Patents by Inventor Ning-Yi Neil Wang

Ning-Yi Neil Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9110020
    Abstract: A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: August 18, 2015
    Assignee: KLA-Tencor Corporation
    Inventors: Hidong Kwak, Ward Dixon, Torsten R. Kaack, Ning-Yi Neil Wang, Jagjit Sandhu
  • Publication number: 20150029494
    Abstract: A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.
    Type: Application
    Filed: August 1, 2014
    Publication date: January 29, 2015
    Inventors: Hidong Kwak, Ward Dixon, Torsten R. Kaack, Ning-Yi Neil Wang, Jagjit Sandhu
  • Patent number: 8830486
    Abstract: A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: September 9, 2014
    Assignee: KLA-Tencor Corporation
    Inventors: Hidong Kwak, Ward Dixon, Torsten Kaack, Ning-Yi Neil Wang, Jagjit Sandhu
  • Publication number: 20130010311
    Abstract: A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 10, 2013
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Hidong Kwak, Ward Dixon, Torsten Kaack, Ning-Yi Neil Wang, Jagjit Sandhu