raos, Nilesh Desai, Steven Flank
-
Publication number: 20070081341Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.Type: ApplicationFiled: October 4, 2006Publication date: April 12, 2007Applicant: ONSCREEN TECHNOLOGIES, INC.Inventors: Robert Raos, Nilesh Desai, Steven Flank
-
Publication number: 20050258446Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.Type: ApplicationFiled: May 18, 2004Publication date: November 24, 2005Applicant: New Millennium Media International Inc.Inventors: Robert Raos, Nilesh Desai, Steven Flank