Patents by Inventor Nim Tea
Nim Tea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9926192Abstract: A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.Type: GrantFiled: August 14, 2015Date of Patent: March 27, 2018Assignee: INVENSENSE, INC.Inventors: Cerina Zhang, Nim Tea
-
Publication number: 20150353353Abstract: A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.Type: ApplicationFiled: August 14, 2015Publication date: December 10, 2015Inventors: Cerina Zhang, Nim Tea
-
Patent number: 9136165Abstract: A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.Type: GrantFiled: June 4, 2013Date of Patent: September 15, 2015Assignee: INVENSENSE, INC.Inventors: Cerina Zhang, Nim Tea
-
Publication number: 20140353774Abstract: A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.Type: ApplicationFiled: June 4, 2013Publication date: December 4, 2014Inventors: Cerina Zhang, Nim Tea
-
Publication number: 20130206990Abstract: The thermoelectric detector comprises an infrared absorber pixel structure supported by two electrically connected beams made of a thermoelectric material. One end of the thermoelectric beam connects to the infrared absorber pixel structure; the other end connects to the substrate. The detector comprises a microlens for collecting and focusing infrared radiation on the detector. Infrared radiation is incident on the infrared absorber pixel structure results in a temperature gradient along the length of the thermoelectric legs, and generating an electrical voltage proportional to the gradient. A low noise SIGe BiCMOS readout integrated circuit is coupled to the detector to provide a background limited detector having improved detectivity.Type: ApplicationFiled: August 20, 2012Publication date: August 15, 2013Applicant: ISC8 Inc.Inventors: Ying Hsu, Medhat Azzazy, Nim Tea
-
Publication number: 20110303404Abstract: A conformal, multilayer micro-channel structure having a wear-resistant interior micro-channel surface coating of an ALD deposited conformal alumina (Al2O3) ceramic of about 1000 ? in thickness and a titanium nitride (TiN) of about 300 ? to about 1000 ? in thickness. The Al2O3/TiN multilayer structure is resistant to erosion and to electro-chemical corrosion as is found in prior art micro-channel coolers and structures.Type: ApplicationFiled: June 8, 2011Publication date: December 15, 2011Applicant: Irvine Sensors CorporationInventor: Nim Tea
-
Patent number: 7922888Abstract: The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.Type: GrantFiled: April 27, 2007Date of Patent: April 12, 2011Assignee: Touchdown Technologies, Inc.Inventors: Salleh Ismail, Nim Tea, Yang Hsu, Weilong Tang, Raffi Garabedian, Melvin Khoo
-
Patent number: 7772859Abstract: A novel probe design is presented that increases a probe tolerance to stress fractures. The probe includes a base, a torsion element connected to the base, and a second element connected to the torsion element through a union angle. The union angle includes an interface between the torsion element and the second element, and the edge of the interface is shaped to diffuse stress. What is further-disclosed are three features that increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.Type: GrantFiled: March 4, 2008Date of Patent: August 10, 2010Assignee: Touchdown Technologies, Inc.Inventors: Melvin Khoo, Nim Tea, Ting Hu, Zhiyong An
-
Patent number: 7724010Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.Type: GrantFiled: November 9, 2007Date of Patent: May 25, 2010Assignee: Touchdown Technologies, Inc.Inventors: Melvin Khoo, Nim Tea, Salleh Ismail, Yang Hsu, Weilong Tang, Raffi Garabedian
-
Patent number: 7589542Abstract: A hybrid probe design is presented that includes a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The probe includes a base, a torsion element, a bending element, and a tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Adjusting the position of a pivot can alter the probe's energy absorption characteristics. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.Type: GrantFiled: April 12, 2007Date of Patent: September 15, 2009Assignee: Touchdown Technologies Inc.Inventors: Melvin Khoo, Nim Tea, Zhiyong An, Ting Hu
-
Patent number: 7538567Abstract: A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.Type: GrantFiled: July 12, 2006Date of Patent: May 26, 2009Assignee: Touchdown Technologies, Inc.Inventors: Shaoning Lu, Melvin Khoo, Nim Tea
-
Publication number: 20080252310Abstract: A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.Type: ApplicationFiled: April 12, 2007Publication date: October 16, 2008Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Nim Tea, Zhiyong An, Melvin Khoo
-
Publication number: 20080252328Abstract: A novel probe design is presented that increases a probe tolerance to stress fractures. Specifically, what is disclosed are three features increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.Type: ApplicationFiled: March 4, 2008Publication date: October 16, 2008Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Zhiyong An, Melvin Khoo, Nim Tea, Ting Hu
-
Patent number: 7437071Abstract: A localized and distributive optical switching control system is separated into three localized systems: a sensor system, a processor system, and a position driver system. The sensor system detects the light transmission efficiency from the input port to the output port, and sends an error signal to the processor system; the processor system processes the error signal and, based upon predefined compensators and control algorithms, generates a control output signal to rectify the error to the sending and/or receiving position driver(s); the position driver(s) receives the control output signal then repositions the sending and/or receiving mirror(s) to the desired position for optimum signal transmission. The amount of communication data and the amount of routing paths between components are reduced, thus decreasing system reaction time and heat generated, allowing controls to be installed on smaller circuits, such as ASIC, and the arrays to be placed closer together.Type: GrantFiled: March 19, 2002Date of Patent: October 14, 2008Assignee: Cisco Technology, Inc.Inventors: Sudharshan Bhat, Kirk Evans, Raffi Garabedian, Keith O'Hara, Nim Tea
-
Patent number: 7378734Abstract: A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.Type: GrantFiled: May 30, 2006Date of Patent: May 27, 2008Assignee: Touchdown Technologies, Inc.Inventors: Richard Yabuki, Nim Tea
-
Publication number: 20080106289Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.Type: ApplicationFiled: November 9, 2007Publication date: May 8, 2008Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Melvin Khoo, Nim Tea, Salleh Ismail, Yang Hsu, Weilong Tang, Raffi Garabedian
-
Patent number: 7362119Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.Type: GrantFiled: August 1, 2005Date of Patent: April 22, 2008Assignee: Touchdown Technologies, IncInventors: Melvin Khoo, Nim Tea, Salleh Ismail, Yang Hsu, Weilong Tang, Raffi Garabedian
-
Publication number: 20080012594Abstract: A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.Type: ApplicationFiled: July 12, 2006Publication date: January 17, 2008Inventors: Shaoning Lu, Melvin Khoo, Nim Tea
-
Publication number: 20080007281Abstract: A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.Type: ApplicationFiled: September 14, 2007Publication date: January 10, 2008Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Raffi Garabedian, Nim Tea, Steven Wang, Heather Karklin
-
Publication number: 20070279077Abstract: A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.Type: ApplicationFiled: May 30, 2006Publication date: December 6, 2007Inventors: Richard Yabuki, Nim Tea