Patents by Inventor Nis Hauke Hansen

Nis Hauke Hansen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11600603
    Abstract: A semiconductor component includes at least two functional units which are identical to one another and are wired to one another, the identical functional units each include at least one gate finger, at least one source finger and at least one drain finger; the wiring comprising conductor tracks. A first track connects the gate fingers respectively, a second track connects the source fingers respectively, and a third track connects the drain fingers of the at least two same functional units, respectively.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: March 7, 2023
    Assignee: X-FAB GLOBAL SERVICES GMBH
    Inventors: Ralf Lerner, Nis Hauke Hansen
  • Publication number: 20220037269
    Abstract: The present invention suggests a semiconductor device for integration into a power module. The semiconductor device comprises (a) a semiconductor layer (10), a first side of the semiconductor layer (10) having a plurality of depressions (11); (b) an insulating layer (12; 12a, 12b), the insulating layer being deposited on the first side of the semiconductor layer (10) and engaging in the depressions (11); (c) a first electrically conductive layer (14; 14a, 14b) for contacting the semiconductor device (1, 2), the first electrically conductive layer (14; 14a, 14b) being deposited on the insulating layer (12a, 12b); and (d) a second electrically conductive layer (16) for contacting the semiconductor device (1, 2), the second electrically conductive layer (16) being deposited on a second side of the semiconductor layer (10) opposite to the first side.
    Type: Application
    Filed: July 9, 2021
    Publication date: February 3, 2022
    Inventors: Ralf LERNER, Nis Hauke HANSEN
  • Publication number: 20210175215
    Abstract: A semiconductor component is to be manufactured in a more time- and cost-efficient manner. The flexibility of the manufacturing process for the production of the semiconductor device is to be increased. This can be achieved with a semiconductor component (50), including a at least two functional units (2) which are identical to one another and are wired to one another, the identical functional units (2) each comprising at least one gate finger (16), at least one source finger (17) and at least one drain finger (18); the wiring comprising conductor tracks. A first track (26) connects the gate fingers (16) respectively, a second track (27) connects the source fingers (17) respectively, and a third track (28) connects the drain fingers (18) of the at least two same functional units (2) respectively.
    Type: Application
    Filed: December 7, 2020
    Publication date: June 10, 2021
    Applicant: X-FAB Global Services GmbH
    Inventors: Ralf Lerner, Nis Hauke Hansen