Abstract: A wide I/O semiconductor device is disclosed including a memory die stack wire bonded to an interface chip. The stack of memory die may be wire bonded to the interface chip using a wire bond scheme optimized for die-to-die connection and optimized for the large number of wire bond connections in a wide I/O semiconductor device. This method can achieve significant BW increase by improving packaging yield and costs, not possible with current packaging schemes.

Abstract: Crystalline NH4Be2BO3F2 or Be2BO3F (abbreviated as BBF) has nonlinear optical effect, is not deliquescent in the air, is chemically stable. They can be used in a variety of nonlinear optical fields and will pioneer the nonlinear optical applications in the deep UV band.

Abstract: Methods and systems for transparent user interface integration between remote (“published”) applications and their local counterparts are described, providing a seamless, unified user experience, and allowing integration of a start menu, dock, taskbar, desktop shortcuts, windows, window and application switching, system tray elements, client-to-host and host-to-client file type association, URL redirection, browser cookie redirection, token redirection, status message interception and redirection, and other elements. These methods and systems further enhance theme-integration between a client and remote desktop or virtual machine by remoting all UI elements to a recipient for generation, including text controls, buttons, progress bars, radio buttons, list boxes, or other elements; presenting them with the receiver's product and OS-specific UI; and returning status back to the sender. This may achieve a more unified and transparent UI integration.

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a substrate having a solder mask. A plurality of pillar bases are formed on the solder mask, and a plurality of solder pillars are applied to the pillar bases. The plurality of solder pillars support one or more semiconductor die above the substrate and the number of solder pillars prevent stresses in the one or more semiconductor die which could otherwise damage the semiconductor die.

Abstract: Implementations relate to automatic response suggestions to images included in received messages. In some implementations, a computer-implemented method includes detecting an image posted within a first message by a first user, and programmatically analyzing the image to determine a feature vector representative of the image. The method programmatically generates one or more suggested responses to the first message based on the feature vector, each suggested response being a conversational reply to the first message. Generating the suggested responses includes determining probabilities associated with word sequences for the feature vector using a model trained with previous responses to previous images, and selecting one or more of the word sequences based on the associated probabilities. The suggested responses are determined based on the selected word sequences. The method causes the suggested responses to be rendered in the messaging application as one or more suggestions to a second user.

Abstract: A magnetic recording medium for heat assisted magnetic recording (HAMR) including in ascending vertical sequence: (i) a substrate; (ii) a first amorphous layer, a first seed layer, or a combination thereof; (iii) a heat sink layer comprising hexagonal boron-nitride grains; (iv) an optional second amorphous layer; (v) an optional second seed layer; (vi) a magnetic recording layer; (vii) an optional capping layer; and (viii) an optional overcoat layer; wherein: the magnetic recording medium has a substrate plane and a basal plane perpendicular to the substrate plane; the heat sink layer is anisotropic and has an a-axis thermal conductivity in the basal plane and a c-axis thermal conductivity in the substrate plane, wherein the a-axis thermal conductivity is greater than the c-axis thermal conductivity; and the hexagonal boron-nitride grains have an average size of at least about 10 nm in the substrate plane. Also, provided is a method of manufacturing the magnetic recording medium for HAMR.

Abstract: Implementations relate to automatic response suggestions to images included in received messages. In some implementations, a computer-implemented method includes detecting an image posted within a first message by a first user, and programmatically analyzing the image to determine a feature vector representative of the image. The method programmatically generates one or more suggested responses to the first message based on the feature vector, each suggested response being a conversational reply to the first message. Generating the suggested responses includes determining probabilities associated with word sequences for the feature vector using a model trained with previous responses to previous images, and selecting one or more of the word sequences based on the associated probabilities. The suggested responses are determined based on the selected word sequences. The method causes the suggested responses to be rendered in the messaging application as one or more suggestions to a second user.

Abstract: A wide I/O semiconductor device is disclosed including a memory die stack wire bonded to an interface chip. The stack of memory die may be wire bonded to the interface chip using a wire bond scheme optimized for die-to-die connection and optimized for the large number of wire bond connections in a wide I/O semiconductor device. This method can achieve significant BW increase by improving packaging yield and costs, not possible with current packaging schemes.

Abstract: A wide I/O semiconductor device is disclosed including a memory die stack wire bonded to an interface chip. The stack of memory die may be wire bonded to the interface chip using a wire bond scheme optimized for die-to-die connection and optimized for the large number of wire bond connections in a wide I/O semiconductor device. This method can achieve significant BW increase by improving packaging yield and costs, not possible with current packaging schemes.

Abstract: A semiconductor device vertically mounted on a medium such as a printed circuit board, and a method of its manufacture, are disclosed. The semiconductor device includes a stack of semiconductor die having contact pads which extend to an active edge of the die aligned on one side of the stack. The active edges of the die are affixed to the PCB and the contact pads at the active edge are electrically coupled to the PCB. This configuration provides an optimal, high density arrangement of semiconductor die in the device, where a large number of semiconductor die can be mounted and electrically coupled directly to the PCT, without a substrate, without staggering the semiconductor die, and without using wire bonds.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for preventing overheating, for annealing non-volatile memory. An apparatus may include an array of non-volatile storage elements. A heating element may be configured to heat a first set of the non-volatile storage elements to anneal the first set of non-volatile storage elements. A heat shield or cooling element may be configured to prevent a second set of the non-volatile storage elements from overheating during annealing of the first set of non-volatile storage elements, to mitigate data errors for data stored on the second set of non-volatile storage elements.

Abstract: Methods and systems for transparent user interface integration between remote applications and their local counterparts are described, providing a seamless, unified user experience, and allowing integration of a start menu, dock, taskbar, desktop shortcuts, windows, window and application switching, system tray elements, client-to-host and host-to-client file type association, URL redirection, browser cookie redirection, token redirection, status message interception and redirection, and other elements. These methods and systems further enhance theme-integration between a client and remote desktop or virtual machine by remoting all UI elements to a recipient for generation, including text controls, buttons, progress bars, radio buttons, list boxes, or other elements; presenting them with the receiver's product and OS-specific UI; and returning status back to the sender. This may achieve a more unified and transparent UI integration.

Abstract: Provided are a method and an apparatus for micro-hydrocyclone purification for a flue gas carbon dioxide capture system. The method comprises: performing gas-liquid micro-hydrocylone separation with ultralow pressure drop on scrubbed flue gas, to remove aerosol particulates entrained in the flue gas; performing gas-liquid micro hydrocyclone separation with ultralow pressure drop on off-gas vented from the top of an absorption column, to remove entrained aerosol particulates; performing gas-liquid micro hydrocyclone separation with ultralow pressure drop on cooled regeneration gas, to remove entrained aerosol particulates; and performing liquid-solid and liquid-liquid two-stage micro-hydrocyclone separation on a mixed amine solution lean for carbon dioxide discharged from regeneration column, to remove entrained solid particulates and machine oil.

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a substrate having a solder mask. A plurality of pillar bases are formed on the solder mask, and a plurality of solder pillars are applied to the pillar bases. The plurality of solder pillars support one or more semiconductor die above the substrate and the number of solder pillars prevent stresses in the one or more semiconductor die which could otherwise damage the semiconductor die.

Abstract: Methods and systems for transparent user interface integration between remote (“published”) applications and their local counterparts are described, providing a seamless, unified user experience, and allowing integration of a start menu, dock, taskbar, desktop shortcuts, windows, window and application switching, system tray elements, client-to-host and host-to-client file type association, URL redirection, browser cookie redirection, token redirection, status message interception and redirection, and other elements. These methods and systems further enhance theme-integration between a client and remote desktop or virtual machine by remoting all UI elements to a recipient for generation, including text controls, buttons, progress bars, radio buttons, list boxes, or other elements; presenting them with the receiver's product and OS-specific UI; and returning status back to the sender. This may achieve a more unified and transparent UI integration.

Abstract: Described are nonlinear optical (NLO) crystals, including aluminum-borate NLO crystals, that have low concentrations of contaminants that adversely affect the NLO crystal's optical properties, such as compounds that contain transition-metal elements and/or lanthanides, other than yttrium, lanthanum, and lutetium. Some NLO crystals with low concentrations of these contaminants are capable of second harmonic generation at very short wavelengths. Also described are embodiments of a method for making these NLO crystals. Some embodiments involve growing a single NLO crystal, such as an aluminum-borate NLO crystal, from a mixture containing a solvent that is substantially free of harmful contaminants. The described NLO crystals can be used, for example, in laser devices.

Abstract: Methods and systems for transparent user interface integration between remote (“published”) applications and their local counterparts are described, providing a seamless, unified user experience, and allowing integration of a start menu, dock, taskbar, desktop shortcuts, windows, window and application switching, system tray elements, client-to-host and host-to-client file type association, URL redirection, browser cookie redirection, token redirection, status message interception and redirection, and other elements. These methods and systems further enhance theme-integration between a client and remote desktop or virtual machine by remoting all UI elements to a recipient for generation, including text controls, buttons, progress bars, radio buttons, list boxes, or other elements; presenting them with the receiver's product and OS-specific UI; and returning status back to the sender. This may achieve a more unified and transparent UI integration.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: Methods and systems for transparent user interface integration between remote applications and their local counterparts are described, providing a seamless, unified user experience, and allowing integration of a start menu, dock, taskbar, desktop shortcuts, windows, window and application switching, system tray elements, client-to-host and host-to-client file type association, URL redirection, browser cookie redirection, token redirection, status message interception and redirection, and other elements. These methods and systems further enhance theme-integration between a client and remote desktop or virtual machine by remoting all UI elements to a recipient for generation, including text controls, buttons, progress bars, radio buttons, list boxes, or other elements; presenting them with the receiver's product and OS-specific UI; and returning status back to the sender. This may achieve a more unified and transparent UI integration.