Patents by Inventor Nils-Peter Harder
Nils-Peter Harder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220367738Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: June 9, 2022Publication date: November 17, 2022Inventors: Richard Hamilton Sewell, Robert Woehl, Jens Dirk Moschner, Nils-Peter Harder
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Publication number: 20220352397Abstract: Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: July 13, 2022Publication date: November 3, 2022Inventors: Richard Hamilton Sewell, Gabriel Harley, Nils-Peter Harder
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Patent number: 11444214Abstract: Methods of manufacturing a semiconductor device, and resulting semiconductor device are described. In an example, the method for manufacturing a semiconductor device include forming a semiconductor region and forming a metal seed region over the semiconductor region. The method can include placing a conductive strip over a first portion of the metal region, where the conductive strip is formed over the semiconductor region. The method can include bonding a contacting portion of the conductive strip to the first portion the metal region. The method can include etching a second portion of the metal region and where the conductive strip inhibits etching of the first portion of the metal region. In an example, the conductive strip can have a coating. In one example, the semiconductor device can be a solar cell.Type: GrantFiled: November 16, 2020Date of Patent: September 13, 2022Assignee: Total Marketing ServicesInventor: Nils-Peter Harder
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Patent number: 11424373Abstract: Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.Type: GrantFiled: April 1, 2016Date of Patent: August 23, 2022Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Gabriel Harley, Nils-Peter Harder
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Publication number: 20220158018Abstract: Methods of fabricating emitter regions of solar cells using surface treatments, and the resulting solar cells, are described herein. In an example, a method of fabricating a solar cell includes treating a surface of a silicon substrate to form a lyophilic area between two lyophobic areas and depositing a liquid phase material containing a silicon material in the lyophilic area to form an emitter region.Type: ApplicationFiled: January 31, 2022Publication date: May 19, 2022Inventor: Nils-Peter Harder
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Patent number: 11271129Abstract: Methods of fabricating emitter regions of solar cells using surface treatments, and the resulting solar cells, are described herein. In an example, a method of fabricating a solar cell includes treating a surface of a silicon substrate to form a lyophilic area between two lyophobic areas and depositing a liquid phase material containing a silicon material in the lyophilic area to form an emitter region.Type: GrantFiled: October 17, 2017Date of Patent: March 8, 2022Assignee: Total Marketing ServicesInventor: Nils-Peter Harder
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Patent number: 11004987Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: GrantFiled: March 13, 2020Date of Patent: May 11, 2021Assignees: SunPower Corporation, Total Marketing Services and Total Energies Nouvelles Activites USAInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
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Publication number: 20210074868Abstract: Methods of manufacturing a semiconductor device, and resulting semiconductor device are described. In an example, the method for manufacturing a semiconductor device include forming a semiconductor region and forming a metal seed region over the semiconductor region. The method can include placing a conductive strip over a first portion of the metal region, where the conductive strip is formed over the semiconductor region. The method can include bonding a contacting portion of the conductive strip to the first portion the metal region. The method can include etching a second portion of the metal region and where the conductive strip inhibits etching of the first portion of the metal region. In an example, the conductive strip can have a coating. In one example, the semiconductor device can be a solar cell.Type: ApplicationFiled: November 16, 2020Publication date: March 11, 2021Inventor: Nils-Peter Harder
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Patent number: 10840394Abstract: Methods of manufacturing a semiconductor device, and resulting semiconductor device are described. In an example, the method for manufacturing a semiconductor device include forming a semiconductor region and forming a metal seed region over the semiconductor region. The method can include placing a conductive strip over a first portion of the metal region, where the conductive strip is formed over the semiconductor region. The method can include bonding a contacting portion of the conductive strip to the first portion the metal region. The method can include etching a second portion of the metal region and where the conductive strip inhibits etching of the first portion of the metal region. In an example, the conductive strip can have a coating. In one example, the semiconductor device can be a solar cell.Type: GrantFiled: September 25, 2015Date of Patent: November 17, 2020Assignee: Total Marketing ServicesInventor: Nils-Peter Harder
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Publication number: 20200220031Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: ApplicationFiled: March 13, 2020Publication date: July 9, 2020Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
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Patent number: 10672924Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: GrantFiled: January 2, 2019Date of Patent: June 2, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Patent number: 10644170Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: GrantFiled: August 21, 2018Date of Patent: May 5, 2020Assignees: SunPower Corporation, Total Marketing Services and Total Energies Nouvelles Activites USAInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
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Publication number: 20190288148Abstract: Methods of fabricating emitter regions of solar cells using surface treatments, and the resulting solar cells, are described herein. In an example, a method of fabricating a solar cell includes treating a surface of a silicon substrate to form a lyophilic area between two lyophobic areas and depositing a liquid phase material containing a silicon material in the lyophilic area to form an emitter region.Type: ApplicationFiled: October 17, 2017Publication date: September 19, 2019Inventor: Nils-Peter HARDER
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Patent number: 10396235Abstract: Indentation approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of alternating N-type and P-type semiconductor regions in or above a substrate. The method also includes locating a metal foil above the alternating N-type and P-type semiconductor regions. The method also includes forming a plurality of indentations through only a portion of the metal foil, the plurality of indentations formed at regions corresponding to locations between the alternating N-type and P-type semiconductor regions. The method also includes, subsequent to forming the plurality of indentations, isolating regions of the remaining metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: October 16, 2015Date of Patent: August 27, 2019Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Nils-Peter Harder
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Publication number: 20190140116Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: ApplicationFiled: January 2, 2019Publication date: May 9, 2019Inventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Patent number: 10177260Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: GrantFiled: March 8, 2017Date of Patent: January 8, 2019Assignees: SunPower Corporation, Total Marketing ServicesInventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Publication number: 20180358481Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: ApplicationFiled: August 21, 2018Publication date: December 13, 2018Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
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Publication number: 20180286994Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: April 2, 2018Publication date: October 4, 2018Inventors: RICHARD HAMILTON SEWELL, ROBERT WOEHL, JENS DIRK MOSCHNER, NILS-PETER HARDER
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Patent number: 10084098Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: GrantFiled: September 30, 2016Date of Patent: September 25, 2018Assignees: SunPower Corporation, Total Marketing Services and Total Energies Nouvelles Activities USAInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
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Patent number: 10032942Abstract: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.Type: GrantFiled: April 20, 2017Date of Patent: July 24, 2018Assignees: SunPower Corporation, Total Marketing ServicesInventors: Taeseok Kim, Robert Woehl, Gabriel Harley, Nils-Peter Harder, Jens-Dirk Moschner, Matthieu Moors, Michel Arsene Olivier Ngamo Toko