Abstract: Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.

Abstract: A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

Abstract: A method of performing electrochemical deposition is provided to minimize overburden. A constant plating voltage (and a variable plating current) is applied across a semiconductor structure (e.g., patterned dielectric layer) and a metal electrode, which are both submerged in an electrolyte that contains both suppressor and accelerator molecules. The constant plating voltage is selected such that the suppressor molecules are predominantly active on the flat upper surface of the patterned dielectric layer, and the accelerator molecules are predominantly active within the patterned features of the patterned dielectric layer. As a result, metal is deposited at a relatively high rate within the patterned features, and at a relatively low rate on the flat upper surface areas of the patterned dielectric layer. Consequently, the patterned features are filled with metal before significant overburden can be formed over the flat upper surface areas of the patterned dielectric layer.

Abstract: The present invention is for substrates for use in interposes for electronic packaging purposes. One preferred embodiment of the present invention is a substrate for use in a Spring Connector Matrix (SCM) interposer having an array of electrically insulated spring connectors each having a fixed end portion and a floating end portion resiliently flexibly coupled to its associated fixed end portion and capable of being independently displaceable in a plane substantially perpendicular to the SCM interposer's major surfaces. Another preferred embodiment of the present invention is a substrate intended to be folded along one or more predetermined fold lines or forming a 3D interposer. Folding is intended at wings which may be wholly formed of valve metal material or may include one or more electrically insulated valve metal traces electrically connected to one or more interconnect regions intended for ICs either single or double sided mounted thereon.

Abstract: The present invention is for substrates for use in interposers for electronic packaging purposes. One preferred embodiment of the present invention is a substrate for use in a Spring Connector Matrix (SCM) interposer having an array of electrically insulated spring connectors each having a fixed end portion and a floating end portion resiliently flexibly coupled to its associated fixed end portion and capable of being independently displaceable in a plane substantially perpendicular to the SCM interposer's major surfaces. Another preferred embodiment of the present invention is a substrate intended to be folded along one or more predetermined fold lines for forming a 3D interposer. Folding is intended at wings which may be wholly formed of valve metal material or may include one or more electrically insulated valve metal traces electrically connected to one or more interconnect regions intended for ICs either single or double sided mounted thereon.

Abstract: An improved method for depositing ferroelectric particles on a surface of a substrate to form films or stand-alone bodies. The improvement is based on electrophoretic deposition (EPD) of ferroelectric films by using a tri-functional phosphate ester additive having a concentration less than 10 volume percent in the EPD suspension, without the need for addition of a binder. The method includes preparation of the suspension by washing and dispersing ferroelectric particles, for example, commercially available PZT powder, in a polar solvent such as ethanol, followed by addition of the phosphate ester additive to the suspension, and an ultrasound treatment. The suspension is used in EPD of the ferroelectric particles on a prepared substrate. Following EPD, the green film is dried and sintered at high temperature.

Abstract: A method of depositing diamond particles on a surface of a substrate is provided. The method is effected by (a) charging the diamond particles by a positive charge to obtain positively charged diamond particles; and (b) electrophoretically depositing the positively charged diamond particles on the surface of the substrate, for obtaining a green diamond particles coat on the surface of the substrate.

Abstract: An improved method for depositing ferroelectric particles on a surface of a substrate to form films or stand-alone bodies. The improvement is based on electrophoretic deposition (EPD) of ferroelectric films by using a tri-functional phosphate ester additive having a concentration less than 10 volume percent in the EPD suspension, without the need for addition of a binder. The method includes preparation of the suspension by washing and dispersing ferroelectric particles, for example, commercially available PZT powder, in a polar solvent such as ethanol, followed by addition of the phosphate ester additive to the suspension, and an ultrasound treatment. The suspension is used in EPD of the ferroelectric particles on a prepared substrate. Following EPD, the green film is dried and sintered at high temperature.

Abstract: An improved method for depositing ferroelectric particles on a surface of a substrate to form films or stand-alone bodies. The improvement is based on electrophoretic deposition (EPD) of ferroelectric films by using a tri-functional phosphate ester additive having a concentration less than 10 volume percent in the EPD suspension, without the need for addition of a binder. The method includes preparation of the suspension by washing and dispersing ferroelectric particles, for example, commercially available PZT powder, in a polar solvent such as ethanol, followed by addition of the phosphate ester additive to the suspension, and an ultrasound treatment. The suspension is used in EPD of the ferroelectric particles on a prepared substrate. Following EPD, the green film is dried and sintered at high temperature.

Abstract: A method for electrophoretic deposition of ceramic particles as a green body shaped as a dental appliance, the method comprising the steps of (a) forming a suspension of the ceramic particles in a first polar solvent, the ceramic particles constituting at least about 5% of the first suspension by weight; (b) passing a direct electrical current through the first suspension, using a deposition electrode shaped as the dental appliance to form a green body; (c) coating the green body with glass particles; and (d) sintering the resultant coated body for obtaining a glass coated all-ceramic dental appliance.

Abstract: A method of electrophoretic deposition of a ceramic green body. A ceramic powder is optionally washed with a polar solvent such as deionized water, dried, and suspended in a polar organic solvent in a proportion of at least 20% by weight. A positive surface charge is imposed on the suspended particles by conventional means such as ball milling or ultrasonic treatment. A green body is deposited on a cathode by passing a direct electric current of constant current density through the suspension. The density of the green body generally is at least 70% of theoretical. The density of the fired body generally is at least 98% of theoretical. A layered green body may be deposited by using several suspensions of differing global ceramic composition and depositing each microlayer in a different suspension.