Patents by Inventor Niranjan PINGLE

Niranjan PINGLE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular mainframe layout for supporting multiple semiconductor process modules or chambers
    Patent number: 11935771
    Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: March 19, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Randy A. Harris, Coby Scott Grove, Paul Zachary Wirth, Avinash Shantaram, Alpay Yilmaz, Amir Nissan, Jitendra Ratilal Bhimjiyani, Niranjan Pingle, Vincent Dicaprio
  • MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS
    Publication number: 20220262653
    Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.
    Type: Application
    Filed: October 28, 2021
    Publication date: August 18, 2022
    Inventors: Randy A. HARRIS, Coby Scott GROVE, Paul Zachary WIRTH, Avinash SHANTARAM, Alpay YILMAZ, Amir NISSAN, Jitendra Ratilal BHIMJIYANI, Niranjan PINGLE, Vincent Dicaprio